The invention discloses a high-thermal conductivity weather-resistant packaging material for microprocessors. The high-thermal conductivity weather-resistant packaging material for microprocessors comprises, by weight, 50-60 parts of unsaturated polyester resin, 12-18 parts of an ethylene-methacrylic acid copolymer, 5-7 parts of nano-oxide, 4-8 parts of ethylene glycol, 10-14 parts of silicone oil, 10-14 parts of a flame-retardant additive, 8-10 parts of a synergist aid, 1-3 parts of boron nitride, 4-6 parts of silicon carbide, 6-8 parts of graphene and 3-5 parts of a coupling agent. The packaging material has the advantages of good thermal conduction and thermal dissipation effects, low thermal impedance, good weather resistance, good flame retardation property and good sealing effect; and a preparation method of the packaging material has the advantages of low material cost, easily available raw materials, simple process, high use values and good application prospect.