Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board

A technology of fluorine-containing resin and conformal coating, which is applied in the direction of epoxy resin coating, printed circuit secondary treatment, carboxylate preparation, etc., and can solve the problems of slow curing speed, moisture resistance and voltage resistance of the use requirements, etc. , to achieve excellent water resistance, good mechanical and thermal properties, and high hardness

Active Publication Date: 2012-06-27
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to overcome the disadvantages of the existing conformal coatings that the water resistance, moisture resistance and voltage resistance cannot meet the use requirements of harsh environments and the curing speed is slow, and provide a coating that can be cured at room temperature and has a good coating layer a

Method used

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  • Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board
  • Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board
  • Fluorine-containing resin, preparation method thereof, conformal coating and printed circuit board

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preparation example Construction

[0040] The present invention also provides a method for preparing the above-mentioned fluorine-containing resin, the method comprising performing condensation reaction and / or ring-opening addition reaction on a resin precursor containing fluorine atoms and an unsaturated fatty acid under the action of a catalyst, wherein the unsaturated The fatty acid molecular structure contains multiple carbon-carbon double bonds, and at least two of the multiple carbon-carbon double bonds are separated by a methylene group.

[0041] In the present invention, the resin precursor containing fluorine atoms and the unsaturated fatty acid undergo condensation reaction and / or ring-opening addition reaction under the action of a catalyst, so that a chemical bond is formed between the resin precursor containing fluorine atoms and the unsaturated fatty acid, thereby obtaining The fluorine-containing resin of the present invention. Therefore, the molecular structure of the resin precursor containing ...

Embodiment 1

[0084] This example is used to illustrate the fluorine-containing resin and its preparation method according to the present invention.

[0085] Add 36.6g of hexafluorobisphenol A, 75.0g of epichlorohydrin and 150ml of N-methylpyrrolidone into a 500ml three-necked flask as a reaction solvent. After the above two reactants are completely dissolved, add 2.75g of tetrabutylammonium chloride, React at 55° C. for 3 hours; then, add 4 g of sodium hydroxide to the reaction system, and react at 70° C. for 4 hours. After the reaction is completed, the method of distillation under reduced pressure is used for purification to obtain the epoxy resin precursor containing fluorine atoms of the present invention. The epoxy equivalent of the epoxy resin precursor containing fluorine atoms is 410, the number average molecular weight is 840, and the molecular weight distribution is 1.05, corresponding to the epoxy resin precursor containing fluorine atoms in structural formula 6 where n=1.

[008...

Embodiment 2

[0088] This example is used to illustrate the fluorine-containing resin and its preparation method according to the present invention.

[0089] In a 500ml three-necked flask, add 36.6g hexafluorobisphenol A, 19.3g epichlorohydrin and 100ml N-methylpyrrolidone as a reaction solvent, and after the above two reactants are completely dissolved, add 2.75g of tetrabutylammonium chloride, React at 60° C. for 4 hours; then, add 4 g of sodium hydroxide to the reaction system, and react at 70° C. for 5 hours. After the reaction is completed, the method of distillation under reduced pressure is used for purification to obtain the epoxy resin precursor containing fluorine atoms of the present invention. The epoxy equivalent of the epoxy resin precursor containing fluorine atoms is 1215, the number average molecular weight is 2400, and the molecular weight distribution is 1.09 respectively, corresponding to the epoxy resin precursor containing fluorine atoms in structural formula 6 where n...

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Abstract

The invention provides a fluorine-containing resin. The molecular structure of the fluorine-containing resin contains a plurality of carbon-carbon double bonds, a methylene group is between at least two carbon-carbon double bonds in all the carbon-carbon double bonds, and the fluorine-containing resin is a fluorine-containing epoxy resin. The invention also provides a preparation method of the fluorine-containing resin. According to the method, a fluorine atom-containing epoxy resin precursor and an unsaturated fatty acid with the molecular structure containing a plurality of the carbon-carbon double bonds and the methylene group between at least two carbon-carbon double bonds in all the carbon-carbon double bonds undergo a condensation reaction and/or a ring-opening addition reaction. The invention further provides a conformal coating containing the fluorine-containing resin of the invention, and a printed circuit board containing the fluorine-containing resin of the invention. The adhesion force of a coating layer formed after the curing of the conformal coating containing the fluorine-containing resin of the invention to the printed circuit board reaches 5B, the hardness reaches a B grade, the flexibility is 0.5mm, the surface energy is 16.56-17.51mJ/cm<2>, and the voltage resistance is higher than 10,000V; and no foaming appears after fifty cycles when the printed circuit board which is sprayed with the conformal coating of the invention and is completely cured is immersed in 50DEG C water.

Description

[0001] This application is a divisional application filed on December 19, 2008 with the application number 200810186468.9 and the name "fluorine-containing resin and its preparation method, conformal coating and printed circuit board". technical field [0002] The invention relates to a fluorine-containing resin, a preparation method thereof, a conformal coating and a printed circuit board containing the fluorine-containing resin. Background technique [0003] Conformal coating is a layer of protective material coated on the printed circuit board (PCB) of soldered plug-in components. After the coating layer is fully cured, it can enhance the moisture-proof and anti-fouling capabilities of electronic circuits and components, and prevent solder joints and conductors from Corroded, it can also play a role in shielding and eliminating electromagnetic interference and preventing circuit short circuit, improving the insulation performance of circuit boards. In addition, the coatin...

Claims

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Application Information

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IPC IPC(8): C08G59/16C07C69/58C07C69/587C07C67/26C09D163/10H05K3/28
Inventor 王忠利韩竹东戚仁宏
Owner BYD CO LTD
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