118 results about "Lead electrode" patented technology

The present invention relates to an ultra-thin light-emitting diode (LED) electrode assembly, a manufacturing method of the ultra-thin LED electrode assembly, and a transfer film of an ultra-thin LED used for manufacturing the ultra-thin LED electrode assembly and relates to an ultra-thin LED electrode assembly in which a plurality of LED elements are simultaneously transferred using a laser-assisted multi-chip transfer printing method to form and pattern the LED elements, thereby preventing process defects caused by omission of the LED elements during transfer and deviation thereof from an electrode line, and defects such as dark spots caused in an LED display, a manufacturing method of the ultra-thin LED electrode assembly, and a transfer film of an ultra-thin LED used for manufacturing the ultra-thin LED electrode assembly.

A method of preparing 2-hydroxyadpic acid and adipic acid is provided. The method of preparing 2-hydroxyadpic acid and adipic acid comprises a step of the electrolysis of 2,5-furandicarboxylic acid using a metal electrode at a constant current in a sulfuric acid solution containing a quaternary ammonium salt. The metal electrode is a bismuth electrode or a lead electrode. The quaternary ammonium salt is represented by formula (I):wherein R1 to R4 are independently a C2-5 hydrocarbon group, and X− is ClO4−, H2PO4−, or Br−.

This invention provides an inductor component. There is a concern that the lead-out electrodes may excessively interrupt magnetic flux when current flows through the inductor wiring. The inductor component (10) includes a blank (20). The blank (20) has a mounting surface (21) and a top surface (22) that are parallel to each other, a first end surface (23) and a second end surface (24) that are parallel to each other, and a first side surface and a second side surface that are parallel to each other. Inductor wiring (30) is disposed inside the blank (20). A first lead-out electrode (40) is connected to a first end in the extending direction of the inductor wiring (30). A second lead-out electrode (50) is connected to a second end in the extending direction of the inductor wiring (30). The lower surfaces of the first lead-out electrode (40) and the second lead-out electrode (50) are exposed from the mounting surface (21) of the blank (20). The first lead-out electrode (40) is a quadrangular prism extending in the height direction (Td). The first lead electrode (40) is exposed from the first end face (23) and the first side face.

The invention discloses a packaging structure design and a packaging process of a multi-channel driving circuit, and relates to the technical field of microelectronic device packaging. Which comprises a ceramic base, a metal wall, a chip carrier and an outer lead electrode, and is characterized in that the ceramic base is of a stepped structure and is made of an Al2O3 multilayer ceramic material; the metal wall on the first step is fixedly connected with the ceramic base through a sintering process, and nine inner electrode bonding pads are arranged on the second step; the chip carrier on the third step is fixedly connected with the ceramic base through a sintering process; and an outer lead electrode is welded and fixed at the bottom of the ceramic base. The heat conductivity of the ceramic material is obviously higher than that of the plastic packaging material, heat generated by the chip can be efficiently conducted to the external environment, and a lighter and smaller packaging appearance is achieved through internal structure optimization. And secondly, the loss of the high-frequency signal in the ceramic material is lower, so that the loss of a finished product device can be reduced.

The utility model discloses a chemical vapor deposition device. The chemical vapor deposition device comprises a high-temperature furnace, a sample tube, a vacuum flange, a lead electrode flange, an electrode and an electrode bracket, the high-temperature furnace is provided with a cavity for accommodating a sample tube; the sample tube is provided with a cavity for accommodating a sample; two ends of the sample tube are respectively sealed by a vacuum flange and a lead electrode flange; a connector connected with a power supply is arranged on the outer side of the lead electrode flange; the electrode is mounted on the electrode bracket; the electrode bracket is arranged in the sample tube and is connected with the joint through a lead; during use, the connector of the lead electrode flange is connected with a power supply, so that the electrode generates an electric field in the sample tube. An electric field is introduced into the sample tube, distribution and migration of gaseous reactants in a reaction area can be effectively regulated and controlled, the deposition process is optimized, and the material performance and the preparation efficiency are improved; in addition, the chemical vapor deposition device is simple and convenient in structure, convenient to operate, good in compatibility and suitable for chemical vapor deposition preparation and scientific research of various materials.

The invention discloses a continuously distributed smart sensor for vehicle wheel mark identification and a positioning method thereof, and relates to the field of road intelligent monitoring, the smart sensor adopts a conductive nano polymer composite material as a sensing unit, and the sensing unit is composed of a polymer matrix material and a nano filler; the composite smart material is prepared by adopting a two-step method of mechanical dispersion and external electric field induced orientation, so that the good dispersion of the nanofiller in the polymer is improved, and the mechanical dispersion comprises methods of mechanical stirring, grinding, high-speed shearing, ultrasonic dispersion and the like; according to the external electric field induced orientation method, an electric field environment with certain field intensity and frequency is applied to the composite material before curing, so that the nanoparticles quickly react to an external electric field, and rotation and arrangement along the direction of the electric field are formed. And after the strip-shaped composite material is cured and molded, sticking and fixing lead electrodes at the two ends, and further performing outer coating and packaging by utilizing a polymer to obtain the smart sensor.

The present application relates to a kind of embedded film thermocouple array heat flow sensor for slab continuous casting crystallizer and on-line monitoring method, belong to continuous casting process detection technical field.Sensor includes flexible insulating substrate, thin film thermocouple array being arranged on the surface of flexible insulating substrate, lead electrode being connected with thin film thermocouple array, and protective packaging layer for covering thin film thermocouple array.Monitoring method includes, calibrating sensor is embedded in crystallizer copper plate hot face, real-time acquisition potential signal output by each subunit of thin film thermocouple array;Local heat flow density at each thermocouple subunit is calculated, and the instantaneous heat flow distribution cloud picture of crystallizer copper plate surface is reconstructed by interpolation method;When local heat flow density exceeds preset threshold or heat flow fluctuation amplitude exceeds set range, prewarning signal is sent.The present application realizes the in-situ, direct measurement of crystallizer hot face heat flow, response speed is fast, can realize transient heat flow measurement and the fine measurement of local heat flow distribution.

The application discloses a data acquisition device, and belongs to the technical field of medical treatment. The data acquisition device comprises an electrocardio monitoring clothes and a portable data acquisition device. The electrocardio monitoring clothes comprises a clothes body and a plurality of lead electrodes. The plurality of lead electrodes are all installed on the clothes body, each lead electrode is matched with a corresponding human body lead position, and the lead electrodes are electrically connected with the portable data acquisition device. A user can wear the electrocardio monitoring clothes. Since the positions of the lead electrodes on the clothes body are matched with the human body lead positions, the lead electrodes on the electrocardio monitoring clothes can be in contact with the human body lead positions of the user, and the user can perform electrocardio measurement by starting the portable data acquisition device. The electrocardio condition is measured through the data acquisition device, and the operation is simple. A professional doctor is not needed to paste the lead electrodes on the user one by one. The heart rate measurement is not limited by occasions. The electrocardio monitoring clothes has a wide application occasion and high flexibility.

This invention discloses a small implantable biosensor assembly and a bioinformation monitoring device containing the assembly. The first conductive end of the connecting unit protrudes from the surface of the outer shell for connection with a transmitter, and the second conductive end of the connecting unit is physically connected to the lead electrode of the implantable sensing electrode. The lower part of the implantation needle and the first notch of the auxiliary needle pass through the guide hole of the outer shell from top to bottom, and a first sealing ring is provided between the lower part of the auxiliary needle and the upper part of the outer shell. The implantable sensing section is contained in the V-shaped or U-shaped opening of the lower part of the implantation needle. The outer side of the barrier is detachably engaged with the second buckle at the bottom of the outer shell, and the inner side of the barrier is detachably engaged with the first notch of the needle assembly. The implantable sensing section and the lower part of the implantation needle are sealed in a closed space formed by the barrier, the lower part of the outer shell, and the lower part of the auxiliary needle. This closed space constitutes a sterilization unit, which is small and has high production efficiency.

The utility model discloses a foldable battery pack and electric equipment, the foldable battery pack comprises a plurality of battery pieces and a protective film for protecting the plurality of battery pieces, and two opposite sides of each battery piece are respectively provided with a group of extraction electrodes; and the plurality of battery pieces are connected in series through the flexible connecting pieces connected with the extraction electrodes, and can be folded through the flexible connecting pieces. According to the foldable battery pack and the electric equipment provided by the embodiment of the invention, the plurality of battery pieces can be folded through the flexible connecting pieces, so that when the plurality of battery pieces are in an unfolded state, the foldable battery pack can be in an unfolded state, and the whole foldable battery pack is in a flat shape; and when the plurality of battery pieces are in a completely folded state, the foldable battery pack is in a folded state, and the whole foldable battery pack is in a square shape. According to the arrangement, the range of electric equipment applied to the foldable battery pack can be expanded, and the design complexity and limitation of the electric equipment are reduced.

The application relates to a micro component structure and a preparation method thereof and a transfer method of an LED chip, wherein the micro component structure comprises a substrate, a plurality of stacked glue layer structures arranged at a first surface of the substrate in a spaced manner and a plurality of LED chips arranged on the plurality of stacked glue layer structures correspondingly, the LED chip has two lead electrodes towards the surface of the stacked glue layer structure; the stacked glue layer structure comprises a photolysis glue layer and a pyrolysis glue layer arranged in a laminated mode, the photolysis glue layer is in contact with the first surface, the pyrolysis glue layer is located between the two lead electrodes, and the thickness of the pyrolysis glue layer is greater than the height of the lead electrodes. When the LED chip on the micro component structure is transferred through laser, the laser energy required for dissociating the photolysis glue layer in the stacked glue layer structure is low, so that the damage to the chip in the transfer process is small, and the existence of the pyrolysis glue layer can further slow down the damage of the laser to the chip, and the transfer yield of the chip is improved.

The invention discloses a shock wave balloon catheter and a manufacturing method thereof, and relates to the technical field of medical instruments, and the shock wave balloon catheter comprises a balloon, an electrode assembly and a wire; the balloon can be filled with a conductive solution; the inner tube is of a hollow tubular structure, and the far end of the inner tube can extend into the balloon; the electrode assembly comprises a positioning sleeve, a protection sleeve, a middle electrode and a wire electrode, the positioning sleeve and the protection sleeve are coaxially arranged on the inner pipe in a sleeving mode from inside to outside in sequence, the middle electrode and the wire electrode are embedded in the positioning sleeve, and the protection sleeve is provided with an excitation through hole used for exposing at least part of the middle electrode and at least part of the wire electrode; the middle electrode and the wire electrode form an electrode pair; and at least one end of the lead is embedded in the positioning sleeve and is connected with the lead electrode, and smooth transition of outlines of all parts of the protection sleeve is guaranteed. Through the arrangement, the overall outer diameter of the system electrode assembly is reduced, meanwhile, the connecting strength of the middle electrode, the wire electrode and the wire is improved, and the stability of the electrode assembly is improved.

The invention provides a crystal device having low crystal impedance characteristics, a crystal resonator element, and a crystal wafer. The crystal device includes: a package including a base plate having a rectangular shape in plan view, a bank portion provided along an edge of the base plate, and an adhesive pad provided on one end side in a longitudinal direction of an inner region surrounded by the bank portion; an AT-cut crystal resonator element which has a rectangular shape in plan view and on which an excitation electrode, a pad electrode positioned on one end side in the longitudinal direction, and a lead-out electrode connected to the excitation electrode and the pad electrode are formed on the front and back surfaces; and a fixing member that fixes the crystal vibrating piece to the bonding pad at a position where the pad electrode and the bonding pad face each other, the ratio of the width of the extraction electrode to the dimension of the crystal vibrating piece in the short-side direction being 15% or more and less than 50%.

A two-electrode submerged arc welding method capable of improving the quality of welded joints is provided. [Solution] A two-electrode submerged arc welding method includes distributing a cut wire within a groove of a base material (2), outputting current from a power source via a leading electrode (3) to energize a leading welding wire (4) and generating an arc (A) between the base material (2) and the leading welding wire (4) within the groove, and energizing a trailing electrode (6) from the power source to supply a heated filler wire (7) to a molten pool (P) formed behind the arc (A) while welding is proceeding, without generating an arc, wherein the leading electrode (3) is inclined toward the welding direction (X) at a predetermined sweepback angle (θ) with respect to an axis (Z) perpendicular to the welding direction (X) and the base material (2).

An integrated capacitor comprises a plurality of capacitor core groups which are connected in parallel, each capacitor core group comprises a plurality of capacitor cores (1) which are mutually connected in series, each capacitor core group is connected with a first extraction electrode (2) through a first connecting sheet (3), and the lengths of the first connecting sheets of the capacitor core groups are the same. According to the invention, the problem of inconsistent performance degradation amounts among the capacitors caused by voltage and current differences among the capacitors when a plurality of capacitors are connected in series and in parallel can be solved, so that the performance consistency of the capacitors in the whole life cycle of a high-precision circuit can be met, and the service life of the circuit can meet the design requirement.

This disclosure provides a device and method for repairing dies during the manufacture of micro-LED displays. The device includes a backplane. The backplane has a plurality of backplane electrodes. Each backplane electrode contains a first material. The device includes a plurality of micro-LEDs, each having a plurality of micro-LED electrodes. Each micro-LED electrode contains a second material. Each micro-LED electrode is bonded to each backplane electrode with an alloy of the first material and the second material in between. At least one backplane electrode is bonded to a micro-LED electrode via a repair material. The device includes a plurality of subpixel isolation (SI) structures formed on the backplane. The SI structures define wells for subpixels. Each well contains its respective micro-LED between adjacent SI structures. The subpixels have a color conversion material placed within the well.

The utility model provides a high-heat-dissipation film thermal printing head, and belongs to the technical field of thermal printing, the printing head comprises a heat dissipation plate and a heating substrate, the heating substrate comprises an insulating substrate, and a local glaze coating layer, a heating resistor body, a lead electrode and a protective layer which are arranged on the upper surface of the insulating substrate, the heat dissipation plate is located on the lower surface of the insulating substrate, and the heat dissipation plate is located on the lower surface of the insulating substrate. One side of the front end of the heat dissipation plate extends towards the insulation substrate in the direction perpendicular to the wide breadth face of the heat dissipation plate to form a heat dissipation plate boss, and the lower surface and the front edge end face of the insulation substrate are connected with the upper surface of the heat dissipation plate and the side face of the heat dissipation plate boss respectively for heat transfer. The height h11 of the heat dissipation plate boss is 10%-100% of the thickness of the insulating substrate. According to the printing head, the heat dissipation effect can be enhanced through the specific structure and material combination of the boss of the heat dissipation plate and the arrangement of the local glaze coating, heat dissipation is controlled according to needs, and therefore the printing speed of the printing head is increased, and the service life of the printing head is prolonged.

The invention discloses a high-reliability small-size combined high-voltage capacitor convenient to assemble, and belongs to the technical field of high-voltage capacitor production, the high-reliability small-size combined high-voltage capacitor convenient to assemble comprises a shell and a plurality of capacitor cores arranged in the shell, the plurality of capacitor cores are sequentially arranged to form a capacitor core group, and in the capacitor core group, a plurality of capacitor cores are arranged in the shell. The first ends of all the capacitor cores and the second end of the first capacitor core are respectively provided with an extraction electrode, and after the extraction electrode at the second end of the first capacitor core is bent by 90 degrees, the end portion of the extraction electrode corresponds to the positions where the end portions of all the other extraction electrodes are located. The first end of the previous capacitor core is conductively connected with the second end of the next capacitor core through a conductive connecting sheet, an insulating isolation plate is arranged between two adjacent capacitor cores, and the conductive connecting sheet passes through a through groove or a through hole in the corresponding insulating isolation plate. The size of the whole capacitor is reduced, the assembling difficulty is reduced, the insulating property and the product reliability are improved, and application is convenient.

This invention discloses a temperature sensor manufacturing process. The temperature sensor includes a temperature sensing module, a metal shell formed by deep drawing a sheet metal part, and an insulating plug. The metal shell has a cavity, and the temperature sensing module is attached to the bottom of the cavity. The temperature sensing module includes a thermistor and an insulating layer. The bottom of the lead electrode of the thermistor is separated from the metal shell by the insulating layer. The insulating plug is positioned and inserted into the cavity. The inner end of the insulating plug has a conductive contact that is electrically connected to the lead electrode. The outer end of the insulating plug has a lead wire that is electrically connected to the conductive contact. In this invention, the temperature sensing module is first mounted on the sheet metal part. When the sheet metal part is deep drawn to the metal shell, the temperature sensing module is formed on the inner bottom surface of the metal shell. The insulating plug is positioned and inserted into the metal shell, allowing the insulating plug to connect with the thermistor of the temperature sensing module. This achieves rapid installation of the temperature sensor, and the position of the temperature sensing module is fixed for each temperature sensor, resulting in high consistency.

The application discloses a kind of for electrocardiogram 12 lead multipath AD data processing method, the application relates to biological electric signal acquisition and analog-digital conversion technical field, comprising the following steps: S1: constructing 12 lead signal acquisition channel mapping model, the model is clear 12 electrocardiogram lead electrode configuration, each lead corresponding analog signal input channel, the hardware architecture of multichannel AD conversion system and the signal transmission path characteristics of each channel.The for electrocardiogram 12 lead multipath AD data processing method, by constructing accurate channel mapping model, and combining dynamic signal feature analysis, realize the individualized precision configuration of each lead AD conversion parameter.The method is verified by model consistency test and physiological rule, and the dual protection mechanism of mechanism, effectively improve the accuracy and reliability of each channel signal acquisition, while ensuring the strict time sequence synchronization between multichannel, provide high-quality, high-consistency electrocardiogram data basis for clinical diagnosis.

The application discloses a radio frequency filter device and a packaging method thereof. The device comprises an external lead electrode and a first bonding filter and a second bonding filter which are stacked from bottom to top. The first bonding filter comprises a first base, a first support electrode on the upper surface of the first base, and a first bonding electrode on the upper surface of the first support electrode. The second bonding filter comprises a second base and a second bonding electrode on the lower surface of the second base, and the second bonding electrode has a recess. The cross-sectional size of the first bonding electrode is smaller than the cross-sectional size of the first support electrode and the size of the recess, and the first bonding electrode is bonded to the second bonding electrode through the recess. The external lead electrode is electrically connected to the second bonding electrode, the first bonding electrode, and an auxiliary bonding electrode in the second base through a through hole in the second base, so that the external lead electrode is electrically connected to the first bonding filter. The application can reduce the packaging cost of the radio frequency filter device, improve the production efficiency and integration.

The utility model relates to the technical field of electrocardiogram lead wires, in particular to an electrocardiogram lead wire capable of reducing skin damage, which comprises a connector, and the front end and the rear end of the right side of the connector are respectively provided with a limb lead electrode wire and a chest electrode wire. Button type gel electrodes are arranged at the ends, away from the connector, of the limb lead electrode wires and the chest electrode wires, arc-shaped seats are fixedly connected to the outer sides of the limb lead electrode wires, and connecting seats are fixedly connected to the tops of the button type gel electrodes. Under the action of the button type gel electrode, the arc-shaped seat and the elastic capsule, the electrocardiogram lead wire has the advantage of reducing skin damage, and solves the problems that clips are clamped on four limbs, and clips are clamped at the tail ends of the limbs for a long time, so that local skin is easily damaged, even local tissues are ischemic, and the like. And therefore, some patients cannot insist at the end of the examination, the physical fitness of the patients is poor, and the technology is not easy to carry out.

This invention provides a metal-doped electrode and a method for the electrochemical oxidation of phenol to prepare p-benzoquinone. The metal-doped electrode comprises a conductive substrate material and lead, manganese, and ruthenium metals attached to the surface of the conductive substrate material, wherein the mass ratio of lead, manganese, and ruthenium is 60-95%:2-25%:2-15%. The method for the electrochemical oxidation of phenol to prepare p-benzoquinone uses the metal-doped electrode of this invention as the anode and a lead electrode as the cathode in a two-chamber electrolytic cell containing a diaphragm, and electrolyzes phenol to prepare p-benzoquinone under acidic conditions. The electrode of this invention is corrosion-resistant under acidic conditions and has a long service life. Current density >4000 A / m 2 By controlling the current density, the selectivity of benzoquinone is >90%. The electrode materials used are inexpensive and readily available, the electrochemical process is simple, and the process is safe and reliable, showing great promise for industrialization.

In one embodiment, an electronic control device according to the present disclosure is provided with a wiring board on which at least one switching element is mounted in a path for supplying power from a power source to a motor. The wiring board has, on the surface thereof, a land pattern to which electrodes of the switching element are joined by soldering, the electrode including a back electrode and a lead electrode integrated with each other. In the land pattern, a first portion to which the back electrode is soldered and a second portion to which the lead electrode is soldered are separated by a non-conductive resist.

The present application relates to a kind of method for synthesizing hexanediamine by electrochemistry of acrylonitrile, wherein electrolysis is divided into two stages, lead electrode is used in cathode in the first stage electrolysis, nanometer titanium dioxide array tube electrode is used in cathode in the second stage electrolysis, the anode used in two stage electrolysis is all DSA anode of iridium tantalum coating, electrolyte includes acrylonitrile, phosphate and quaternary ammonium base, electrolyte is injected into electrolytic cell to carry out two stage electrolysis reaction, and hexanediamine, a small amount of propylamine and a small amount of 1,3,6-hexane triamine are obtained.The process uses electrochemistry method to directly synthesize hexanediamine from acrylonitrile, process is simple, three wastes are little, and it has higher practical value.

Semiconductor device (1A) comprising: a substrate (10) having a substrate main surface (101) pointing in a thickness direction (Z); a semiconductor element (40) having an element main surface (401) pointing towards the substrate main surface (101), a first element electrode (43) formed on the element main surface (401), and a second element electrode (53) formed on the element main surface (401); a first through-electrode (22) extending through the substrate (10) and having a first upper electrode surface (221) pointing in the same direction as the substrate main surface (101); a second through-electrode (32) extending through the substrate (10) and having a second upper electrode surface (321) pointing in the same direction as the substrate main surface (101);a first main area wiring conductor (23) that contacts the substrate main area (101) and the first upper electrode area (221) and has a first upper wiring conductor area (231) that points in the same direction as the substrate main area (101); a second main area wiring conductor (33) that contacts the second upper electrode area (321) and has a second upper wiring conductor area (331) that points in the same direction as the substrate main area (101); a first wiring conductor electrode (24) that is formed on the first upper wiring conductor area (231); a second wiring conductor electrode (34) that is formed on the second upper wiring conductor area (331); a first joining element (61) that joins the first element electrode (43) and the first wiring conductor electrode (24) together;and a second joining element (62) which joins the second element electrode (53) and the second wiring lead electrode (34) together, wherein the second through-electrode (32) is arranged in a region which, when viewed in the thickness direction (Z), overlaps with the semiconductor element (40), the first upper electrode surface (221) is recessed into the first through-electrode (22), the second upper electrode surface (321) is recessed into the second through-electrode (32), and the first wiring lead electrode (24) is larger than the second wiring lead electrode (34) when viewed in the thickness direction (Z).

The present disclosure provides an apparatus and method for repairing a die during manufacturing of a micro LED display. The device comprises a back plate. The backplane has a plurality of backplane electrodes. Each backplane electrode includes a first material. The device comprises a plurality of micro-LEDs with a plurality of micro-LED electrodes. Each micro LED electrode includes a second material. Each micro-LED electrode is bonded to each backplane electrode by an alloy of the first material and the second material between the micro-LED electrode and the backplane electrode. At least one backplane electrode is bonded to the micro LED electrode via a repair material. The device includes a plurality of sub-pixel isolation (SI) structures formed over the backplane. The SI structure defines a well of a sub-pixel. Each well includes a respective micro LED located between adjacent SI structures. The sub-pixel has a color conversion material disposed in the well.

The present disclosure relates to a light-emitting diode (LED) electrode assembly, and more specifically, to an ultra-thin LED electrode assembly and a manufacturing method thereof.

The fuse element's melting speed is increased to shorten the interruption time in case of an abnormality. [Solution] When viewed from a direction perpendicular to the first main surface 111, the fuse element 150 has recesses 151 formed on its edge in the second direction (Y-axis direction) perpendicular to the first direction (X-axis direction) at the position between the first electrode 120 and the lead electrode 160, and at the position between the second electrode 130 and the lead electrode 160. A portion 10p of the flux 10 accumulates inside the recesses 151.

The invention discloses an MEMS ionization vacuum sensor based on magnetic field assistance and a manufacturing method thereof, and belongs to the technical field of microelectronics. The sensor comprises a glass substrate, an emitter electrode, a lead electrode, an electron emitter, a first insulating spacer layer, a grid electrode, a second insulating spacer layer, top glass, an ion deflection electrode, an ion collector, an annular electrode and a magnetic field generation part, the manufacturing method comprises the steps of preparation of the substrate and the top glass, bonding of the electron emitter, processing of the insulating spacer layer and the grid electrode, anodic bonding, laser bonding, installation of the magnetic field component and scribing. An electric field-magnetic field composite field is used for remarkably expanding the electron motion trail, the problems that an existing sensor is weak in ion flow and poor in anti-interference capacity are solved by combining the physical isolation design of an ionization and collection area, and the sensor has the advantages of being small in size, high in precision, good in consistency and low in cost and is suitable for the fields of semiconductor manufacturing and aerospace.