Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate
An aluminum-based copper-clad laminate with high thermal conductivity technology, applied in the field of copper-clad laminates, can solve the problems of reduced withstand voltage, easy cracking, high brittleness, etc., to increase cladding, improve electrical insulation performance and withstand voltage performance, The effect of reducing microbubbles
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example 1
[0027] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:
[0028] (1) Provide raw materials for the following components:
[0029] material name
Mass (grams)
mass ratio
E type bisphenol A epoxy resin
60
11.25%
O-Cresol Novolak Epoxy Resin
30
5.62%
Bisphenol A Low Molecular Epoxy Resin
10
1.88%
Diaminodiphenylsulfone
25
4.69%
boron trifluoride monoethylamine
0.5
0.09%
silicone rubber
8
1.50%
Toluene
50
9.38%
dimethylformamide
25
4.69%
butanone
50
9.38%
Cyclohexanone
20
3.75%
acetone
10
1.88%
Aluminum oxide powder (1μm)
50
9.38%
Silicon carbide powder (3μm)
90
16.87%
Aluminum oxide powder (8μm)
100
18.75%
A silane coupling agent
...
example 2
[0044] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:
[0045] (1) Provide raw materials for the following components:
[0046] material name
Mass (grams)
mass ratio
E type bisphenol A epoxy resin
85
16.14
O-Cresol Novolak Epoxy Resin
10
1.90
Bisphenol A Low Molecular Epoxy Resin
5
0.95
Diaminodiphenylsulfone
15
2.85
boron trifluoride monoethylamine
0.6
0.11
silicone rubber
3
0.57
Toluene
50
9.49
dimethylformamide
25
4.75
butanone
50
9.49
Cyclohexanone
20
3.80
acetone
10
1.90
Aluminum oxide powder (1μm)
60
11.39
Silicon carbide powder (3μm)
70
13.29
Aluminum oxide powder (8μm)
120
22.79
A silane coupling agent
3
0.57
...
example 3
[0061] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:
[0062] (1) Provide raw materials for the following components:
[0063] material name
Mass (grams)
mass ratio
E type bisphenol A epoxy resin
70
12.94%
O-Cresol Novolak Epoxy Resin
25
4.62%
Bisphenol A Low Molecular Epoxy Resin
5
0.92%
Diaminodiphenylsulfone
20
3.70%
boron trifluoride monoethylamine
0.8
0.15%
silicone rubber
10
1.85%
Toluene
50
9.25%
dimethylformamide
25
4.62%
butanone
50
9.25%
Cyclohexanone
20
3.70%
acetone
10
1.85%
Aluminum oxide powder (1μm)
60
11.09%
Silicon carbide powder (3μm)
90
16.64%
Aluminum oxide powder (8μm)
100
18.49%
A silane coupling agent
...
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