Preparation method of high thermal conductivity adhesive film for aluminum base copper clad laminate

An aluminum-based copper clad laminate, high thermal conductivity technology, applied in the field of copper clad laminates, can solve the problems of high brittleness, easy cracking, reduced voltage resistance, etc., to reduce micro-bubble, improve electrical insulation performance and voltage resistance performance, Increase the effect of wrapping

Active Publication Date: 2017-08-08
GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, some resin film-like materials made by adding a large amount of heat-conducting materials have appeared. This kind of film-like material is not only brittle, but also has many micro-air gaps in the film layer, and it is easy to crack during PCB processing, which will cause LED During long-term use, the components fail due to the drop in withstand voltage

Method used

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  • Preparation method of high thermal conductivity adhesive film for aluminum base copper clad laminate
  • Preparation method of high thermal conductivity adhesive film for aluminum base copper clad laminate
  • Preparation method of high thermal conductivity adhesive film for aluminum base copper clad laminate

Examples

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example 1

[0027] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:

[0028] (1) Provide raw materials for the following components:

[0029] material name Mass (grams) mass ratio E type bisphenol A epoxy resin 60 11.25％ O-Cresol Novolak Epoxy Resin 30 5.62％ Bisphenol A Low Molecular Epoxy Resin 10 1.88％ Diaminodiphenylsulfone 25 4.69％ boron trifluoride monoethylamine 0.5 0.09％ silicone rubber 8 1.50％ Toluene 50 9.38％ dimethylformamide 25 4.69％ butanone 50 9.38％ Cyclohexanone 20 3.75％ acetone 10 1.88％ Aluminum oxide powder (1μm) 50 9.38％ Silicon carbide powder (3μm) 90 16.87％ Aluminum oxide powder (8μm) 100 18.75％ A silane coupling agent 4.8 0.90％

[0030] (2) Add the dimethylformamide, methyl ethyl ketone, cyclohexanone, and acetone measured in the abo...

example 2

[0044] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:

[0045] (1) Provide raw materials for the following components:

[0046] material name Mass (grams) mass ratio E type bisphenol A epoxy resin 85 16.14 O-Cresol Novolak Epoxy Resin 10 1.90 Bisphenol A Low Molecular Epoxy Resin 5 0.95 Diaminodiphenylsulfone 15 2.85 boron trifluoride monoethylamine 0.6 0.11 silicone rubber 3 0.57 Toluene 50 9.49 dimethylformamide 25 4.75 butanone 50 9.49 Cyclohexanone 20 3.80 acetone 10 1.90 Aluminum oxide powder (1μm) 60 11.39 Silicon carbide powder (3μm) 70 13.29 Aluminum oxide powder (8μm) 120 22.79 A silane coupling agent 3 0.57

[0047] (2) Add the dimethylformamide, methyl ethyl ketone, cyclohexanone, and acetone measured in the above table into the...

example 3

[0061] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:

[0062] (1) Provide raw materials for the following components:

[0063] material name Mass (grams) mass ratio E type bisphenol A epoxy resin 70 12.94％ O-Cresol Novolak Epoxy Resin 25 4.62％ Bisphenol A Low Molecular Epoxy Resin 5 0.92％ Diaminodiphenylsulfone 20 3.70％ boron trifluoride monoethylamine 0.8 0.15％ silicone rubber 10 1.85％ Toluene 50 9.25％ dimethylformamide 25 4.62％ butanone 50 9.25％ Cyclohexanone 20 3.70％ acetone 10 1.85％ Aluminum oxide powder (1μm) 60 11.09％ Silicon carbide powder (3μm) 90 16.64％ Aluminum oxide powder (8μm) 100 18.49％ A silane coupling agent 5.0 0.92％

[0064] (2) Add the dimethylformamide, methyl ethyl ketone, cyclohexanone, and acetone measured in the ab...

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Abstract

The invention discloses a method for preparing a high thermal conductivity adhesive film for aluminum-based copper-clad laminates, mainly by adding composite thermal conductive fillers to make the thermal conductivity of the adhesive film greater than 3.0W / K m; at the same time, using a variety of solvent systems with different boiling points. During the film drying process, the solvent is volatilized in a gradient manner, reducing the micro-bubbles in the film layer, improving the electrical insulation performance and voltage resistance of the film layer; and introducing organic elastic resin and sub-resin into the resin system to increase the elasticity of the film and resin Coating and wettability of inorganic fillers.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a method for preparing a high thermal conductivity adhesive film for aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper-clad laminates are widely used in high-power heating components due to their good heat dissipation performance. With the rapid development of green lighting technology and the maturity of LED technology, aluminum-based copper-clad laminates have become the preferred material for high-power LED substrate materials. The heat dissipation of aluminum-based copper-clad laminates directly affects the life and luminous efficiency of LED light-emitting components, and the heat dissipation of aluminum-based copper-clad laminates depends on the thermal conductivity of the insulating adhesive layer. Therefore, research on insulating materials with good thermal conductivity The adhesive system is the main way ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C09J163/00C09J163/04C09J11/06C09J11/04C09J11/08B32B37/12
Inventor 马憬峰叶致远
Owner GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) LTD
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