Fluorine-containing resin and preparation method thereof, conformal coating and printed circuit board

A technology of fluorine-containing resin and conformal coating, which is applied in the direction of epoxy resin coating, secondary treatment of printed circuit, polyurea/polyurethane coating, etc. It can solve the problem of unsatisfactory moisture resistance and voltage resistance, slow curing speed, etc. problems, to achieve good mechanical properties and thermal properties, excellent water resistance, high hardness

Active Publication Date: 2010-06-23
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to overcome the disadvantages of the existing conformal coatings that the water resistance, moisture resistance and voltage resistance cannot meet the use requirements of harsh environments and the curing speed is slow, and provide a coating that can be cured at room temperature and has a good coating laye...

Method used

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  • Fluorine-containing resin and preparation method thereof, conformal coating and printed circuit board
  • Fluorine-containing resin and preparation method thereof, conformal coating and printed circuit board
  • Fluorine-containing resin and preparation method thereof, conformal coating and printed circuit board

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preparation example Construction

[0039] The present invention also provides a method for preparing the above-mentioned fluorine-containing resin, the method comprising performing condensation reaction and / or ring-opening addition reaction on a resin precursor containing fluorine atoms and an unsaturated fatty acid under the action of a catalyst, wherein the unsaturated The fatty acid molecular structure contains multiple carbon-carbon double bonds, and at least two of the multiple carbon-carbon double bonds are separated by a methylene group.

[0040] In the present invention, the resin precursor containing fluorine atoms and the unsaturated fatty acid undergo condensation reaction and / or ring-opening addition reaction under the action of a catalyst, so that a chemical bond is formed between the resin precursor containing fluorine atoms and the unsaturated fatty acid, thereby obtaining The fluorine-containing resin of the present invention. Therefore, the molecular structure of the resin precursor containing ...

Embodiment 1

[0083] This example is used to illustrate the fluorine-containing resin and its preparation method according to the present invention.

[0084] Add 36.6g of hexafluorobisphenol A, 75.0g of epichlorohydrin and 150ml of N-methylpyrrolidone into a 500ml three-necked flask as a reaction solvent. After the above two reactants are completely dissolved, add 2.75g of tetrabutylammonium chloride, React at 55° C. for 3 hours; then, add 4 g of sodium hydroxide to the reaction system, and react at 70° C. for 4 hours. After the reaction is completed, the method of distillation under reduced pressure is used for purification to obtain the epoxy resin precursor containing fluorine atoms of the present invention. The epoxy equivalent of the epoxy resin precursor containing fluorine atoms is 410, the number average molecular weight is 840, and the molecular weight distribution is 1.05, corresponding to the epoxy resin precursor containing fluorine atoms in structural formula 6 where n=1.

[008...

Embodiment 2

[0087] This example is used to illustrate the fluorine-containing resin and its preparation method according to the present invention.

[0088] In a 500ml three-necked flask, add 36.6g hexafluorobisphenol A, 19.3g epichlorohydrin and 100ml N-methylpyrrolidone as a reaction solvent, and after the above two reactants are completely dissolved, add 2.75g of tetrabutylammonium chloride, React at 60° C. for 4 hours; then, add 4 g of sodium hydroxide to the reaction system, and react at 70° C. for 5 hours. After the reaction is completed, the method of distillation under reduced pressure is used for purification to obtain the epoxy resin precursor containing fluorine atoms of the present invention. The epoxy equivalent of the epoxy resin precursor containing fluorine atoms is 1215, the number average molecular weight is 2400, and the molecular weight distribution is 1.09 respectively, corresponding to the epoxy resin precursor containing fluorine atoms in structural formula 6 where n...

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Abstract

The invention provides a fluorine-containing resin of which the molecular structure contains multiple carbon-carbon double bonds in which at least two are spaced by a methylene. The invention also provides a preparation method of the fluorine-containing resin, comprising the step of performing condensation reaction and/or ring-opening addition reaction on the precursor of the fluorine-containing resin and the unsaturated fatty acid under the action of catalyst, wherein, the molecular structure of the unsaturated fatty acid contains in which at least two are spaced by a methylene. The invention further provides a conformal coating and printed circuit board containing the fluorine-containing resin. The adhesive attraction of the coating layer formed by curing the conformal coating containing the fluorine-containing resin to the printed circuit board reaches 5B, the rigidity reaches B level, the flexibility is 0.5mm, the surface energy is 16.56-17.51 mJ/cm<2>, the voltage resistance capacity is higher than 10000V; the completely cured printed circuit board coated with the conformal coating of the invention can not bubble in 50 circulations after being soaked in the water of 50 DEG C.

Description

technical field [0001] The invention relates to a fluorine-containing resin, a preparation method thereof, a conformal coating and a printed circuit board containing the fluorine-containing resin. Background technique [0002] Conformal coating is a layer of protective material coated on the printed circuit board (PCB) of soldered plug-in components. After the coating layer is fully cured, it can enhance the moisture-proof and anti-fouling capabilities of electronic circuits and components, and prevent solder joints and conductors from Corroded, it can also play a role in shielding and eliminating electromagnetic interference and preventing circuit short circuit, improving the insulation performance of circuit boards. In addition, the coating protective film is also beneficial to improve the friction resistance and solvent resistance of circuits and components, and can release the pressure caused by periodic temperature changes, improve the stability of electronic products, ...

Claims

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Application Information

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IPC IPC(8): C08G59/16C08G18/83C09D163/10C09D175/14H05K3/28
Inventor 王忠利韩竹东戚仁宏
Owner BYD CO LTD
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