12results about How to "Lower junction temperature" patented technology

The invention discloses an LED chip with a bionic structure and a manufacturing method thereof. The LED chip with the bionic structure comprises a substrate, a P electrode, a P-GaN layer, an MQW layer, an N-GaN layer and an N electrode which are sequentially stacked from bottom to top, a first vertical hole is formed in the P electrode, a second vertical hole is formed in the P-GaN layer, a third vertical hole is formed in the MQW layer, a fourth vertical hole is formed in the N-GaN layer, the first vertical hole, the second vertical hole, the third vertical hole and the fourth vertical hole are communicated with one another, and the cross sections of the first vertical hole, the second vertical hole, the third vertical hole and the fourth vertical hole are all regular hexagons. The plurality of first vertical holes, the plurality of second vertical holes, the plurality of third vertical holes and the plurality of fourth vertical holes are distributed in a hexagonal honeycomb network to form a vertical hole group; a P layer transverse hole is formed in the P-GaN layer, an N layer transverse hole is formed in the N-GaN layer, and insulating heat conduction materials are arranged in the first vertical hole, the second vertical hole, the third vertical hole, the fourth vertical hole, the P layer transverse hole and the N layer transverse hole. The invention aims to solve the technical problem that the performance of an LED chip is limited due to the fact that high luminous efficiency and efficient heat dissipation are difficult to consider at the same time in the prior art.

The utility model discloses an adjustable light-emitting diode (LED) fish gathering lamp with a wide-angle lighting and forced air cooling structure, which comprises a lamp body shell, a lamp arranged in the lamp body shell, a heat dissipation fan, a wide-angle lens arranged at the bottom of the lamp body shell and used for increasing the lighting range, and a light diffusion plate arranged at the bottom of the lamp body shell. A heat dissipation air channel used for enhancing the heat dissipation effect is arranged in the lamp body shell, an adjustable installation part is arranged on one side of the lamp body shell, the illumination intensity and the illumination range are optimized, 165-degree wide-angle illumination is adopted to cover a fishing boat operation area, and the illumination uniformity is greatly improved. And a heat dissipation air channel is optimized, and forced air cooling is adopted, so that the junction temperature of the LED is greatly reduced, and light attenuation is delayed. The fishing boat has the functions of being adjustable in installation and convenient to adjust, adjustment at any time in daily use is facilitated, and various installation modes of the installation part are suitable for various fishing boat scenes.

The invention discloses a half-bridge power module packaging optimization method, and belongs to the technical field of power module packaging, and the method comprises the steps: S1, analyzing the thermodynamic performance of a power module; s2, establishing a two-dimensional power module finite element model; s3, based on finite element simulation, researching the influence of temperature on the service life and stress strain of the module; s4, based on finite element simulation, obtaining the thermal resistance value of each layer of material and the ratio of the thermal resistance value to the total thermal resistance value; s5, analyzing the relationship between the packaging parameters and the thermal impedance, and giving an optimization direction from the packaging level by integrating the temperature and the stress; and S6, establishing a thermal network model, extracting junction temperature through electrothermal coupling, and verifying life increase. By the adoption of the half-bridge power module packaging optimization method, the size of the module can be reduced, temperature resistance and stability can be enhanced, the problem of multi-physics field coupling can be solved, internal thermal impedance and stress strain can be remarkably reduced, thermal performance can be improved, and the service life of the power module can be effectively prolonged through verification of the working condition of a photovoltaic inverter.

The application provides a multi-chip stacked package structure and a preparation method thereof. The multi-chip stacked package structure comprises a first chip distributed on a substrate, a side surface of the first chip being covered by a first plastic package structure; a second chip stacked on the first chip, a side surface and a bottom surface of the second chip being covered by a second plastic package structure; and a heat dissipation structure comprising micro-flow channels located on both sides of the first chip and the second chip, the micro-flow channels penetrating a top surface of the second plastic package structure and extending to a bottom surface of the first plastic package structure, and side surfaces of the micro-flow channels being covered by the first plastic package structure and the second plastic package structure. The multi-chip stacked package structure can quickly conduct the heat generated by the chips to the outside of the overall package structure, avoid the accumulation of heat in the plastic package structure, and ensure the reliability and service life of the device.

The application relates to the technical field of motor control, and discloses a variable-frequency variable-voltage permanent magnet synchronous motor control method, which comprises the following steps: first step: establishing a model of a hidden-pole permanent magnet synchronous motor and an IGBT loss model based on an output period, and establishing the relationship between the two; second step: taking the quality of inverter output current as a constraint condition, and taking the switching frequency of the inverter and the DC bus voltage as constraint variables to establish an optimization target; third step: applying an optimization method to obtain the switching frequency and the DC bus voltage with the lowest IGBT loss based on the output period. The variable-frequency variable-voltage permanent magnet synchronous motor control method optimizes the DC bus voltage and the switching frequency of the motor, can reduce the IGBT loss to the maximum extent, thereby obviously reducing the junction temperature of the IGBT and prolonging the service life of the IGBT.

This application relates to a vertical pin LED chip holder, comprising a substrate. The top of the substrate has multiple evenly arranged supports. Each support includes two horizontal pins arranged parallel to each other vertically and a vertically bent pin at the right end of each horizontal pin. The tops of the two vertical pins are provided with solder pads. A first support rib connected to the substrate is located at the right end of one of the horizontal pins closest to the substrate, and a second support rib connected to the substrate is located at the left end of the two horizontal pins. This invention belongs to the field of LED light-emitting diode technology. It features a robust structure, is not easily deformed, and the vertical pin and double support rib design reduces the soldering offset rate to below 1%, improving stability.

The invention discloses a multi-layer aluminum core copper-clad plate adopting a plasma oxidation-copper plating process and also discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: carrying out plasma anodic oxidation and copper plating treatment on the surface of an aluminum substrate to obtain a copper-clad plasma anodic aluminum oxide substrate; manufacturing an inner-layer circuit pattern on the surface of the copper-clad plasma anodic aluminum oxide substrate, then overlapping the inner-layer circuit pattern with a copper foil and a prepreg, and carrying out vacuum hot-pressing curing to obtain a multi-layer plate blank embedded with an aluminum core; through holes are formed in the multi-layer plate blank, activation and copper plating treatment are carried out, and interlayer electrical interconnection is achieved; and manufacturing an outer-layer circuit pattern on the surface of the multi-layer plate blank, preparing a solder mask layer on the surface of the circuit, and carrying out nickel plating and gold leaching surface treatment to obtain the multi-layer aluminum core copper-clad plate. According to the method, the problems of weak interlayer binding force, low heat dissipation efficiency, insufficient electrical interconnection reliability and the like of the aluminum core multilayer board are solved, and the prepared copper-clad plate can meet the use requirements of high-frequency and high-power electronic equipment.

The application discloses a lens module and an electronic device. The lens module comprises a holder structure, an opening is arranged on the holder structure, an installation cavity is arranged in the holder structure, and the installation cavity is communicated with the opening; a motor assembly is arranged in the installation cavity, the motor assembly can move relative to the holder structure, and the motor assembly is arranged opposite to the opening; a photosensitive chip is arranged in the installation cavity, and the photosensitive chip is connected to the side of the motor assembly which is away from the opening; and a heat dissipation structure, at least a part of the heat dissipation structure is arranged in the installation cavity, the part of the heat dissipation structure in the installation cavity is arranged on the circumferential side of the photosensitive chip; the part of the heat dissipation structure in the installation cavity is provided with a flow channel, a flowable heat dissipation medium is arranged in the flow channel, and the heat dissipation medium is used for conducting heat to the photosensitive chip. The application reasonably sets the structure of the lens module, can effectively reduce the temperature rise at the photosensitive chip, so that the probability of the imaging quality decline caused by the junction temperature rise of the photosensitive chip can be reduced.

The invention discloses a 2835 support-based flip chip LED packaging structure, which comprises a support body and an LED flip chip, a cavity is arranged in the support body, the bottom of the cavity is connected with a centrally arranged metal electrode, the LED flip chip is arranged in the cavity, the LED flip chip is connected with the metal electrode, a white glue layer is filled between the LED flip chip and the cavity, and the bottom of the cavity is connected with the metal electrode. A packaging layer is arranged above the white glue layer in the cavity; the invention further discloses an implementation method of the flip chip LED packaging structure based on the 2835 support. The LED flip chip is directly connected to the metal electrode through the eutectic bonding or solder paste sintering process, the PN electrode of the LED flip chip makes contact with the positive electrode and the negative electrode of the support body, no gold wire is needed for electrical connection, and therefore shielding and absorption of the gold wire to emergent light are thoroughly eliminated, and the light extraction efficiency is improved.

The application discloses a kind of micro electronic systems and integrated method. Specifically related to the field of semiconductor three-dimensional integrated packaging technology, the method comprises the following steps: S1, provide a semiconductor substrate, the semiconductor substrate surface is equipped with first linear strip I / O pin solder pad array and second linear strip I / O pin solder pad array;S2, provide a memory stack core particle, the memory stack core particle surface is equipped with third linear strip I / O pin solder pad array with the first linear strip I / O pin solder pad array is oppositely arranged;S3, provide a logic processor core particle, the logic processor core particle surface is equipped with fourth linear strip I / O pin solder pad array with the second linear strip I / O pin solder pad array is oppositely arranged.The application will be mechanically fixed and electrically decoupled, with low parasitic capacitance, good heat dissipation, easy repair, small stress, simple process, compatible high bandwidth memory and graphic processor thickness gap and other advantages.

This invention proposes a monolithically integrated microwave radiation system based on an optically triggered switch and its fabrication method, belonging to the field of high-power microwave technology. The system includes a driver wafer and a device wafer bonded together. The device wafer uses cubic boron nitride or hexagonal boron nitride as a substrate, on which a heterojunction optically triggered switch, a monolithic microwave integrated circuit, and a monitoring and protection module are integrated. The optically triggered switch is vertically integrated on the side of the monolithic microwave integrated circuit. Under the excitation of the optical pulse output from the driver wafer, it generates an electrical trigger signal, which is amplified by the monolithic microwave integrated circuit and outputs a microwave signal. This invention, through the synergistic design of an ultra-wide bandgap semiconductor substrate, a two-dimensional material heterojunction, three-dimensional integration technology, and full-dimensional on-chip monitoring, achieves chip integration from optical triggering, microwave amplification to intelligent protection on a nitride-based substrate, significantly improving power density, response speed, operating frequency, and reliability.

The application relates to a carrier frequency control method and device of a motor controller, electronic equipment and a storage medium, wherein the carrier frequency control method of the motor controller comprises the following steps: acquiring state information of a target vehicle; determining a carrier frequency control mode based on a driving mode of the target vehicle, and adjusting a carrier frequency of a motor controller of the target vehicle based on the carrier frequency control mode and driving parameters of the target vehicle; reducing the carrier frequency of the motor controller based on the driving parameters of the target vehicle, obtaining a corrected carrier frequency, and outputting the corrected carrier frequency. The application can adjust and correct the carrier frequency of the motor controller, so as to reduce the junction temperature of the motor controller, and then improve the continuous working capacity of the motor controller, so that the off-road passability of the vehicle is improved by improving the continuous working capacity of the motor controller. Compared with the prior art, the application has the advantages of not changing hardware and not increasing cost.