5results about How to "Lower junction temperature" patented technology

The invention discloses a half-bridge power module packaging optimization method, and belongs to the technical field of power module packaging, and the method comprises the steps: S1, analyzing the thermodynamic performance of a power module; s2, establishing a two-dimensional power module finite element model; s3, based on finite element simulation, researching the influence of temperature on the service life and stress strain of the module; s4, based on finite element simulation, obtaining the thermal resistance value of each layer of material and the ratio of the thermal resistance value to the total thermal resistance value; s5, analyzing the relationship between the packaging parameters and the thermal impedance, and giving an optimization direction from the packaging level by integrating the temperature and the stress; and S6, establishing a thermal network model, extracting junction temperature through electrothermal coupling, and verifying life increase. By the adoption of the half-bridge power module packaging optimization method, the size of the module can be reduced, temperature resistance and stability can be enhanced, the problem of multi-physics field coupling can be solved, internal thermal impedance and stress strain can be remarkably reduced, thermal performance can be improved, and the service life of the power module can be effectively prolonged through verification of the working condition of a photovoltaic inverter.

This application relates to a vertical pin LED chip holder, comprising a substrate. The top of the substrate has multiple evenly arranged supports. Each support includes two horizontal pins arranged parallel to each other vertically and a vertically bent pin at the right end of each horizontal pin. The tops of the two vertical pins are provided with solder pads. A first support rib connected to the substrate is located at the right end of one of the horizontal pins closest to the substrate, and a second support rib connected to the substrate is located at the left end of the two horizontal pins. This invention belongs to the field of LED light-emitting diode technology. It features a robust structure, is not easily deformed, and the vertical pin and double support rib design reduces the soldering offset rate to below 1%, improving stability.

The application discloses a lens module and an electronic device. The lens module comprises a holder structure, an opening is arranged on the holder structure, an installation cavity is arranged in the holder structure, and the installation cavity is communicated with the opening; a motor assembly is arranged in the installation cavity, the motor assembly can move relative to the holder structure, and the motor assembly is arranged opposite to the opening; a photosensitive chip is arranged in the installation cavity, and the photosensitive chip is connected to the side of the motor assembly which is away from the opening; and a heat dissipation structure, at least a part of the heat dissipation structure is arranged in the installation cavity, the part of the heat dissipation structure in the installation cavity is arranged on the circumferential side of the photosensitive chip; the part of the heat dissipation structure in the installation cavity is provided with a flow channel, a flowable heat dissipation medium is arranged in the flow channel, and the heat dissipation medium is used for conducting heat to the photosensitive chip. The application reasonably sets the structure of the lens module, can effectively reduce the temperature rise at the photosensitive chip, so that the probability of the imaging quality decline caused by the junction temperature rise of the photosensitive chip can be reduced.

This invention proposes a monolithically integrated microwave radiation system based on an optically triggered switch and its fabrication method, belonging to the field of high-power microwave technology. The system includes a driver wafer and a device wafer bonded together. The device wafer uses cubic boron nitride or hexagonal boron nitride as a substrate, on which a heterojunction optically triggered switch, a monolithic microwave integrated circuit, and a monitoring and protection module are integrated. The optically triggered switch is vertically integrated on the side of the monolithic microwave integrated circuit. Under the excitation of the optical pulse output from the driver wafer, it generates an electrical trigger signal, which is amplified by the monolithic microwave integrated circuit and outputs a microwave signal. This invention, through the synergistic design of an ultra-wide bandgap semiconductor substrate, a two-dimensional material heterojunction, three-dimensional integration technology, and full-dimensional on-chip monitoring, achieves chip integration from optical triggering, microwave amplification to intelligent protection on a nitride-based substrate, significantly improving power density, response speed, operating frequency, and reliability.

The application relates to a carrier frequency control method and device of a motor controller, electronic equipment and a storage medium, wherein the carrier frequency control method of the motor controller comprises the following steps: acquiring state information of a target vehicle; determining a carrier frequency control mode based on a driving mode of the target vehicle, and adjusting a carrier frequency of a motor controller of the target vehicle based on the carrier frequency control mode and driving parameters of the target vehicle; reducing the carrier frequency of the motor controller based on the driving parameters of the target vehicle, obtaining a corrected carrier frequency, and outputting the corrected carrier frequency. The application can adjust and correct the carrier frequency of the motor controller, so as to reduce the junction temperature of the motor controller, and then improve the continuous working capacity of the motor controller, so that the off-road passability of the vehicle is improved by improving the continuous working capacity of the motor controller. Compared with the prior art, the application has the advantages of not changing hardware and not increasing cost.