High power LED source for heat conduction by using room temperature liquid metal

A technology of LED light source and liquid metal, applied in the field of lighting light source, can solve the problems of affecting the heat dissipation and long-term stability of the device, easy aging, and small thermal conductivity, so as to improve the thermal conductivity, avoid stress and deformation problems, and increase the contact area. Effect

Active Publication Date: 2010-03-10
SHANGHAI CEYUAN IND
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these materials have very small thermal conductivity and are prone to

Method used

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  • High power LED source for heat conduction by using room temperature liquid metal
  • High power LED source for heat conduction by using room temperature liquid metal
  • High power LED source for heat conduction by using room temperature liquid metal

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Experimental program
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Embodiment Construction

[0020] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0021] Such as figure 1 As shown, the high-power LED light source using room temperature liquid metal heat conduction includes LED chip 1, concave packaging substrate 2, room temperature liquid metal layer 3, sealing layer 4, heat sink 5, fluorescent glue layer 6; LED chip 1 is installed in the concave shape On the packaging substrate 2, the concave packaging substrate 2 is provided with an optical reflective surface 8, the LED chip 1 is covered with a fluorescent glue layer 6, the concave packaging substrate 2 is installed on the radiator 5, and the concave packaging substrate 2 and the radiator 5 There are gaps between them, which are sealed by the sealing layer 4, and the gaps are filled with the room temperature liquid metal layer 3. The room temperature liquid metal layer 3 is a metal or alloy that is liquid below 100 degrees Celsius, an...

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Abstract

The invention discloses a high power LED source for heat conduction by using a room temperature liquid metal, which comprises an LED chip, a concave package substrate, a room temperature liquid metallayer, a sealing layer, a radiator and a fluorescent adhesive layer. The LED chip is mounted on the concave package substrate, and an optical reflection surface is arranged on the concave package substrate. The fluorescent adhesive layer is covered on the LED chip and the concave package substrate is mounted on the radiator. A gap is arranged between the concave package substrate and the radiatorand is sealed by the sealing layer, and the gap is filled with the room temperature liquid metal layer. The method effectively solves the problem of the thermal contact resistance between the high power LED package substrate and the radiator by using the high heat conductivity of the room temperature liquid metal, thereby achieving a better heat conduction effect; and the heat generated by the LEDchip is transferred, and the junction temperature of the LED chip is kept at a low level, thereby improving the operation reliability of the high power LED and prolonging the service life thereof.

Description

technical field [0001] The invention relates to an illumination light source, in particular to a high-power LED light source utilizing room temperature liquid metal for heat conduction. Background technique [0002] LED light source is a new generation of green lighting source. Its power consumption is only one tenth of that of ordinary incandescent lamps, but its life is more than ten times longer. In addition, LED light sources also have the advantages of small size, durability, and rich colors. In order to meet the requirements of higher light intensity, the LED light source is realized by increasing the output power of a single chip or using an LED array. Under ideal conditions, matching optical materials and appropriate packaging structures can give full play to the efficient light-emitting performance of LEDs and convert most of the electrical energy into light. However, due to the very small area of ​​the LED chip, a large amount of heat cannot be dissipated in time...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V7/00F21V9/10F21V29/00H01L23/373F21Y101/02F21K9/20F21V9/40F21V19/00F21V29/508F21V29/56F21V29/71F21V29/76F21V29/89F21Y105/18F21Y115/10
Inventor 符建
Owner SHANGHAI CEYUAN IND
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