749results about How to "Avoid insufficient thickness" patented technology

A process for trimming a photoresist layer during the fabrication of a gate electrode in a MOSFET is described. A bilayer stack with a top photoresist layer on a thicker organic underlayer is patternwise exposed with 193 nm or 157 nm radiation to form a feature having a width w1 in the top layer. A pattern transfer through the underlayer is performed with an anisotropic etch based on H2 / N2 and SO2 chemistry. The feature formed in the bilayer stack is trimmed by 10 nm or more to a width w2 by a HBr / O2 / Cl2 plasma etch. The pattern transfer through an underlying gate layer is performed with a third etch based on HBr / O2 / Cl2 chemistry. The underlayer is stripped by an O2 ashing with no damage to the gate electrode. Excellent profile control of the gate electrode is achieved and a larger (w1−w2) is possible than in prior art methods.

Systems and methods for reducing a surface roughness of a polycrystalline or single crystal thin film produced by the sequential lateral solidification process are disclosed. In one arrangement, the system includes an excimer laser (110) for generating a plurality of excimer laser pulses of a predetermined fluence, an energy density modulator (120) for controllably modulating the fluence of the excimer laser pulses such that the fluence is below that which is required to completely melt the thin film, a beam homoginizer (144) for homoginizing modulated laser pulses in a predetermined plane, a sample stage (170) for receiving homoginized laser pulses to effect melting of portions of the polycrystalline or single crystal thin film corresponding to the laser pulses, translating means for controllably translating a relative position of the sample stage (170) with respect to the laser pulses, and a computer (110) for coordinating the excimer pulse generation and fluence modulation with the relative positions of the sample stage (170) to thereby process the polycrystalline or single crystal thin film by sequential translation of the sample stage (170) relative to the laser pulses.

An internal connection dental implant and implant assembly in which the implant includes a lobed configuration for installing the implant and a beveled surface positioned on the proximal side of the lobed configuration for providing stability between the implant and a corresponding abutment.

An LED apparatus including (a) a mounting board, (b) a plurality of LED packages thereon, (c) a lens member over each LED package, and (d) a safety barrier positioned over the mounting board, the barrier having sufficient thickness for enclosure of electrical elements on the mounting board and including a plurality of openings each sized to permit light from an LED package to pass therethrough and through a light-transmission portion of the lens member over such LED package to prevent finger-contact of electrical elements on the mounting board when the light-transmission portion is not present.

This invention relates to a briefcase or carrying case for a mobile office, holding a number of interconnected electronic devices (laptop computer, printer, and the like) which may be opened up for immediate use of the devices. A rectangular rigid frame comprises the foundation and ancillary items are fastened to the frame. An enclosing cover having a zipper is also attached to the frame. Shock-absorbing foam and straps are included. An optional wheeled caddie can support the frame using coupling blocks on each side of the frame.When in use, the laptop extends forward from the frame in a low flat position. The printer, held on a second hinged tray, is flipped backwards by 270 degrees over the top of the frame, so that the weight of the printer and the weight of the laptop tend to counterbalance each other and the carrying case is stable.