30results about How to "Short heat conduction path" patented technology

The invention relates to an electric heating floor and a paving method thereof, belonging to the technical field of building decorative materials. The electric heating floor comprises a floor body, wherein the floor body is internally provided with a plurality of through holes penetrating through two ends of the floor body, the through holes are parallel mutually, each through hole is internally provided with a strip electric heating element extending along the length direction of the through holes, the outer surface of the electric heating element is in contact with the inner wall of the through hole, and the electric heating elements in the through holes are mutually connected in series or in parallel. The invention has the advantages of short heat conduction path and higher heat conduction efficiency, and solves the problems of longer heat conduction path, lower heat conduction efficiency, difficulty of rapidly transmitting the heat to the floor surface, and the like; and the heat can be rapidly transmitted to the floor surface.

The invention discloses a compression joint-type electric vehicle controller for a double-row power tube leaf spring. The compression joint-type electric vehicle controller comprises a hollow shell in the middle, and a front baffle and a rear baffle at two ends, wherein a front sealing gasket and a rear sealing gasket are arranged between the front baffle and the shell, and between the rear baffle and the shell, and eighteen power tubes welding on a circuit board, function lines, power lines and a leaf spring for in compression joint with the power tubes are contained inside the controller. The compression joint-type electric vehicle controller is characterized in that the bottom of the hollow shell is arch-shaped, and strip-shaped heat dissipation teeth are distributed on the outer surface of the shell; two rows of salient points are arranged on each heat dissipation tooth; twelve small holes are respectively formed in the front baffle and the rear baffle; the leaf spring is provided with twenty-two pins; the eighteen power tubes welded on the circuit board are divided into two rows and are uniformly distributed on two sides of the circuit board; the eighteen power tubes pass through the bottom of the shell by adopting compression joint screws; the leaf spring is in compression joint, so that the leaf spring deforms to generate elastic force. The elastic force is applied to the power tube bodies through the pins on the leaf spring, so that the power tubes are tightly attached to the inner surface of the shell, the heat conduction path is the shortest, and the timeliness and the effectiveness of heat conduction are guaranteed.

The invention relates to a decorative panel connection structure, which belongs to the technical field of building decoration materials. To provide a veneer with seaming edges, in particular a parquet floor with a square surface, especially a parquet geothermal floor with a heat-conducting medium and a heating body inside it, designed so that adjacent veneers are joined not only by tenons The groove structures are engaged with each other to form a locking connection, and at the same time, the common coupling connection of adjacent veneer panels is realized through independent coupling elements. It is characterized in that the veneer is easy to install and realizes all-round locking between adjacent veneers.

The invention provides a heating and cooling type seat. The heating and cooling type seat can improve the ride comfort of a seat and can improve heat transmission efficiency of heat conduction from a Peltier element to a seating surface. The heating and cooling type seat (10) heats or cools a heat cushion (11) through the Peltier element (32) and a heat conduction part (34) combined with the Peltier element. The Peltier element (32) is disposed in a scope that a person can seat on the seat cushion after looking down, and is located on the opposite side of the seating surface (11a) relative to the seat cushion. The heat conduction part is a flexible part, and extends from the Peltier element to the seating surface in the scope that the person can seat on the seat cushion after looking down.

The invention discloses an integrated LED element with an epitaxial structure integrated with a packaging substrate and a manufacturing method. An LED element is formed by directly forming an LED epitaxial structure, electrodes, wires, etc. on a substrate to become an independent integrated LED element. . The LED element is a polycrystalline module structure, and can also be a single crystal structure. The LED element can be embedded in a bare empty carrier body, and through the support of the bare empty carrier body, the lower surface of the substrate of the LED element can be directly placed and contacted on a heat conduction or heat dissipation element. The LED element is directly fabricated on the wafer and cut into an independent element. The structure of the LED element can be a vertical structure or a horizontal structure according to different manufacturing methods.

The invention relates to a semiconductor light-emitting chip and a lamp using the chip. The chip includes a substrate having a first surface and a second surface, on the first surface of the substrate there is a semiconductor stack including at least an n-type conductive layer, a light-emitting layer and a p-type conductive layer, and on the semiconductor stack The surface has at least one n-type electrode step and / or n-type electrode through hole exposing a part of the n-type conductive layer, and all exposed and conductive surfaces and sides of the semiconductor light emitting chip are wrapped by at least one insulating layer; The surface of the insulating layer is provided with exposed at least one p-type electrode and at least one n-type electrode; the p-type electrode and the n-type electrode are insulated from each other, and penetrate through the insulating layer and the p-type conductive layer and the n-type electrode respectively. The conductive layer is electrically connected. Its structure allows the semiconductor light-emitting chip to be directly welded to the lamp board, lamp bar, lamp post, or LED bracket, or COB substrate used to prepare various lamps or light sources by reflow soldering process, which has the advantages of simple structure and low manufacturing cost .

The invention relates to a composite veneer belonging to the technical field of architectural decoration materials. The composite veneer comprises a composite veneer body. The composite veneer is characterized in that the inside of the composite veneer body is provided with a plurality of heat-conducting media which extend along the length direction of the composite veneer body and have a strip-shaped structure, wherein the insides of the bodies of the heat-conducting media are provided with a plurality of first through holes which extend along the length directions of the bodies of the heat-conducting media. Preferably, the insides of the first through holes are provided with heating elements which have a strip-shaped structure, the material of the composite veneer body is a plastic-woodcomposite material (or called wood plastics and WPC) or a stone-plastic composite material, and the composite veneer body is formed by a mould through injection molding or extrusion molding. The invention organically combines an entire floor heating system and a floor together and has convenient assembly and maintenance.

The invention discloses a refrigerant radiator, an assembly design method and air conditioning equipment. The refrigerant radiator comprises a cold plate, wherein the cold plate is arranged in a mode of being stacked with a heating module, and a groove is formed in the surface of the side, which is away from the heating module, of the cold plate and used for containing a refrigerant pipe; the cold plate is used for soaking the heat emitted by the heating module; and the refrigerant pipe is embedded into the groove of the cold plate and comprises an inflow section, a bent section and an outflow section, and the outflow section corresponds to a main heating area of the heating module in position and exchanges heat with the main heating area. According to the invention, the heat conduction path of the main heating area and the refrigerant pipe can be shortest, the heat exchange effect is improved, and the heat dissipation efficiency is further improved.

The invention provides a semiconductor microcavity laser structure and a preparation method thereof. The microcavity laser is prepared on the nitrogen surface of the nitride semiconductor, and the p-type ohmic contact of the (0001) gallium surface adopts the whole-surface contact method, which greatly reduces the cost of the microcavity laser. The series resistance of the microcavity laser; the heat of the microcavity laser is directly conducted to the heat sink with high thermal conductivity, and the microcavity laser is prepared on the nitrogen surface, and the side wall of the microcavity laser is fabricated by wet etching, which can greatly improve the stability of the microcavity laser properties, using AlInGaN, ITO, AZO, IGZO, porous GaN, Ag, Al, ZnO, MgO, Si, SiO 2 , SiNx, TiO 2 , ZrO 2 , AlN, Al 2 o 3 、 Ta 2 o 5 , HfO 2 , HfSiO 4 , AlON material is used as the optical confinement layer of the microcavity laser to provide strong optical confinement. The novel nitride semiconductor microcavity laser structure proposed by the present invention has the advantages of small resistance, low thermal resistance, easy implementation of electric injection, good stability and reliability, etc., and can greatly enhance the performance and service life of the nitride semiconductor microcavity laser.

The invention provides a heating / cooling seat, aiming to enhance the seating comfort of a seat, and to enhance heat conductivity for conducting heat to a seated face from a Peltier element. The heating / cooling seat 10 heats or cools a seat cushion 11 by using a Peltier element 32 and a heat conductive member 34 connected to the Peltier element. The Peltier element 32 is arranged within a plane-view seatable range 11b of the seat cushion, and located at a side opposite to a seating face 11a with respect to the seat cushion. The heat conductive member is a flexible member, passes through the plane-view seatable range in the seat cushion from the Peltier element, and extends toward the seating face.

The invention discloses an electromobile controller with two rows of power tubes. The electromobile controller is composed of a plastic cover cap, a sealing strip, screws, pressing plates, rubber strips, eighteen power tubes welded on a circuit board, two sets of functional plugs welded on the circuit board, and an aluminum-cast heat-dissipating shell. The electromobile controller is characterized in that the controller is of an upper-lower structure, the plastic cover cap is arranged on the upper side, the aluminum-cast heat-dissipating shell is arranged on the lower side, the sealing strip is arranged between the plastic cover cap and the aluminum-cast heat-dissipating shell, and the power tubes and the functional plugs both welded on the circuit board are contained inside the controller. The electromobile controller has the advantages that the power tubes welded on the circuit board are compressed by the pressing plates and the rubber strips to be directly and closely fit with the plane of the aluminum-cast heat-dissipating shell for heat dissipation, and a heat conduction path is shortest, so that timeliness and effectiveness of heat conduction are guaranteed; after compressing the sealing strip, the plastic cover cap is in buckling connection with the aluminum-cast heat-dissipating shell, so that sealing performance of the controller is effectively guaranteed.

The invention relates to a dry-type paved geothermal floor board which belongs to the technical field of building decorative materials. The dry-type paved geothermal floor board comprises a substrate, wherein the upper surface of the substrate is provided with a decorative surface layer; the two sides of the substrate are provided with locks that can be matched with adjacent substrates respectively; an upward-concave groove is formed on the lower surface of the substrate; the groove comprises two side parts and an upper bottom part between the two side parts; a heat conducting medium layer isattached to the surface of the groove, and at least covers the upper bottom of the groove; a heat insulation module in contact with the ground is arranged below the substrate; an upward-protruding boss is formed on the upper surface of the heat insulation module; the shape of the boss is matched with the shape of the groove on the lower surface of the substrate; and a heating body in heat-conducting contact with the heat conducting medium layer is arranged between the heat insulation module and the heat conducting medium layer. The surface of the floor board is uniformly heated, the heat conducting path is relatively short, the heat efficiency is relatively high, and the entire pavement thickness is relatively small.

The invention relates to a light-emitting diode spotlight, which comprises a main casing, a driver, a cover body, a lamp holder, a light-emitting diode substrate and a lampshade. The housing has an accommodating portion and an opening, the driver is arranged in the accommodating portion, and the cover covers the opening. The casing is provided with a plurality of arms, and the lamp holder is supported on the plurality of arms. The lamp holder has a heat dissipation surface, and the LED substrate is arranged on the heat dissipation surface of the lamp holder. The lampshade covers the lamp holder and is located on the light emitting surface of the LED substrate. The distance between the lamp holder and the cover body is 20%-50% of the height of the LED spotlight.