Semiconductor light-emitting chip, semiconductor lighting fixture and manufacturing method thereof

Abstract

The invention relates to a semiconductor light-emitting chip and a lamp using the chip. The chip includes a substrate having a first surface and a second surface, on the first surface of the substrate there is a semiconductor stack including at least an n-type conductive layer, a light-emitting layer and a p-type conductive layer, and on the semiconductor stack The surface has at least one n-type electrode step and / or n-type electrode through hole exposing a part of the n-type conductive layer, and all exposed and conductive surfaces and sides of the semiconductor light emitting chip are wrapped by at least one insulating layer; The surface of the insulating layer is provided with exposed at least one p-type electrode and at least one n-type electrode; the p-type electrode and the n-type electrode are insulated from each other, and penetrate through the insulating layer and the p-type conductive layer and the n-type electrode respectively. The conductive layer is electrically connected. Its structure allows the semiconductor light-emitting chip to be directly welded to the lamp board, lamp bar, lamp post, or LED bracket, or COB substrate used to prepare various lamps or light sources by reflow soldering process, which has the advantages of simple structure and low manufacturing cost .

Description

technical field [0001] The present invention relates to a semiconductor light emitting chip, and further relates to a semiconductor light emitting chip structure suitable for reflow soldering. Background technique [0002] With the improvement of luminous efficiency and the reduction of manufacturing cost of semiconductor light-emitting chips, semiconductor light-emitting chips have been widely used in fields such as backlight, display and lighting. [0003] A common semiconductor light-emitting chip structure such as figure 1 As shown, it includes a sapphire substrate 11, an n-type conductive layer 12, a light-emitting layer 13, a p-type conductive layer 14, an n-type electrode 15, a p-type electrode 16, conductive lines 19a, 19b, an insulating layer 110, pads 121a, 121b , LED bracket 120, crystal bonding adhesive 120a. In order to reduce the shading effect and increase the effective light-emitting area, the size of the electrodes 15 and 16 is reduced as much as possible,...

AI Technical Summary

Problems solved by technology

Repeating the fixation three times not only wastes a lot of raw materials and increases the weight of the lamp, but also adds many insignificant process links and production equipment, which makes the comprehensive manufacturing cost of the lamp high.

Poor heat dissipation will cause the light-emitting chip 380 to decay faster and shorten the service life of the whole lamp

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