Dry-type paved geothermal floor board

A geothermal floor, dry-type technology, applied in the field of building decoration materials, can solve the problems of short heat conduction path, long heat conduction path, low thermal efficiency, etc., and achieve the effect of short heat conduction path, uniform heating and high thermal efficiency

Inactive Publication Date: 2012-11-07
杭州暖捷环境科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a dry pavement geothermal floor with uniform heating everywhere on the floor surface, short heat conduction path, high thermal efficiency and small overall pavement thickness, which solves the problem of uneven heating on the floor surface existing in the prior art. Uniformity, long heat conduction path, low thermal efficiency, etc.

Method used

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  • Dry-type paved geothermal floor board
  • Dry-type paved geothermal floor board
  • Dry-type paved geothermal floor board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: as figure 1 As shown, the upper surface of the substrate 1 is provided with a decorative surface layer 2, the decorative surface layer 2 is a thin plate attached to the substrate, and both sides of the substrate 1 are respectively provided with locks 3 that can cooperate with adjacent substrates, as shown in FIG. figure 2 As shown, the lower surface of the substrate 1 is formed with an upward concave groove 4, the depth of the groove is 1 / 2 of the thickness of the substrate, the groove 4 includes two sides 41 and between the two sides 41 and with the substrate 1 The upper surface is parallel to the upper bottom 42, and the two sides 41 are inclined downward and outward from the two sides of the upper bottom 42. The surface of the groove 4 is attached with an upper heat conduction medium layer 5 made of aluminum alloy material, and the upper heat conduction Dielectric layer 5 covers the surface of upper bottom 42 and both sides 41, such as figure 1 As sho...

Embodiment 2

[0024] Embodiment 2: as image 3 As shown, the upper surface of the substrate 1 is provided with a decorative surface layer 2, the decorative surface layer 2 is a thin plate attached to the substrate, and both sides of the substrate 1 are respectively provided with locks 3 that can cooperate with adjacent substrates, as shown in FIG. Figure 4 As shown, the lower surface of the substrate 1 is formed with an upward concave groove 4, the depth of the groove is 1 / 2 of the thickness of the substrate, the groove 4 includes two sides 41 and between the two sides 41 and with the substrate 1 The upper surface is parallel to the upper bottom 42, and the two sides 41 are inclined downward and outward from the two sides of the upper bottom 42. The surface of the groove 4 is attached with a heat-conducting medium layer 15 made of aluminum alloy material. The upper heat-conducting medium Layer 15 covers the surfaces of the upper bottom 42 and the two sides 41, such as image 3 As shown, t...

Embodiment 3

[0026] Embodiment 3: as Figure 5 As shown, the upper surface of the substrate 1 is provided with a decorative surface layer 2, the decorative surface layer 2 is a thin plate attached to the substrate, and both sides of the substrate 1 are respectively provided with locks 3 that can cooperate with adjacent substrates, as shown in FIG. figure 2 As shown, the lower surface of the substrate 1 is formed with an upward concave groove 4, the depth of the groove is 1 / 2 of the thickness of the substrate, and the groove 4 includes two sides and is located between the two sides and is connected to the upper surface of the substrate 1. Parallel upper bottom, the two sides are obliquely downward and outward from both sides of the upper bottom, the surface of the groove 4 is attached with a heat conduction medium layer 15 made of aluminum alloy material, and the heat conduction medium layer 15 covers the upper bottom and On both sides of the surface, the bottom of the base plate 1 is prov...

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Abstract

The invention relates to a dry-type paved geothermal floor board which belongs to the technical field of building decorative materials. The dry-type paved geothermal floor board comprises a substrate, wherein the upper surface of the substrate is provided with a decorative surface layer; the two sides of the substrate are provided with locks that can be matched with adjacent substrates respectively; an upward-concave groove is formed on the lower surface of the substrate; the groove comprises two side parts and an upper bottom part between the two side parts; a heat conducting medium layer isattached to the surface of the groove, and at least covers the upper bottom of the groove; a heat insulation module in contact with the ground is arranged below the substrate; an upward-protruding boss is formed on the upper surface of the heat insulation module; the shape of the boss is matched with the shape of the groove on the lower surface of the substrate; and a heating body in heat-conducting contact with the heat conducting medium layer is arranged between the heat insulation module and the heat conducting medium layer. The surface of the floor board is uniformly heated, the heat conducting path is relatively short, the heat efficiency is relatively high, and the entire pavement thickness is relatively small.

Description

technical field [0001] The invention relates to a dry paving geothermal floor, which belongs to the technical field of building decoration materials. Background technique [0002] In the prior art, the heat conduction medium or heating element of the geothermal floor is set separately from the floor, or laid on the ground or installed inside other components such as the bottom plate between the ground and the floor. For example, Chinese patent literature discloses a composite geothermal floor [application number: CN 200510040599.2], which solves the problems of low thermal conductivity, large deformation and easy cracking of the surface of the existing geothermal floor. It includes a surface plate, a sub-surface plate, a core plate, and a bottom plate. A horizontal heat conduction groove is arranged in the core plate, and a longitudinal heat conduction groove is arranged in the bottom plate. Filled with heat transfer medium. In the above technical solution, the heat conduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04F15/02E04F15/18
Inventor 李增清李渊
Owner 杭州暖捷环境科技有限公司
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