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Aluminum-based copper-clad plate and manufacturing method thereof, and electronic circuit board

A technology of aluminum-based copper-clad laminates and aluminum substrates, which is applied in the manufacture of printed circuits, electrical components, and printed circuits, can solve problems such as reduced heat dissipation capacity, electrified substrates, and safety issues, and achieve improved heat dissipation performance, improved reliability, low cost effect

Active Publication Date: 2014-11-05
GUANGDONG MIDEA GRP WUHU REFRIGERATING EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the protruding structure is directly connected to the circuit or separated by an insulating layer of a specified thickness. The direct connection will cause the substrate to be electrified and cause safety problems; even if the insulating layer is provided, it needs a sufficient thickness, which also greatly reduces the heat dissipation capacity.

Method used

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  • Aluminum-based copper-clad plate and manufacturing method thereof, and electronic circuit board
  • Aluminum-based copper-clad plate and manufacturing method thereof, and electronic circuit board

Examples

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preparation example Construction

[0025] Correspondingly. The invention also provides a method for preparing an aluminum-based copper-clad laminate with simple procedures and high production efficiency. This method can be used to prepare the above as figure 1 As shown in the aluminum base copper clad laminate, the process of the method is as follows figure 2 As shown, it includes the following steps:

[0026] Step S01. Stamping the surface of the pure aluminum plate to form a protrusion structure 31 on at least one surface of the pure aluminum plate;

[0027] Step S02. Degreasing the surface of the stamped pure aluminum plate, immersing it in a tank filled with an oxidizing solution to oxidize the surface of the pure aluminum plate on both sides to produce an aluminum substrate 6 with double-sided aluminum oxide layers. Specifically, refer to figure 1 The oxidized aluminum substrate 6 includes a first aluminum oxide layer 3 , a pure aluminum layer 4 and a second aluminum oxide layer 5 stacked in sequence,...

Embodiment 1

[0033] An aluminum-based copper-clad laminate for preparing electronic circuit boards and a preparation method thereof.

[0034] The structure of the aluminum base copper clad laminate is as follows figure 1 As shown, it includes a copper foil layer 1, a thermally conductive insulating layer 2, a first aluminum oxide layer 3, a pure aluminum layer 4, and a second aluminum oxide layer 5 arranged in sequence; wherein, the first aluminum oxide layer 3 and the thermally conductive insulating layer 2 The contact side has a protruding structure 31, and the height of the protruding structure 31 is 5 μm.

[0035] The preparation method of the above-mentioned aluminum-based copper-clad laminate is as follows:

[0036] (1) Stamping the surface of the 1100 series pure aluminum plate to form a protruding structure 31 on one of the surfaces;

[0037] (2), degreasing the surface of the stamped 1100 series pure aluminum plate, immersing it in a tank filled with an oxidizing solution to oxi...

Embodiment 2

[0040] An aluminum-based copper-clad laminate for preparing electronic circuit boards and a preparation method thereof.

[0041] The structure of the aluminum-based copper-clad laminate is the same as that of the aluminum-based copper-clad laminate in Embodiment 1. The differences are as follows: 1. The pure aluminum plate adopts 5052 series; 2. The height of the protruding structure 31 on the first alumina layer 3 is 10 μm; 3. The thermal conductivity of the thermally conductive insulating layer 2 is 3W / mK.

[0042] Refer to Example 1 for the preparation method of the above-mentioned aluminum-based copper-clad laminate.

[0043] In addition, an electronic circuit board comprising the above-mentioned aluminum-based copper-clad laminate is also provided.

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Abstract

The invention relates to an aluminum-based copper-clad plate and a manufacturing method thereof. The aluminum-based copper-clad plate in order comprises a copper foil layer, a heat conduction insulating layer, a first aluminum oxide layer, a pure aluminum layer and a second aluminum oxide layer, wherein a protruding structure is arranged at the surface, which is contacted with the heat conduction insulating layer, of the first aluminum oxide layer. An oxidized protruding structure is formed at the surface of the aluminum substrate in the aluminum-based copper-clad plate, of which the thermal conductivity is far larger than that of the heat conductivity insulating layer. By arranging the protruding structure, the distance between the copper foil layer and the aluminum substrate is shortened, the contact area is enlarged, and thus, the heat resistance is lowered efficiently. In the meantime, the protruding structure on the aluminum oxide layer has excellent natural insulation and jointly provides excellent insulation for the electronic circuit board with the heat conduction insulating layer. Under the same requirements for insulation, the heat resistance is lowered largely, and thus, the power electronic devices have longer service life and higher reliability.

Description

technical field [0001] The invention relates to the technical field of metal-based copper-clad laminates, in particular to an aluminum-based copper-clad laminate, a preparation method thereof, and a circuit electronic circuit board. Background technique [0002] With the development of electronic technology, the design of electronic components is becoming more and more miniaturized, and the circuit is becoming more and more refined. Therefore, it is necessary to meet the requirements of good circuit design flexibility and heat dissipation characteristics. Metal-based copper-clad laminates carrying electronic components have been widely used in LEDs, intelligent power modules, and power supplies due to their excellent heat dissipation, insulation performance, flexible circuit design, and excellent processing characteristics. [0003] Metal-based copper-clad laminates are composed of a three-layer structure of metal substrate, insulating layer, and copper foil. Among them, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 王新雷
Owner GUANGDONG MIDEA GRP WUHU REFRIGERATING EQUIP CO LTD
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