Disclosed is a wiring board which comprises: conducting plates (21, 22, 121, 122, 131, 132, 141, 142, 151, 152, 161, 162, 171, 172, 181, 182, 191, 192, 201, 202, 211, 212, 221, 222, 231, 232) including electrode parts (21a, 22a, 139b, 139c, 139d) which are connected to semiconductor elements (11, 311, 312) for power conversion, and wiring parts (21b, 22b, 131b, 132b, 139a); liquid cooling pipes (31, 32) which are disposed in the region of the conducting plates and are supplied with a liquid (33) for internal cooling; and an insulating resin material (51) which is disposed at least between the conducting plates and the liquid cooling pipes.