Polymer-based insulation thermal conduction composite and preparing method thereof

Abstract

The invention discloses a polymer-based insulation thermal conduction composite. The composite is a composite which is of a particular double-percolation structure and formed through alternative arranging of a polymer-based / conductive thermal conduction filler premixed object, 2(n+1) conductive thermal conduction layers formed through molten plasticizing and n-time layered overlapping of polymer-based / insulation thermal conduction filler premixed objects, and an insulation thermal conduction layer or a composite which is formed through alternative arranging of 2(n+1)+1 conductive thermal conduction layers and an insulation thermal conduction layer. The outmost end of the material is the insulation thermal conduction layer. The invention further provides a preparing method of the composite.In the composite, polymer and filler do not need to be particularly treated, the preparing method is simple in process, operation and control are convenient, production efficiency is high, productioncost is low, and the wide industrialization and market prospects are achieved.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a polymer-based insulating and heat-conducting composite material and a preparation method thereof. Background technique [0002] At present, with the integration, high speed and high frequency of electronic components, the phenomenon of local heat generation is particularly serious, which will not only reduce their working efficiency, but also shorten their service life exponentially. Therefore, in order to solve this problem, many scholars have devoted themselves to the development of new high-efficiency thermal conductive composite materials. Among them, polymer-based materials have attracted extensive attention due to their light weight, corrosion resistance, and low cost. In consideration of the operational safety of electronic components, high insulation requirements are put forward for thermally conductive composite materials, because when thermally conductive...

AI Technical Summary

Problems solved by technology

However, the processing process of this method is cumbersome, and the directional distribution area of ​​the filler is not controllable, but in a random state, which makes the overall performance of the material deviate greatly and the performance is single, so it is difficult to be popularized.