Polymer-based insulation thermal conduction composite and preparing method thereof

A technology of insulating and heat-conducting composite materials, applied in the direction of layered products, etc., can solve the problems of uncontrollable directional distribution area of ​​fillers, large deviation of the overall performance of materials, cumbersome processing process, etc. Easy-to-control effects

Inactive Publication Date: 2019-07-16
周琪
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the processing process of this method is cumbersome, and the directional distribution area of ​​the filler is not controllable, but in a random state, which makes the overall performance of the material deviate greatly and the performance is single, so it is difficult to be popularized.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0023] The polymer-based insulating and heat-conducting composite material of the present invention is formed by melting and plasticizing the following polymer-based / conductive and heat-conducting filler premix and polymer-based / insulating and heat-conducting filler premix, and stacking n times of layers A composite material with a special dual-infiltration structure in which 2 (n+1) layers of conductive and heat-conducting layers and insulating and heat-conducting layers are alternately arranged or a composite of 2 (n+1)+1 layers of conductive and heat-conducting layers and insulating and heat-conducting layers alternately arranged material, wherein the outermost end of the material is an insulating and heat-conducting layer.

[0024] The selected high molecular polymer can be one or two kinds of thermoplastics such as polyolefins, polyamides, polyesters and polyethers.

[0025] The selected conductive and thermally conductive fillers may be one or more of graphite, carbon bl...

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PUM

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Abstract

The invention discloses a polymer-based insulation thermal conduction composite. The composite is a composite which is of a particular double-percolation structure and formed through alternative arranging of a polymer-based/conductive thermal conduction filler premixed object, 2(n+1) conductive thermal conduction layers formed through molten plasticizing and n-time layered overlapping of polymer-based/insulation thermal conduction filler premixed objects, and an insulation thermal conduction layer or a composite which is formed through alternative arranging of 2(n+1)+1 conductive thermal conduction layers and an insulation thermal conduction layer. The outmost end of the material is the insulation thermal conduction layer. The invention further provides a preparing method of the composite.In the composite, polymer and filler do not need to be particularly treated, the preparing method is simple in process, operation and control are convenient, production efficiency is high, productioncost is low, and the wide industrialization and market prospects are achieved.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a polymer-based insulating and heat-conducting composite material and a preparation method thereof. Background technique [0002] At present, with the integration, high speed and high frequency of electronic components, the phenomenon of local heat generation is particularly serious, which will not only reduce their working efficiency, but also shorten their service life exponentially. Therefore, in order to solve this problem, many scholars have devoted themselves to the development of new high-efficiency thermal conductive composite materials. Among them, polymer-based materials have attracted extensive attention due to their light weight, corrosion resistance, and low cost. In consideration of the operational safety of electronic components, high insulation requirements are put forward for thermally conductive composite materials, because when thermally conductive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C48/18B29C48/49B32B9/00B32B9/04
CPCB32B9/00B32B9/04B32B2250/42B32B2307/206B32B2307/302B29C48/18B29C48/49
Inventor 周琪
Owner 周琪
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