Preparation method of graphite-oriented thermal interface material

A thermal interface material and orientation technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of high porosity, large contact thermal resistance and total thermal resistance, and achieve low orientation, high density, The effect of low thermal resistance

Pending Publication Date: 2021-04-30
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems of high porosity, high contact thermal resistance and large total thermal resistance of the graphite filler/polymer-based thermal in

Method used

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  • Preparation method of graphite-oriented thermal interface material
  • Preparation method of graphite-oriented thermal interface material
  • Preparation method of graphite-oriented thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0054] A method for preparing a graphite filler / polymer-based thermal interface material with oriented structural features: comprising the following steps:

[0055] According to the volume percentage, weigh the corresponding mass of graphite filler, microscopic thermal conductive filler and polymer matrix.

[0056] The graphite filler, the microscopic heat-conducting filler and the polymer matrix are uniformly mixed by means of mechanical mixing (such as planetary stirring, centrifugal stirring) to obtain a mixture. The rotational speed of the stirring rod of the planetary stirring is 100-250 rpm, the stirring time is 2-6 hours, the stirring temperature is -5-100°C, and the stirring environment is a vacuum environment.

[0057] Orientation treatment (such as slit extrusion process) is adopted to realize the orientation of graphite microflakes in the mixture to obtain a lamellar mixture. The slot extrusion orientation process uses shear force to promote the orientation of grap...

Example Embodiment

[0064] Example 1

[0065] First, flake graphite with an average particle size of 180 microns is used as the graphite filler, aluminum powder with an average particle size of 5 microns is used as the microscopic thermally conductive filler, and hydrogen-containing silicone oil and vinyl silicone oil with an average molecular weight of 1000 are used as the matrix. Through planetary stirring The method is mixed into a mixture with flake graphite volume percentage of 35% and aluminum powder volume percentage of 3%. The rotational speed of the stirring rod of the planetary stirring is 120 rpm, the stirring time is 3 hours, and the stirring temperature is 5°C. After the mixture was evenly stirred, a platinum catalyst was added, and the stirring was continued for 30 minutes. Through slit extrusion, the above mixture was subjected to extrusion orientation treatment, and the thickness of the slit was controlled to be 1 mm. Then the extruded mixture is sent to a refrigeration device w...

Example Embodiment

[0068] Example 2

[0069] First, flake graphite with an average particle size of 280 microns is used as the graphite filler, aluminum powder with an average particle size of 5 microns is used as the microscopic thermally conductive filler, and hydrogen-containing silicone oil and vinyl silicone oil with an average molecular weight of 1000 are used as the matrix. Through planetary stirring The way is mixed into flake graphite volume percentage is 45%, the volume percentage of aluminum powder is 3% mixture. The rotational speed of the stirring rod of the planetary stirring is 120 rpm, the stirring time is 3 hours, and the stirring temperature is 5°C. After the mixture was evenly stirred, a platinum catalyst was added, and the stirring was continued for 30 minutes. Through slit extrusion, the above mixture was subjected to extrusion orientation treatment, and the thickness of the slit was controlled to be 1.5 mm. Then the extruded mixture is sent to a refrigeration device with ...

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Abstract

The invention discloses a preparation method of a graphite-oriented thermal interface material. The preparation method comprises the following steps: mixing raw materials of the graphite-oriented thermal interface material to obtain a mixture; carrying out orientation treatment on the mixture to obtain a lamellar mixture; freezing the lamellar mixture to obtain a frozen lamellar mixture; cutting the frozen lamellar mixture to obtain a lamellar sample with specified width and length, and laminating the lamellar sample; treating the laminated sample by adopting a vacuum pressurizing mode, and conducting slow heating in the process so as to convert the mixture from a solid state to a viscous flow state, thereby obtaining a compact sample preform; carrying out high-temperature curing treatment on the compact sample preform to obtain a cured sample; and cutting the cured sample along a direction vertical to the thickness of the lamellar sample to obtain the graphite-oriented thermal interface material. The graphite-oriented thermal interface material prepared by the preparation method is high in compactness and small in thermal resistance.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive polymer-based composite materials, and in particular relates to a preparation method of a graphite-oriented thermal interface material. Background technique [0002] The rise of emerging fields such as 5G communications, the Internet of Things, big data, and artificial intelligence has made integrated circuits develop in the direction of miniaturization, thinning, and high integration. However, this trend directly leads to an increase in the power density and operating temperature of electronic devices. If the heat of electronic devices is not dissipated in time, not only will its performance be significantly reduced, but in severe cases it will also lead to equipment failure, scrapping, and even safety hazards. Therefore, how to achieve efficient heat dissipation of electronic components is a key issue facing the design and assembly of electronic products today. Especially for port...

Claims

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Application Information

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IPC IPC(8): C08L83/05C08L83/07C08K3/04C08K3/08C08K3/22C08L75/08C08J3/00C09K5/14
CPCC08L83/04C08K3/042C08K3/08C08K3/22C08J3/00C09K5/14C08K2201/005C08K2003/0812C08L2205/025C08K2003/2227C08J2383/05C08J2383/07C08J2483/05C08J2483/07C08J2375/08C08L75/08
Inventor 曾小亮张晨旭叶振强任琳琳张月星许建斌孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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