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A kind of thermally conductive insulating composite material and preparation method thereof

A thermally conductive insulating filler and composite material technology, applied in the field of polymer materials, can solve the problems of decreased tensile strength, ineffective improvement of thermal conductivity, and interruption of thermal conduction network

Active Publication Date: 2018-01-30
上海晗普新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its thermal conductivity is only 0.26W·m -1 ·K -1 , cannot meet the industrial requirements of timely heat dissipation under high temperature working conditions, thus limiting its application to a certain extent
[0003] At present, the main method to improve the thermal conductivity of polymer materials is to fill insulating ceramic fillers with high thermal conductivity, such as alumina, boron nitride, aluminum nitride, etc. Since the structure of engineering plastics is amorphous, there is no plastic crystal. , if there is no overlap between the plastic crystal and the thermally conductive filler particles, the thermally conductive network may be interrupted, and the thermal conductivity cannot be effectively improved. Generally, a high filler filling amount is required to form a thermally conductive path and improve thermal conductivity. It will cause the impact strength and tensile strength of the composite material to drop rapidly

Method used

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  • A kind of thermally conductive insulating composite material and preparation method thereof
  • A kind of thermally conductive insulating composite material and preparation method thereof

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preparation example Construction

[0045] In a typical preparation method of polyethersulfone resin and polyphenylene resin, as a first stage, the two raw materials are dissolved in an organic polar solvent, and as a second stage, an alkali of carbonic acid is added to the solution obtained in the first stage Metal salt, subjecting two raw materials to polycondensation, as the third stage, from the reaction mixture obtained in the second stage, unreacted alkali metal salt of carbonic acid, produced by-product alkali metal halide, and organic polar solvent are removed , to obtain polyethersulfone resin and polyphenylene resin.

[0046] The dissolution temperature in the first stage is usually 40 to 180°C, and the polycondensation temperature in the second stage is usually 180 to 400°C. Assuming that side reactions do not occur, the higher the polycondensation temperature is, the faster the intended polycondensation proceeds, and thus the degree of polymerization of the obtained resin becomes higher. As a result...

Embodiment 1～7

[0071] The preparation method of embodiment 1~7 is as follows:

[0072] (1) Dissolve polyethersulfone resin in DMF at 30-60°C, so that the concentration of polyethersulfone is 1-10g / 100mL; then drop it into deionized water at 60-90°C, and stir while adding, to obtain white Precipitation: Suction filter, wash and dry the white precipitate to obtain polyethersulfone resin powder;

[0073] (2) Putting polyethersulfone resin powder, processing aids and dry-treated fillers into a high-speed mixer for pre-mixing, melt-blending, extruding, and granulating through a twin-screw extruder to obtain the product. The temperature of the feeding port, conveying section, melting section, homogenizing section, and die of the above-mentioned twin-screw extruder are respectively 150°C, 180°C, 180°C, 180°C, and 180°C. Dry in a blast oven to obtain an insulating high thermal conductivity composite material.

[0074] The thermal conductivity of the thermally conductive and insulating composite ma...

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Abstract

The invention discloses a heat conduction and electricity insulation composite material and a preparation method thereof. The composite material is composed of 100 parts of polyethersulfone resin powder, 25-40 parts of a heat conduction and electricity insulation filler and 1-5 parts of a processing assistant; the structure of the polyethersulfone resin is shown in the specification, x in the structure is 1-3, and y in the structure is 1-3; the degree of crystallization of the polyethersulfone resin is 20-40%; and the molecular weight of the polyethersulfone resin is 5000-100000. The polyethersulfone resin with a certain degree of crystallization is adopted as the matrix of the composite material, a modified inorganic filler is adopted as a composite heat conduction filler, and a filler-filler and filler-polymer crystal-filler heat conduction network is formed between the crystal matrix and the modified inorganic filler, so the heat conduction coefficient of the composite material is obviously improved.

Description

technical field [0001] The invention belongs to the field of polymer materials, and more specifically, the invention relates to a heat-conducting and insulating composite material and a preparation method thereof. Background technique [0002] At present, domestic research reports on insulating and heat-conducting composite materials in different fields are mostly insulating and heat-conducting adhesives, insulating and heat-conducting rubber, and insulating and heat-conducting potting materials, and relatively little development of insulating and heat-conducting plastics. Special engineering plastics have good heat resistance and are widely used in various fields in the national economy and defense industry. Polysulfone is a kind of non-crystalline thermoplastic special engineering plastics. It mainly includes three types of bisphenol A polysulfone, polyarylsulfone and polyethersulfone. It has excellent heat resistance and creep resistance. It can be used for a long time a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L81/06C08K9/06C08K3/22C08K3/38C08K3/28
CPCC08K2201/003C08K2201/011C08K2201/014C08L81/06C08L2205/025C08L83/04C08K2003/2227C08K2003/385C08K2003/282C08K9/06C08K9/08
Inventor 浦亚芹
Owner 上海晗普新材料科技有限公司
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