Prepreg applied for multi-layer board of printed electronic circuit

A technology of prepreg and curing accelerator, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., and can solve the needs of making multi-layer PCB special structures, white spots and dried flowers on the substrate, and poor machinability and other problems, to achieve the effect of improving delamination explosion, low cost, and small residual stress

Active Publication Date: 2008-07-16
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional prepreg that uses glass fiber cloth as a reinforcing material is woven with warp and weft glass fiber yarns in its production process, which makes the glass fiber cloth have the characteristics of high fiber density, high strength, and stable dimensions. However, because of these characteristics, glass fiber The dense weaving of the cloth, interweaving of warp and weft yarns, and the two-directional weaving characteristics of warp and weft gradually exposed the lack of performance and reliability of multi-layer boards, mainly manifested in: qual

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of prepreg for multilayer board, it comprises reinforcing material and resin composition, and wherein said reinforcing material is glass fiber paper, and the prescription of resin composition is:

[0023] 30 parts of epoxy resin

[0024] 40 parts of phenolic resin

[0025] Aluminum hydroxide 14.99 parts

[0026] 0.01 parts of 2-methylimidazole

[0027] Butanone 15 parts;

[0028] A kind of prepreg for multi-layer board, its preparation method is finished by the following steps:

[0029] The above resin composition solution was impregnated in glass fiber paper for 3 minutes, put into an oven at 170° C. and baked for 5 minutes. After removing the solvent, a prepreg for multi-layer board was obtained.

[0030] The prepreg multilayer PCB processing material obtained above is used to make the inner core board of the multilayer circuit board with the copper clad laminate. The prepreg bonds a single or multiple core boards and copper foil, and uses the above resin i...

Embodiment 2

[0034] A kind of prepreg for multilayer board, it comprises reinforcing material and resin composition, and wherein said reinforcing material is glass fiber paper, and the prescription of resin composition is:

[0035] 65 parts of trifunctional epoxy resin

[0036] Silicon oxide 15 parts

[0037] 0.3 parts of 2-methyl

[0038] 19.7 parts of dimethylformamide

[0039] A kind of prepreg for multi-layer board, its preparation method is finished by the following steps:

[0040] The above resin composition solution was impregnated in glass fiber paper for 5 minutes, put into an oven at 170° C. and baked for 8 minutes. After removing the solvent, a prepreg for multi-layer board was obtained.

[0041] Using the same resin composition formula, the reinforcing materials are prepregs made of glass fiber cloth and glass fiber paper respectively. The comprehensive performance comparison is shown in the table below

[0042] project

[0043]

Embodiment 3

[0045] A kind of prepreg for multilayer board, it comprises reinforcing material and resin composition, and wherein said reinforcing material is glass fiber paper, and the prescription of resin composition is:

[0046] Four functional epoxy resin 40 parts

[0047] 29.7 parts of phenolic resin

[0048] 0.3 parts of 4-ethylimidazole

[0049] 30 parts of propylene glycol methyl ether acetate.

[0050] A prepreg for a multi-layer board, the preparation method of which is completed by the following steps: impregnating the above-mentioned resin composition solution in glass fiber paper for 1 minute, putting it into a 170°C oven and baking for 5 minutes, and after removing the solvent, a multi-layer prepreg is obtained. Prepreg for laminates. Using the same resin composition formula, the reinforcing materials are prepregs made of glass fiber cloth and glass fiber paper respectively. The comprehensive performance comparison is shown in the table below

[0051] project

...

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PUM

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Abstract

The invention pertains to the technical field of the copper clad laminate, which more particularly relates to a prepreg applied to a printing circuit multilayer board. The prepreg comprises reinforced materials and resin composite, wherein, the reinforced materials is glass fiber paper, and according to part by weight, the formulation of the resin composite is as follows: 20 to 84 portions of resin, 0 to 35 portions of filling materials, 0.01 to 0.3 portions of curing accelerator and 10 to 45 portions of solvent; the resin composite solvent is soaked in the glass fiber paper for 1 to 5 minutes, and is put in a 140 to 200 DEG C oven for baking for 2 to 10 minutes; after the solvent is removed, the prepreg applied to multilayer PCB processing materials is obtained; white flake and spot problems of base materials during the manufacturing procedures of the multilayer PCB are prevented, problems of de-lamination, shrink resin, holes and crack of the resin and white flake, etc. that come up after the multilayer PCB goes through cold and hot impact are improved, and the prepreg has good reliability and low cost.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit boards, in particular to a prepreg applied to printed circuit multilayer boards. Background technique: [0002] Copper-clad laminate is a composite material made by impregnating the reinforcing material with resin, covered with copper foil on one or both sides, and hot-pressed, referred to as copper-clad laminate (CCL), which is used to make printed circuit boards (PCB) . Printed circuit boards have become an indispensable main component for most electronic products to achieve circuit interconnection. The main materials for manufacturing printed circuit boards (PCBs) include copper clad laminates (CCL) and prepregs. Among them, copper clad laminates are mainly used to make inner core boards of multilayer circuit boards. The main function of prepregs is to convert single or multiple The core board and copper foil are bonded, and the resin composition impregnated with itself is used to fi...

Claims

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Application Information

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IPC IPC(8): C08J5/08C08J5/18C08L63/00C08L77/00C08L27/12C08L61/06B32B27/04H05K1/03
Inventor 吴小连马栋杰王水娟方东炜
Owner GUANGDONG SHENGYI SCI TECH
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