High-temperature-resistant honeycomb node adhesive and preparation method thereof

A technology for adhesives and high temperature resistance, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of unsatisfactory bonding compatibility, low temperature resistance level, etc., and achieve good toughening effect , good heat resistance, the effect of maintaining high temperature strength and toughness

Inactive Publication Date: 2015-04-01
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems that the existing honeycomb node adhesive has a low temperature resistance level and the bonding compatibility c

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-temperature-resistant honeycomb node adhesive and preparation method thereof
  • High-temperature-resistant honeycomb node adhesive and preparation method thereof
  • High-temperature-resistant honeycomb node adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0019] Specific embodiment 1: This embodiment is a high-temperature-resistant honeycomb node adhesive, which is composed of 100 parts of main resin, 10-15 parts of BMT bismaleimide resin, and 10-15 parts of phenolic cyanic acid according to the mass. It is made of ester, 8-12 parts copolymerization modifier, 15-30 parts rubber elastomer toughening agent, 4-12 parts inorganic nano filler and 220-280 parts solvent. Among them, BMT type bismaleimide The mass ratio of amine resin, phenolic cyanate ester and copolymerization modifier is 5:5:4.

[0020] In this embodiment, the chemical structural formula of the BMT type bismaleimide resin is:

[0021]

[0022] The BMT-type bismaleimide resin is a commercially available product, purchased from Honghu Shuangma New Material Technology Co., Ltd. (formerly Honghu Shuangma Resin Factory in Hubei Province), and the trade name is T-type Shuangma BMI-06 resin.

Example Embodiment

[0023] Specific embodiment two: this embodiment is different from specific embodiment one in that: the adhesive is increased by 100 parts by mass of main resin, 35-40 parts of process modified resin, and 20-25 parts of rubber elastomer. It is made of toughening agent, 6-10 parts of inorganic nano filler and 240-260 parts of solvent. Others are the same as the first embodiment.

Example Embodiment

[0024] Specific embodiment three: This embodiment is different from specific embodiment one or two in that the main resin is composed of alkynyl-terminated isoimide resin. Others are the same as the first or second embodiment.

[0025] In this embodiment, the alkynyl-terminated isoimide resin is divided into:

[0026] High molecular weight alkynyl-terminated isoimide resin, the chemical structure is:

[0027]

[0028] Low molecular weight alkynyl-terminated isoimide resin, the chemical structure is:

[0029]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Shear strengthaaaaaaaaaa
Shear strengthaaaaaaaaaa
Strengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a high-temperature-resistant honeycomb node adhesive and a preparation method thereof and relates to an adhesive and a preparation method thereof. The high-temperature-resistant honeycomb node adhesive is used for solving the problem that the existing honeycomb node adhesive cannot meet the requirements on the manufacturing of polyimide paper honeycomb due to low temperature-resistant level and poor bonding compatibility. The adhesive is prepared from matrix resin, BMT type bismaleimide resin, phenolic cyanate ester, a co-polymerization modifier, a rubber elastomer toughening agent, inorganic nanometer filler and a solvent. The preparation method comprises the following steps: firstly, weighing; secondly, preparing toughening modified resin; thirdly, mechanically blending to obtain mixed rubber sheets; and fourthly, preparing uniform rubber liquid under stirring. The high-temperature-resistant honeycomb node adhesive is mainly applied in manufacturing aerospace polyimide paper honeycomb and has the characteristics of high temperature resistance and good process performance. The high-temperature-resistant honeycomb node adhesive prepared by the preparation method is used for the manufacturing of aerospace polyimide paper honeycomb and has the characteristics of high temperature resistance and good process performance.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] The honeycomb sandwich structure has been widely used in aviation and aerospace fields because of its high specific strength and specific modulus, good fatigue resistance, good vibration resistance, and effective absorption of impact loads. Among them, the polyimide paper substrate has high temperature resistance and low dielectric properties, so the polyimide paper honeycomb prepared from it has high expectations in terms of high temperature resistance and low dielectric properties, and is intended to be used for aircraft high temperature resistant radome and Manufacture of some stealth structural parts. [0003] High temperature resistant honeycomb node adhesive is an important bonding material in the honeycomb manufacturing process, and its heat resistance, mechanical properties, dielectric properties and process properties determine the performance...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J179/08C09J11/04C09J11/06C09J11/08C08G73/10
Inventor 王德志曲春艳宿凯张杨冯浩李洪峰杨海冬刘长威王海民毛勇
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap