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High-temperature-resistant honeycomb node adhesive and preparation method thereof

A technology for adhesives and high temperature resistance, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of unsatisfactory bonding compatibility, low temperature resistance level, etc., and achieve good toughening effect , good heat resistance, the effect of maintaining high temperature strength and toughness

Inactive Publication Date: 2015-04-01
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems that the existing honeycomb node adhesive has a low temperature resistance level and the bonding compatibility cannot meet the requirements of polyimide paper honeycomb manufacturing, thereby providing a high temperature resistant honeycomb node adhesive and its preparation method

Method used

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  • High-temperature-resistant honeycomb node adhesive and preparation method thereof
  • High-temperature-resistant honeycomb node adhesive and preparation method thereof
  • High-temperature-resistant honeycomb node adhesive and preparation method thereof

Examples

Experimental program
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Effect test

specific Embodiment approach 1

[0019] Specific Embodiment 1: In this embodiment, a high-temperature-resistant honeycomb node adhesive consists of 100 parts of main resin, 10-15 parts of BMT-type bismaleimide resin, and 10-15 parts of phenolic cyanic acid ester, 8 to 12 parts of copolymerization modifier, 15 to 30 parts of rubber elastomer toughening agent, 4 to 12 parts of inorganic nano filler and 220 to 280 parts of solvent, among which, BMT type bismaleimide The mass ratio of amine resin, phenolic cyanate and copolymerization modifier is 5:5:4.

[0020] BMT type bismaleimide resin in the present embodiment, chemical structural formula is:

[0021]

[0022] The BMT-type bismaleimide resin is a commercially available product, purchased from Honghu Shuangma New Material Technology Co., Ltd. (formerly Hubei Honghu Shuangma Resin Factory), and the trade name is T-type Shuangma BMI-06 resin.

specific Embodiment approach 2

[0023] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the adhesive consists of 100 parts by mass of main resin, 35-40 parts of process-modified resin, and 20-25 parts of rubber elastic body. Toughening agent, 6-10 parts of inorganic nano filler and 240-260 parts of solvent. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0024] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the main resin is composed of an alkynyl-terminated isoimide resin. Others are the same as in the first or second embodiment.

[0025] In this embodiment, the alkynyl-terminated isoimide resin is divided into:

[0026] High molecular weight alkyne-terminated isoimide resin, the chemical structural formula is:

[0027]

[0028] Low molecular weight alkyne-terminated isoimide resin, the chemical structural formula is:

[0029]

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Abstract

The invention discloses a high-temperature-resistant honeycomb node adhesive and a preparation method thereof and relates to an adhesive and a preparation method thereof. The high-temperature-resistant honeycomb node adhesive is used for solving the problem that the existing honeycomb node adhesive cannot meet the requirements on the manufacturing of polyimide paper honeycomb due to low temperature-resistant level and poor bonding compatibility. The adhesive is prepared from matrix resin, BMT type bismaleimide resin, phenolic cyanate ester, a co-polymerization modifier, a rubber elastomer toughening agent, inorganic nanometer filler and a solvent. The preparation method comprises the following steps: firstly, weighing; secondly, preparing toughening modified resin; thirdly, mechanically blending to obtain mixed rubber sheets; and fourthly, preparing uniform rubber liquid under stirring. The high-temperature-resistant honeycomb node adhesive is mainly applied in manufacturing aerospace polyimide paper honeycomb and has the characteristics of high temperature resistance and good process performance. The high-temperature-resistant honeycomb node adhesive prepared by the preparation method is used for the manufacturing of aerospace polyimide paper honeycomb and has the characteristics of high temperature resistance and good process performance.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] The honeycomb sandwich structure has been widely used in aviation and aerospace fields because of its high specific strength and specific modulus, good fatigue resistance, good vibration resistance, and effective absorption of impact loads. Among them, the polyimide paper substrate has high temperature resistance and low dielectric properties, so the polyimide paper honeycomb prepared from it has high expectations in terms of high temperature resistance and low dielectric properties, and is intended to be used for aircraft high temperature resistant radome and Manufacture of some stealth structural parts. [0003] High temperature resistant honeycomb node adhesive is an important bonding material in the honeycomb manufacturing process, and its heat resistance, mechanical properties, dielectric properties and process properties determine the performance...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J11/04C09J11/06C09J11/08C08G73/10
Inventor 王德志曲春艳宿凯张杨冯浩李洪峰杨海冬刘长威王海民毛勇
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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