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Epoxy resin composition and cured product thereof

A technology of epoxy resin and composition, which is applied in the direction of epoxy resin glue, synthetic resin layered products, adhesive types, etc., can solve the problems of increased molecular weight, inappropriateness, and reduced operability, and achieve high heat resistance , low dielectric effect

Active Publication Date: 2015-04-15
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Here, the modified phenolic material, which is a material for imparting low dielectric properties, is inevitably increased in molecular weight by repolymerization accompanied by decomposition during its synthesis, resulting in a decrease in workability such as impregnation into glass cloth, and in view of expensive raw materials. It is also very unsuitable for the development to the use of communication terminal equipment which is becoming common (Patent Document 3)

Method used

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  • Epoxy resin composition and cured product thereof
  • Epoxy resin composition and cured product thereof
  • Epoxy resin composition and cured product thereof

Examples

Experimental program
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Effect test

Embodiment

[0068] Hereinafter, the present invention will be further specifically described based on examples and comparative examples, but the present invention is not limited thereto. In the examples, unless otherwise specified, "parts" means parts by mass, and "%" means % by mass.

[0069] (1) Determination of epoxy equivalent

[0070] Measurement was performed in accordance with JIS K 7236 standard. Specifically, a potentiometric titration device was used, methyl ethyl ketone was used as a solvent, a tetraethylammonium bromide acetic acid solution was added, and a 0.1 mol / L perchloric acid-acetic acid solution was used.

[0071] (2) Determination of phosphorus content

[0072] Sulfuric acid, hydrochloric acid, and perchloric acid are added to the sample, and heated to carry out wet ashing, so that all the phosphorus atoms become orthophosphoric acid. React metavanadate and molybdate in sulfuric acid acidic solution, measure the absorbance of the generated vanadium phosphomolybdate...

Synthetic example 1

[0089] Synthesis Example 1 (Synthesis of Phenol Compound (B1))

[0090] 806 parts of methanol and 201.7 parts of potassium hydroxide were put into a 4-mouth separable glass flask equipped with a stirring device, a thermometer, a cooling pipe, and a nitrogen gas introduction device, and stirred, and 550 parts of dihydroxy compound (a) were added thereto. Bis(4-hydroxy-3,5-dimethylphenyl) sulfone (hereinafter referred to as TMBPS) to make alkali metal salt. After that, 4.5 parts of 4,4'-bischloromethylbiphenyl (hereinafter referred to as BCMB) as a halomethyl-containing compound (b) and 488 parts of bis(2-methoxyethyl) as a solvent were charged. Ether, heated to 75°C while stirring, and reacted for 2 hours.

[0091] After the reaction was completed, the generated salt was removed by filtration, and the temperature was raised to 100°C under a reduced pressure of 50 mmHg. After distilling off the entire amount of methanol and bis(2-methoxyethyl) ether, 1,290 parts of toluene was ...

Synthetic example 2

[0092] Synthesis Example 2 (Synthesis of Phenol Compound (B2))

[0093] 367 parts of methanol and 91.7 parts of potassium hydroxide were put into a 4-mouth separable glass flask equipped with a stirring device, a thermometer, a cooling pipe, and a nitrogen gas introduction device, and stirred, and 250 parts of dihydroxy compound (a) were put into it. TMBPS, prepared as an alkali metal salt. Thereafter, 61.5 parts of BCMB as a halomethyl-containing compound (b) and 360 parts of bis(2-methoxyethyl)ether as a solvent were charged, heated to 75°C while stirring, and reacted for 2 hours.

[0094] After the reaction was completed, the generated salt was removed by filtration, and the temperature was raised to 100°C under a reduced pressure of 50 mmHg. After distilling off the entire amount of methanol and bis(2-methoxyethyl) ether, 685 parts of toluene was added and dissolved. . After neutralizing and liquid-separating with phosphoric acid, washing and liquid-separating with water...

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Abstract

The invention provides an epoxy resin composition which has low medium property, high thermal resistance and excellent performance and is useful in overlaying, forming, casting, adhesion and other occasions, and a cured product of the epoxy resin composition. The invention relates to the epoxy resin composition and the cured product thereof. The epoxy resin composition contains an epoxy resin (A) represented in a formula (1) and a curing agent (B). In the formula (1), m is a number of repetition with the average value being 0<m<10; X and Y are selected from phenylene or naphthylene having hydroxy groups or halogen atoms which can serve as substituent group with the number of carbon atoms being 1 to 10, or at last one group in the groups represented in a formula (2), and can be the identical or different. In the formula (2), R1 represents a hydroxy group or a halogen atom having 1 to 10 hydrogen atoms or carbon atoms which can be the same or different; and R2 is a single bond or a bivalent group.

Description

technical field [0001] The present invention relates to an epoxy resin composition and a cured product thereof which provide a cured product having low dielectric properties, high heat resistance, and low hygroscopicity. Background technique [0002] In recent years, the demand for small mobile communication devices with personal communication terminals such as smartphones and tablet PCs has grown rapidly. Along with this, the signal frequency band of information communication equipment and the CPU frequency of computers have reached the GHz band, and further high frequency is progressing. [0003] The dielectric loss of an electrical signal is proportional to the product of the square root of the permittivity of the insulator forming the circuit, the dielectric loss tangent, and the frequency of the signal used. Therefore, the higher the frequency of the signal used, the greater the dielectric loss becomes. [0004] Dielectric loss will attenuate the electrical signal as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G59/20C08L63/00C09J7/00C09J163/00B32B27/38
CPCC08G59/22C08G59/304C08G59/40C08G59/621C08J3/24C08L63/00C09J7/20
Inventor 佐藤洋佐濑奈央树
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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