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Low-dielectric polyperfluorinated ethylene propylene copper-clad plate and preparation method thereof

A technology of polyperfluoroethylene propylene and copper clad laminates, which is applied in the fields of printed circuit manufacturing, circuit substrate materials, chemical instruments and methods, etc., can solve the problems of cumbersome dipping process and long time spent, and achieve strong machinability, The effect of short use time and low water absorption

Active Publication Date: 2019-09-13
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method takes a long time for dipping, and the dipping process is cumbersome

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A method for manufacturing a low-dielectric polyperfluoroethylene propylene copper-clad laminate, comprising the following steps and process conditions:

[0038] (1) Pretreatment of glass fiber: put 1 part of 1080-type chopped glass fiber in 5 parts of deionized water, use dilute hydrochloric acid to adjust the pH value of the glass fiber suspension, and control pH=2.5;

[0039] (2) Modification of glass fiber: put 1 part of N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane (KH602) coupling agent in 5 parts of deionized water, at 50 Heat at ℃ for 20 minutes to fully hydrolyze the silane coupling agent, and put the hydrolyzed coupling agent into the glass fiber suspension;

[0040] (3) Dispersion of glass fibers: add polyethylene oxide to the glass fiber suspension, and decompose the chopped glass fibers for 1000r with a decomposer;

[0041](4) Drying of glass fiber: filter the water in the glass fiber suspension, then put it in a vacuum oven and dry at 60°C for 20min...

Embodiment 2

[0050] A method for manufacturing a low-dielectric polyperfluoroethylene propylene copper-clad laminate, comprising the following steps and process conditions:

[0051] (1) Pretreatment of glass fiber: put 2 parts of 1080-type chopped glass fiber in 5 parts of deionized water, use dilute hydrochloric acid to adjust the pH value of the glass fiber suspension, and control pH=3;

[0052] (2) Modification of glass fiber: put 2 parts of N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane (KH602) coupling agent in 6 parts of deionized water, at 60 Heat at ℃ for 30 minutes to fully hydrolyze the silane coupling agent, and put the hydrolyzed coupling agent into the glass fiber suspension;

[0053] (3) Dispersion of glass fibers: add polyethylene oxide to the glass fiber suspension, and decompose the chopped glass fibers for 1500r with a decomposer;

[0054] (4) Drying of glass fiber: filter the water in the glass fiber suspension, then put it in a vacuum oven and dry at 60°C for 30mi...

Embodiment 3

[0062] A method for manufacturing a low-dielectric polyperfluoroethylene propylene copper-clad laminate, comprising the following steps and process conditions:

[0063] (1) Pretreatment of glass fiber: put 2 parts of 106-type chopped glass fiber in 6 parts of deionized water, use dilute hydrochloric acid to adjust the pH value of the glass fiber suspension, and control pH=3;

[0064] (2) Modification of glass fiber: put 2 parts of thiopropyltrimethoxysilane (KH590) coupling agent in 6 parts of deionized water, heat at 65°C for 15 minutes to fully hydrolyze the silane coupling agent, and then The final coupling agent is put into the glass fiber suspension;

[0065] (3) Dispersion of glass fibers: add polyethylene oxide to the glass fiber suspension, and decompose the chopped glass fibers for 2000r with a decomposer;

[0066] (4) Drying of glass fiber: filter the water in the glass fiber suspension, then put it in a vacuum oven and dry at 70°C for 15 minutes to remove moisture;...

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Abstract

The invention discloses a low-dielectric polyperfluorinated ethylene propylene copper-clad plate and a preparation method thereof. The preparation method comprises the following steps: performing pretreatment on chopped glass fibers, performing modification with a silane coupling agent, adding a dispersing agent to perform fluffing by a fluffer, and enabling the glass fibers to be uniformly dispersed; drying the dispersed glass fibers to remove water, adding polyperfluorinated ethylene propylene emulsion, uniformly mixing the polyperfluorinated ethylene propylene emulsion and the glass fibers,and performing dehydration and concentration; coating a high temperature resistant film with a concentrated solution uniformly by using an automatic coater; performing vacuum drying, and taking out the materials after cooling so as to prepare a polyperfluorinated ethylene propylene prepreg; and attaching the prepreg onto a copper foil, and performing pressing by a hot press so as to obtain the copper-clad plate. The copper-clad plate is prepared by selecting a polyperfluorinated ethylene propylene resin, and has a dielectric constant value up to 2-2.5, a dielectric loss value up to 0.0008-0.0015 and the water absorption rate of 0.02-0.05%. The copper-clad plate disclosed by the invention is excellent in dielectric property, low in water absorption rate, good in cohesive property and highin machinability.

Description

technical field [0001] The invention relates to a manufacturing method of a copper-clad laminate, in particular to a low-dielectric polyperfluoroethylene-propylene copper-clad laminate for high-frequency and high-speed use and a manufacturing method thereof. Background technique [0002] With the development of modern communication technology, computers, networks, and satellite communications have penetrated into every corner of people's lives. With the development of information and communication technologies such as mobile phones and satellite communication technologies towards multi-channel, high-performance and multi-functionalization, the frequencies used by wireless networks, satellite communications and radar continue to increase. Due to the poor dielectric properties, large thermal expansion, and poor moisture resistance of traditional printed circuit boards such as phenolic / paper base, epoxy resin / glass fiber, etc., they are not suitable for modern high-frequency pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/085B32B27/32B32B27/06B32B27/18B32B37/06B32B37/10C08L27/18C08L71/02C08K9/06C08K7/14H05K1/03H05K3/02
CPCB32B15/085B32B15/20B32B27/06B32B27/18B32B27/322B32B37/06B32B37/10B32B2250/40B32B2307/204C08L27/18H05K1/0366H05K3/022C08L71/02C08K9/06C08K7/14
Inventor 刘德桃李映辉徐科林美燕欧阳豪苏灵峰
Owner SOUTH CHINA UNIV OF TECH
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