Nanometer zinc borate-containing maleic anhydride-grafted polyphenyl ether modified epoxy resin composite used for LED packaging and preparation method thereof

Abstract

The invention discloses a nanometer zinc borate-containing maleic anhydride-grafted polyphenyl ether modified epoxy resin composite used for LED packaging. The composite employs grafted polyphenyl ether to modify epoxy resin; a polyphenyl ether material obtained after grafting by raw materials like maleic anhydride and nanometer titanium dioxide maintains excellent low dielectric performance, low loss and high heat resistance and has improved compatibility with the epoxy resin, so the defects of the epoxy resin as a packaging material are effectively improved; and blended nanometer zinc borate and graphene oxide enable the composite to have improved electrical performance, better insulating properties and heat stability, flame retardation, water resistance and the like. The composite prepared in the invention has excellent mechanical properties and dielectric properties, long service life, economic performance and safety when used as an LED packaging material.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to a maleic anhydride grafted polyphenylene ether modified epoxy resin composite material containing nano-zinc borate for LED packaging and a preparation method thereof. Background technique [0002] LED packaging refers to the packaging of light-emitting chips. LED packaging is different from other integrated circuit packaging. It not only needs to protect the chip, but also has light transmission. Therefore, there are special requirements for the performance of LED packaging materials. Requirements for packaging materials Mainly reflected in the need to extract as much light as possible from the chip, but also to reduce thermal resistance, to achieve the effect of improving heat dissipation and light output efficiency. With the rapid development of the LED industry, the demand for new high-quality packaging materials is increasingly strong At present, the commonly ...

AI Technical Summary

Problems solved by technology

[0002] LED packaging refers to the packaging of light-emitting chips. LED packaging is different from other integrated circuit packaging. It not only needs to protect the chip, but also has light transmission. Therefore, there are special requirements for the performance of LED packaging materials. Requirements for packaging materials Mainly reflected in the need to extract as much light as possible from the chip, but also to reduce thermal resistance, to achieve the effect of improving heat dissipation and light output efficiency. With the rapid development of the LED industry, the demand for new high-quality packaging materials is increasingly strong At present, the commonly used packaging materials mainly include epoxy resin and silicone resin. The cost of epoxy resin is low, and its UV resistance and aging resistance are poor, while silicone resin has excellent heat aging resistance, UV aging resistance, and light transmission. High pass rate and other advantages, but its production cost is high