Polyimide composite material and preparation method and application thereof

A technology of composite materials and polyimide, which is applied in the direction of circuits, electrical solid state devices, semiconductor devices, etc., to achieve the effect of simple operation

Active Publication Date: 2020-12-04
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric properties, light transmittance, heat resistance and mechanical properties of the polyimide resin obtained by the invention need to be further improved

Method used

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  • Polyimide composite material and preparation method and application thereof
  • Polyimide composite material and preparation method and application thereof
  • Polyimide composite material and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Embodiment 1: fluorinated graphene / polyimide composite material

[0091] (1) Preparation of graphene oxide

[0092] First, add 4 g of graphite and 120 mL of concentrated H to a glass bottle in an ice bath at 0 °C 2 SO 4 , then add 2 g of NaNO under constant stirring3 and 20 g of KMnO 4 And react for 1h. Then, it was kept in a 35°C water bath for 1 hour. Finally, deionized water was added up to 500 mL at 45 °C, followed by H 2 o 2 (30%) treatment, the solid matter (graphene oxide) obtained by centrifugation (9500 rpm) was washed successively with 5% hydrochloric acid and deionized water until the pH was adjusted to 7.

[0093] The above-mentioned graphene oxide is frozen by liquid nitrogen, and then thoroughly dried in a freeze dryer to obtain graphene oxide airgel powder.

[0094] (2) Preparation of fluorinated graphene

[0095] Take 1g of the above-mentioned graphene oxide airgel powder and add it to a reaction kettle of 500mL tetrafluoroethylene, add 5g XeF 2...

Embodiment 2

[0100] The only difference from Example 1 is that in step (3), the added amount of fluorinated graphene is 0.01 g, and the content of fluorinated graphene in the obtained composite material is 0.25%.

Embodiment 3

[0102] The only difference from Example 1 is that in step (3), the added amount of fluorinated graphene is 0.04g, and the content of fluorinated graphene in the obtained composite material is 1%.

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Abstract

The invention relates to a polyimide composite material and a preparation method and application thereof. The polyimide composite material comprises a polyimide matrix and a carbon fluoride material distributed in the polyimide matrix; the carbon fluoride material comprises any one or a combination of at least two of graphene fluoride with the plane size smaller than or equal to 10 [mu]m, fluorinated nano carbon black with the diameter smaller than or equal to 100 nm or fluorinated graphene quantum dots with the diameter smaller than or equal to 10 nm. The three carbon fluoride materials withspecific sizes are introduced into the polyimide matrix, so that the comprehensive performance of the polyimide can be effectively improved, and the polyimide has low dielectric constant, high light transmittance, low water absorption rate, high heat resistance and excellent mechanical properties.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to a polyimide composite material and its preparation method and application. Background technique [0002] Polyimide (PI) is widely used in aviation due to its excellent thermal stability, mechanical properties, chemical resistance, dimensional stability, low dielectric constant and loss, low water absorption and good adhesion. Aerospace, microelectronics and other fields. In semiconductor advanced packaging, with the rapid development of advanced packaging technology such as fan-out wafer level packaging and fan-out large board level packaging, polyimide layers with low dielectric constant, high transparency and low water absorption Intermediary materials put forward higher requirements. Among them, with the rapid development of high-frequency communications such as 5G, there is an urgent requirement for polyimide materials with low dielectric constants. Generally, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K9/02C08K7/24C08K3/04C08J5/18H01L23/29C08L79/08
CPCC08G73/1071C08G73/1007C08K9/02C08K7/24C08K3/042C08K3/04C08J5/18H01L23/293C08K2201/011C08J2379/08
Inventor 李金辉张国平随裕莹孙蓉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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