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Styryl siloxy phenolic resin, and preparation method and application thereof

A technology based on siloxy phenolic resin and phenolic resin, which is applied in the field of styrene-based siloxy phenolic resin and its preparation, and can solve the problems of undisclosed performance improvement of polyphenylene ether, etc.

Inactive Publication Date: 2018-06-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current chain end has the method of C=C double bond polyphenylene ether resin, as known polyphenylene ether resin and alkenyl acid chloride monomer are reacted with chain end having hydroxyl group, generates alkenyl ester-polyphenylene ether compound ( SABIC, commodity MX-9000); or as CN104072751A discloses in the presence of alkali metal hydroxide aqueous solution, in the solvent that comprises aromatic hydrocarbon and aliphatic alcohol, makes the end have the polyphenylene ether of phenolic hydroxyl and vinylbenzyl The halide reacts in the presence of a phase transfer catalyst, and the reactant is washed successively with an aqueous alkali metal hydroxide solution and hydrochloric acid to obtain a vinylbenzyl-polyphenylene ether compound. However, it does not disclose that the polyphenylene ether is used for high Performance improvement when using high-frequency circuit boards

Method used

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  • Styryl siloxy phenolic resin, and preparation method and application thereof
  • Styryl siloxy phenolic resin, and preparation method and application thereof
  • Styryl siloxy phenolic resin, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Stir 21 parts by weight of phenol-formaldehyde phenolic resin and 1000 mL of anhydrous tetrahydrofuran in a reaction kettle equipped with a stirrer, dropping funnel, thermometer and air duct (nitrogen) until completely dissolved into a uniform solution, and continue nitrogen for 0.5- The water vapor in the reaction kettle was removed for 1 hour, and nitrogen gas was kept flowing throughout the reaction process. Keep the temperature in the reactor below 20° C., and then slowly add 53 parts by weight of diphenyldichlorosilane dropwise. After the dropwise addition, the reaction kettle was kept below 20°C for 8 hours, and then the temperature was raised to 55°C for 3 hours. Then, 26 parts by weight of p-hydroxystyrene was added dropwise into the reactor, and reacted at 55° C. for 5 hours. After the reaction finishes, THF is removed by distillation under reduced pressure to obtain a novolac resin (modified resin a) modified by styrylsiloxy groups. The styryl equivalent of t...

Embodiment 2

[0099] 42 parts by weight of dicyclopentadiene-type phenolic resin and 1000mL of anhydrous tetrahydrofuran were stirred in a reactor equipped with a stirrer, dropping funnel, thermometer and gas guide tube (nitrogen) until completely dissolved into a uniform solution, and nitrogen was continued. The water vapor in the reactor was removed in 0.5-1 hour, and nitrogen was kept flowing during the whole reaction process. At the same time, the temperature in the reactor was kept below 20° C., and then 30 parts by weight of dimethyldichlorosilane was slowly added dropwise. After the dropwise addition, the reaction kettle was kept below 20°C for 7 hours, and then the temperature was raised to 60°C for 2.5 hours. Then, 28 parts by weight of p-hydroxystyrene was added dropwise into the reaction kettle, and reacted at 58° C. for 6 hours. After reaction finishes, remove tetrahydrofuran by underpressure distillation, obtain the dicyclopentadiene type phenolic resin (modified resin b) of s...

Embodiment 3

[0102] 33 parts by weight of dicyclopentadiene-type phenolic resin and 1000mL of anhydrous tetrahydrofuran were stirred in a reactor equipped with a stirrer, dropping funnel, thermometer and air duct (nitrogen) until completely dissolved into a uniform solution, and the nitrogen was continued. The water vapor in the reactor was removed in 0.5-1 hour, and nitrogen was kept flowing during the whole reaction process. At the same time, the temperature in the reactor was kept below 20° C., and then 46 parts by weight of diphenyldichlorosilane was slowly added dropwise. After the dropwise addition, the reaction kettle was kept below 20°C for 8 hours, and then the temperature was raised to 55°C for 3 hours. Then, 28 parts by weight of p-hydroxystyrene were added dropwise into the reaction kettle, and reacted at 55° C. for 5 hours. After reaction finishes, remove tetrahydrofuran by underpressure distillation, obtain the dicyclopentadiene type phenolic resin (modified resin c) of styr...

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Abstract

The invention provides styryl siloxy phenolic resin, and a preparation method and application thereof. The styryl siloxy phenolic resin has a structure shown in a formula I. According to the method provided by the invention, a simpler synthetic method is utilized to introduce an unsaturated C=C double bond and a siloxy group into a side chain of phenolic resin, so that the resin simultaneously combines low dielectricity of double-bond curing and heat resistance, weather resistance, flame retardance, dielectric properties and a low water absorption rate of the siloxy group, greatly plays application advantages of the phenolic resin in a copper-clad laminate, and can provide excellent dielectric properties, heat and humidity resistance and heat resistance required for the high-frequency high-speed copper-clad laminate.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and relates to a styrene-based siliconoxy phenolic resin and a preparation method and application thereof. Background technique [0002] With the increase in the amount of information communication in recent years, the demand for high-frequency printed circuit boards is increasing. In order to reduce the transmission loss in the high frequency band, electrical insulating materials with excellent electrical properties have become the focus of research in the field of copper clad laminates. At the same time, printed circuit boards or electronic components using these electrical insulating materials need materials with high heat resistance and high glass transition temperature in order to be able to cope with high-temperature reflow soldering and high-level multi-layer assembly during mounting. Phenolic resins have various molecular structures and contain a large number of benzene rin...

Claims

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Application Information

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IPC IPC(8): C08G8/30C08L61/14C08L83/05C08L9/06C08K5/14B32B15/098H05K1/03
Inventor 袁婵娥罗鸿运范华勇林伟
Owner GUANGDONG SHENGYI SCI TECH
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