Packaging material for LED filament

A technology for LED filaments and packaging materials, applied in the direction of epoxy resin glue, adhesive type, grafted polymer adhesive, etc., can solve the problems of complex manufacturing process, inconvenience of large-angle light emission, and unsightly appearance. Achieve long service life, excellent mechanical properties and dielectric properties, improve density and thermal stability

Inactive Publication Date: 2016-05-04
CHONGQING XINDE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to meet different needs, especially the application of plant growth lamps is becoming more and more extensive. However, due to the limitations of traditional ordinary LED combinations, complex manufacturing processes, high power consumption, and unsightly appearance, and LED traditional pa

Method used

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  • Packaging material for LED filament
  • Packaging material for LED filament
  • Packaging material for LED filament

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0015] Example one

[0016] The embodiment is basically as attached figure 1 , 2 Shown: The LED filament of this embodiment includes a long transparent substrate 2, a metal bracket 1 fixed on both ends of the transparent substrate, a plurality of blue LED chips 3 are fixed on the transparent substrate, and the plurality of blue LED chips form at least one row through the transparent substrate The blue LED chips of each LED string are connected in series with wires; the blue LED chips at both ends 4 of the transparent substrate are connected to the bracket with wires 5 respectively;

[0017] A red phosphor layer 6 is also wrapped on the outside of the transparent substrate, and the red phosphor layer is made of a mixture of red phosphor and an adhesive.

[0018] When in use, the metal brackets at both ends of the transparent substrate are connected to the positive and negative electrodes of the power supply, and the two metal brackets are electrically connected to the LED string compo...

Example Embodiment

[0028] Example two

[0029] The glue-linking agent also includes the following raw materials prepared by weight: 72 parts of epoxy resin, 18-22 parts of polyphenylene ether powder, 4 parts of methyl phenyl silicone oil, 0.2-0.4 nanometer zinc sulfide, and a mass concentration of 30 parts. -40% of nano ceramic powder transparent liquid 6-8, nano titanium dioxide 4-5, benzoyl peroxide 0.1-0.2, maleic anhydride 0.4-0.5, silane coupling agent 0.1-0.2, chloroform antioxidant 0.01-0.02 Parts, curing agent 20-25 parts.

[0030] The preparation method is:

[0031] (1) The polyphenylene ether powder is pre-irradiated, and the irradiation conditions are: electron accelerator is used as the irradiation source, and β-rays are used for irradiation under normal temperature, atmospheric pressure and air atmosphere. The pre-irradiation dose range 20kGy, get pre-irradiated polyphenylene ether material;

[0032] (2) Put the pre-irradiated polyphenylene ether material with maleic anhydride, silane cou...

Example Embodiment

[0038] Example three

[0039] The preparation method of the methyl phenyl silicone oil is as follows:

[0040] The components are weighed by weight: 30 parts of methyl phenyl mixed ring body, 30 parts of octamethyl cyclotetrasiloxane, 20 parts of tetramethyl cyclotetrasiloxane, tetramethyl divinyl disiloxane 10 parts of oxane, 5 parts of potassium hydroxide silicon alkoxide, 5 parts of organosilicon phosphate.

[0041] Then, prepare methyl phenyl silicone oil: (1) Add methyl phenyl mixed ring body, octamethylcyclotetrasiloxane, tetramethylcyclotetrasiloxane, and tetramethyldivinyldisiloxane into In the reactor, dehydration was carried out at a temperature of 60°C and a pressure of -0.1MPa for 2h; (2) The dehydrated mixture was heated to 180°C, potassium hydroxide silicon alkoxide catalyst was added, and the temperature was 185°C. Equilibrium reaction for 8 hours; (3) After the reaction is completed, add organosilicon phosphate to the reactor for neutralization for 2.5 hours, then r...

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Abstract

The invention discloses a packaging material, specifically to a packaging material for an LED filament. The packaging material for the LED filament comprises red fluorescent powder and a cross-linking agent mixed with the red fluorescent powder. The cross-linking agent is prepared from the following raw materials by weight: 72 parts of epoxy resin, 18 to 22 parts of polyphenylene ether powder, 4 parts of methyl phenyl silicone oil, 0.2 to 0.4 part of nanometer zinc sulfide, 6 to 8 parts of transparent nanometer ceramic powder liquid with a mass concentration of 30 to 40%, 4 to 5 parts of nanometer titanium dioxide, 0.1 to 0.2 part of benzoyl peroxide, 0.4 to 0.5 part of maleic anhydride, 0.1 to 0.2 part of a silane coupling agent, 0.01 to 0.02 part of a chloroform antioxidant and 20 to 25 parts of a curing agent. The packaging material provided by the invention overcomes the technical defects of a small emergence angle and low light out-coupling efficiency and has improved transmittance and luminous intensity.

Description

technical field [0001] The invention relates to a packaging material, in particular to a packaging material for LED filaments. Background technique [0002] The light environment is one of the important physical environmental factors that are indispensable for the growth and development of plants. Through the adjustment of light quality, controlling the formation of plants is an important technology in the field of facility cultivation; plant growth lights are more environmentally friendly and energy-saving. LED plant lights give plants Provide photosynthesis, promote plant growth, shorten the time for plants to flower and bear fruit, and increase production. In modern construction, plant growth lights are an indispensable product for crops. [0003] In order to meet different needs, especially the application of plant growth lamps is becoming more and more extensive. However, due to the limitations of traditional ordinary LED combinations, complex manufacturing processes, ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J151/08C09J11/04C09J11/08C08F283/06C08F222/06H01L33/56
CPCC09J163/00C08F283/06C08K2201/011C08L2201/08C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J11/08H01L33/56C08L51/08C08L83/04C08K13/02C08K2003/3036C08K3/00C08K2003/2241C08F222/06
Inventor 鲁永忠
Owner CHONGQING XINDE ELECTRONICS
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