Oxygen and water resistant maleic anhydride grafted polyphenyl ether modified epoxy resin composite material for LED packaging, and preparation method thereof

Abstract

The invention discloses an oxygen and water resistant maleic anhydride grafted polyphenyl ether modified epoxy resin composite material for LED packaging. Epoxy resin is modified by grafted polyphenyl ether, polyphenyl ether grafted by maleic anhydride, nanometer organic montmorillonite and other raw materials maintains excellent performances of low dielectric property, low loss and high heat resistance, and the compatibility of the grafted polyphenyl ether and the epoxy resin is improved, so the defects of traditional epoxy resin as a packaging material are effectively improved; and the modified epoxy resin material prepared in the invention has excellent mechanical performances, and the unique structure of the nanometer organic montmorillonite makes the resin material be solidified and compact, so the composite material has good barrier ability to oxygen and water vapor, thereby the material is durable, and has the advantages of excellent mechanical and dielectric performances, high light and thermal ageing resistance, long service life, economy and durability as a packaging material.

Description

technical field [0001] The invention relates to the technical field of LED packaging materials, in particular to a maleic anhydride grafted polyphenylene ether modified epoxy resin composite material for oxygen and water resistance for LED packaging and a preparation method thereof. Background technique [0002] LED packaging refers to the packaging of light-emitting chips. LED packaging is different from other integrated circuit packaging. It not only needs to protect the chip, but also has light transmission. Therefore, there are special requirements for the performance of LED packaging materials. Requirements for packaging materials Mainly reflected in the need to extract as much light as possible from the chip, but also to reduce thermal resistance, to achieve the effect of improving heat dissipation and light output efficiency. With the rapid development of the LED industry, the demand for new high-quality packaging materials is increasingly strong At present, the commo...

AI Technical Summary

Problems solved by technology

[0002] LED packaging refers to the packaging of light-emitting chips. LED packaging is different from other integrated circuit packaging. It not only needs to protect the chip, but also has light transmission. Therefore, there are special requirements for the performance of LED packaging materials. Requirements for packaging materials Mainly reflected in the need to extract as much light as possible from the chip, but also to reduce thermal resistance, to achieve the effect of improving heat dissipation and light output efficiency. With the rapid development of the LED industry, the demand for new high-quality packaging materials is increasingly strong At present, the commonly used packaging materials mainly include epoxy resin and silicone resin. The cost of epoxy resin is low, and its UV resistance and aging resistance are poor, while silicone resin has excellent heat aging resistance, UV aging resistance, and light transmission. High pass rate and other advantages, but its production cost is high