Al3O3 ceramic substrate metallization process

Abstract

The invention relates to a technical field of ceramic material metallization production, and specifically relates to an Al3O3 ceramic substrate metallization process. According to the invention, the Al3O3 ceramic substrate is sequentially subjected to a coarsening treatment, a sensitization and activation treatment, a chemical plating treatment, and a metal or alloy electroplating treatment, such that a metal or alloy film is formed on the surface of the substrate. With the process method provided by the invention, the surface of the ceramic substrate is uniformly coarsened. Microscopic coarse particles are small and have high adsorption capacity. Therefore, reducing cores can be well absorbed during the subsequent sensitization and activation treatment, and chemical plating can be finally realized. The coarsened ceramic substrate can be subjected to the sensitization and activation treatment with a subsequent silver ammonia solution, and can be provided with a copper plating layer with the chemical copper plating process. Also, the substrate can be subjected to the sensitization and activation treatment with colloidal palladium, and can be subjected to a nickel plating process, such that a chemical nickel plating layer can be obtained. Copper, nickel, or other metal or alloy can be electroplated, and ceramic substrate metallization can be realized.

Description

technical field [0001] The invention relates to the technical field of ceramic material metallization production, in particular to an Al 2 o 3 Ceramic substrate metallization process. Background technique [0002] Ceramic materials can be divided into three categories: structural ceramics, electronic ceramics, and bioceramics. Ceramic materials dominate the world of new materials with excellent properties such as high temperature resistance, super strength, and multi-function. Advanced ceramics or new ceramics are likely to replace steel and other metals in a wide range and be widely used to save energy, improve efficiency, and reduce costs. [0003] In recent years, ceramic materials have been widely used in the electronics industry. For example, with the development of the electronic packaging industry in the direction of high density and high speed, the rapid and effective heat dissipation of the package body has become one of the key issues. For this reason, printed ...

AI Technical Summary

Problems solved by technology

U.S. Patent U.A pat NO.4008343 uses a colloidal palladium pretreatment solution to enable the electroless plating to proceed smoothly, but the adhesion between the substrate and the coating is not strong

[0008] The above methods have some problems to varying degrees, such as: the W-Mn method has complex process flow, many procedures, and a long production cycle; the active metal method has unstable quality and low high-temperature connection strength; although the vacuum method is easy to use, it is expensive and difficult to batch Production; chemical vapor deposition method, complex equipment, not easy to produce, etc.; and chemical plating method has simple equipment, cheap price, and is convenient for batch automated production