Substrate and manufacturing method of substrate

A manufacturing method and substrate technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve problems such as malfunction, and achieve the effects of increasing the contact area, ensuring integrity, and improving heat dissipation.

Inactive Publication Date: 2021-03-12
MEIKO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, semiconductors using Si will cause malfunctions and failures when the ambient temperature becomes 100°C or higher.

Method used

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  • Substrate and manufacturing method of substrate
  • Substrate and manufacturing method of substrate
  • Substrate and manufacturing method of substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030]Such asfigure 1 andfigure 2 As shown, the substrate 1 of the present invention is mainly configured to have a laminated wiring plate 3 which is referred to as a plurality of conductive layer 2 (also including the double panel). infigure 1 In the example, a so-called four-layer plate formed with a four-layer conductive layer 2 is shown. The conductive layer 2 is formed in each layer as a conductor pattern. An insulating layer 4 is disposed between the conductive layer 2. The insulating layer 4 is formed, for example, by an insulating material such as a prepreg. In more detail, the insulating layer 4 is used, for example, a prepreg of a sheet-like glass cloth 5 in an epoxy resin, which is woven by a glass fiber yarn.

[0031]A through hole 6 is formed on the laminate plate 3. The through hole 6 runs through the laminated line plate 3. The well shape of the through hole 6 is a substantially cylindrical shape. In the plan view of the lamination line plate 3, the through hole 6 is plo...

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PUM

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Abstract

The substrate includes: a laminated wiring board formed with a conductive layer; a through hole penetrating through the laminated wiring board; a through hole plating layer (7) electrically connected to the conductive layer; and a metal sheet (10) arranged on the through hole plating layer Inside of (7), a protrusion (8) directly in contact with the through-hole plating (7) and a separation portion (9) at a position spaced from the through-hole plating (7) are formed on the side of the metal sheet (10) , the space surrounded by the separation part (9) and the through-hole plating layer (7) is covered with a metal plating film (13), and the inner side of the plating film (13) is filled with a filling material (14).

Description

Technical field[0001]The present invention relates to a substrate and a substrate manufacturing method, and the substrate is a substrate such as a printed wiring board, and is being embedded in a metal sheet, a large current characteristic, and the heat dissipation characteristics are excellent.Background technique[0002]The semiconductor element in the circuit has a tendency to increase by heat generation due to high density and high currentization. In particular, when the SI-using Si is used as a cause of malfunction and failure when the temperature is 100 ° C or above. As a heat generating member such as such a semiconductor element, for example, there is a switching element such as an IGBT (Intelligent Power Module), an IPM (Intelligent Power Module).[0003]In order to effectively cool the heat generating member, the heat dissipation path is formed such that the heat generated from the heat generated by the heat generated toward the opposite side of the substrate. Specifically, co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/46
Inventor 高林纯平关保明牧野直之
Owner MEIKO ELECTRONICS CO LTD
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