Non-cyanide alkaline copper plating bath, preparation and use method thereof

An alkaline and electroplating copper technology, applied in the field of electroplating, can solve the problems of staying in the experimental research stage and not fully using industrial production, and achieve the effects of good appearance and color, easy wastewater treatment, and simple components

Inactive Publication Date: 2009-10-07
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Several other processes also have different defects, basically stay in the expe

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Plating solution composition:

[0020] Hydroxyethylene diphosphonic acid 120g / L

[0021] Basic copper carbonate 12g / L

[0022] Potassium hydroxide 30g / L

[0023] Tripotassium citrate 30g / L

[0024] Potassium nitrate 6g / L

[0025] Preparation method:

[0026] ①Use distilled water to make basic copper carbonate into a paste; ②Use distilled water to dissolve hydroxyethylene diphosphonic acid, add hydrogen peroxide to oxidize the reducing components, and then add potassium hydroxide or sodium hydroxide solution to adjust the pH to Between 8.0 and 9.0; ③ Under stirring conditions, slowly add solution ① to solution ② to make it fully complexed; ④ Dissolve tripotassium citrate and potassium nitrate in distilled water, and add them to solution ③ in succession ; ⑤ Use potassium hydroxide or sodium hydroxide to adjust the pH value of the plating solution to between 12 and 13; ⑥ Use distilled water to make up the volume before use.

[0027] During electroplating, the cathode...

Embodiment 2

[0029] Plating solution composition:

[0030] Hydroxyethylene diphosphonic acid 180g / L

[0031] Basic copper carbonate 20g / L

[0032] Potassium hydroxide 40g / L

[0033] Sodium Potassium Tartrate 35g / L

[0034] Potassium nitrate 4g / L

[0035] Preparation method:

[0036] ①Use distilled water to make basic copper carbonate into a paste; ②Use distilled water to dissolve hydroxyethylene diphosphonic acid, add hydrogen peroxide to oxidize the reducing components, and then add sodium hydroxide or potassium hydroxide solution to adjust the pH to Between 8.0 and 9.0; ③ Under stirring conditions, slowly add solution ① to solution ② to make it fully complexed; ④ Dissolve potassium sodium tartrate and potassium nitrate in distilled water, and add them to solution ③ successively; ⑤Use sodium hydroxide or potassium hydroxide to adjust the pH value of the plating solution to between 12 and 13; ⑥Use distilled water to make up the volume before use.

[0037] The cathodic current density...

Embodiment 3

[0039] Hydroxyethylene diphosphonic acid 150g / L

[0040] Copper sulfate 35g / L

[0041] Potassium hydroxide 30g / L

[0042] Sodium Potassium Tartrate 30g / L

[0043] Potassium nitrate 6g / L

[0044] Preparation method:

[0045] ①Dissolve copper sulfate in distilled water to a transparent solution; ②Dissolve hydroxyethylene diphosphonic acid in distilled water, add hydrogen peroxide to oxidize the reducing components, and then add sodium hydroxide or potassium hydroxide solution to adjust the pH to 8.0~ Between 9.0; ③ Under stirring conditions, slowly add solution ① to solution ② to make it fully complexed; ④ Dissolve tripotassium citrate and potassium nitrate in distilled water, and add them to solution ③ in succession; ⑤ Use sodium hydroxide or potassium hydroxide to adjust the pH value of the plating solution to between 12 and 13; ⑥ Use distilled water to make up the volume and use it.

[0046] The cathodic current density of the copper electroplating solution during electr...

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PUM

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Abstract

The present invention is a new non-cyanide alkaline copper plating bath, preparation and use method thereof. In the copper plating bath, using copper sulfate or basic copper carbonate as main salt, using hydroxy-ethylidene diphosphonic acid as main complexant, using trisodium citrate, potassium citrate or potassium sodium tartrate as auxiliary complexant, using sodium nitrate or potassium nitrate as conductive salt, using sodium hydroxide or potassium hydrate as pH value regulator; the operation conditions are: cathode current density is 0.5-3.0 A/dm [2], pH of plating bath controlled between 12 and 13, plating bath temperature is 50-70 DEG. Comparing with the prior known technology, the invention has following advantages or positive effects: simple plating bath formula, easy control and operation, wide temperature range of plating bath using, high current efficiency, fine crystallization coating, good appearance color, stable plating bath, strong uniform plating and covering ability, low cost, easy wastewater treatment. The invention can be used for pre copper plating or direct electro-coppering instead of virulent cyaniding electro-coppering process.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a cyanide-free alkaline copper plating solution and a method for preparing and using the same. Background technique [0002] The cyanide electroplating copper layer has fine crystallization, good bonding force, good leveling, leveling and stability of the plating solution, and can be directly electroplated on steel, zinc and zinc alloy substrate parts. However, the cyanide electroplating copper solution contains cyanide ions, which is highly toxic, difficult to handle waste water and liquid waste, seriously pollutes the environment, and endangers human health. Therefore, people have been looking for a cyanide-free copper plating process that can replace cyanide electroplating copper. The existing cyanide-free copper plating processes mainly include pyrophosphate copper plating, sulfate copper plating, ethylenediamine copper plating, fluoroborate copper plating, citric aci...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 郭忠诚徐瑞东龙晋明周卫铭
Owner KUNMING UNIV OF SCI & TECH
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