Electroless plating solution and method for cladding surfaces of SiC particles with Ni-P through electroless plating solution

A technology of chemical plating solution and surface coating, applied in liquid chemical plating, transportation and packaging, coating and other directions, can solve the problems of low wettability, difficult metal liquid compounding, etc., and achieve dense plating and strong uniform plating ability. , the effect of less pores

Inactive Publication Date: 2017-07-07
SUZHOU JINCANG ALLOY NEW MATERIAL +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In view of this, the inventor of the present invention wishes to provide a kind of new electroless plating solution, does not need complex maintenance technology and long service life in its use process, in addition, the inventor of the present invention also aims to provide a kind of SiC particle surface Activation and sensitization pretreatment activation and sensitization solution to solve the problem of low wettability of SiC particles and difficulty in compounding with metal liquid, and to achieve full coating of SiC particles with nickel-phosphorus

Method used

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  • Electroless plating solution and method for cladding surfaces of SiC particles with Ni-P through electroless plating solution

Examples

Experimental program
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Effect test

Embodiment 1

[0072] Embodiment 1 (orthogonal experiment 20)

[0073] Configure chemical plating solution 250mL, the specific composition of this chemical plating solution is that the concentration of nickel sulfate hexahydrate is 0.20mol / L, the concentration of sodium hypophosphite is 0.333mol / L, the concentration of ammonium sulfate is 0.7mol / L, and the concentration of trisodium citrate is 0.20mol / L. The content is 0.1mol / L, and traces of lactic acid and thiourea, and dilute to 250mL solution with deionized water.

[0074] Take 5 g of activated and sensitized SiC particles and place them in the plating solution (thus, the content of SiC particles in the plating solution is 20 g / L), adjust the pH of the solution to 9.5, and place the reaction system in a water bath at a constant temperature of 40°C. , reacted under magnetic stirring for 60 minutes, after the reaction was completed, the plating solution was left to settle, filtered, placed in a blast drying oven at 80°C, and dried for 10 h...

Embodiment 2

[0078] Embodiment 2 (orthogonal experiment 16)

[0079] Configure 250mL of chemical plating solution, the chemical plating solution composition is nickel sulfate hexahydrate concentration is 0.20mol / L, the concentration of sodium hypophosphite is 1.0mol / L, the concentration of ammonium sulfate is 0.8mol / L, the content of trisodium citrate 0.2mol / L, and traces of lactic acid and thiourea, dilute to 250mL solution with deionized water.

[0080] Take 5 g of activated and sensitized SiC particles and place them in the prepared plating solution (thus, the content of SiC particles in the plating solution is 20 g / L), adjust the pH of the solution to 10, and place the reaction system in a water bath at 40°C React in a constant temperature water bath for 60 minutes under magnetic stirring. After the reaction, the plating solution is left to settle, filtered, and dried in a blast drying oven at 80°C for 10 hours to obtain nickel-coated SiC particles. Figure 6 It is the SEM photo of th...

Embodiment 3

[0084] Embodiment 3 (orthogonal experiment 23)

[0085] Configure chemical plating solution 250mL, the composition of this chemical plating solution is that the concentration of nickel sulfate hexahydrate is 0.25mol / L, the concentration of sodium hypophosphite is 0.625mol / L, the concentration of ammonium sulfate is 0.6mol / L, and the concentration of trisodium citrate is 0.25mol / L. The content is 0.1mol / L, and traces of lactic acid and thiourea, and dilute to 250mL solution with deionized water.

[0086] Take 5g of activated and sensitized SiC particles and place them in the prepared plating solution (thus, the content of SiC particles in the plating solution is 20g / L), adjust the pH of the solution to 10, and place the reaction system in a water bath at 45°C React in a constant temperature water bath for 60 minutes under magnetic stirring. After the reaction, the plating solution is left to settle, filtered, and dried in a blast drying oven at 80°C for 10 hours to obtain nicke...

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Abstract

The invention relates to an electroless plating solution which is used for cladding the surfaces of SiC particles with Ni-P, and further relates to a method for cladding the surfaces of the SiC particles with Ni-P through the electroless plating solution. The method comprises the following steps that (1) SiC surface cleaning treatment is conducted; (2) the SiC particles are coarsened; (3) the SiC particles are activated and sensitized; (4) the electroless plating solution is prepared, and plating is conducted; and (5) electroless plating aftertreatment is conducted. The SiC surface cladding effect is the best when the concentration of [Ni2+] in the electroless plating solution is 0.25 mol / L, the concentration of [NH4+] is 0.6 mol / L, the concentration ratio of [Ni2+] to [H2PO2-] is 0.4, the concentration of citric acid is 0.1 mol / L, and trace lactic acid and thiourea exist. The electroless plating solution is used for complete nickel cladding of the SiC particles, and the problem that the SiC particles are low in wettability and consequently the SiC particles are difficult to composite with molten metal is solved; and the electroless plating solution is low in maintaining cost and long in service life.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of micron particles, and in particular relates to an electroless plating solution for coating Ni-P on the surface of SiC particles. Method and SiC particles obtained therefrom. Background technique [0002] Traditional superalloys require a large grain size or even a single crystal. This is because the smaller the grain size of the alloy material, the larger the grain boundary area, and the easier the diffusion of atoms. Therefore, under the action of high temperature and stress, through the tilting of the grain Plastic deformation occurs with deformation, which accelerates the creep rate of the alloy material and shortens its high temperature durability. The ceramic particles with high melting point distributed in the grain boundary have obvious grain boundary pinning effect, which greatly reduces the diffusion speed of metal atoms along the grain boundary. At the same time, the grain ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36B22F1/02
CPCC23C18/1639C23C18/1893C23C18/36B22F1/17
Inventor 戴挺朱琳赵勇孙飞
Owner SUZHOU JINCANG ALLOY NEW MATERIAL
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