Leveling agent, metal electroplating composition containing leveling agent, preparation method and application thereof

A technology of metal electroplating and composition, applied in the field of metal electroplating composition and leveling agent, can solve the problems of lack, low impurity of plating layer, small surface roughness and the like

Active Publication Date: 2017-11-10
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to solve the problem in the art that lacks a metal electroplating composition that can achieve no voids and defects, low coating impurities, good throwing property, compact structure, and small surface roughness, and provides a leveling Agent, metal electroplating composition containing it, preparation method and application

Method used

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  • Leveling agent, metal electroplating composition containing leveling agent, preparation method and application thereof
  • Leveling agent, metal electroplating composition containing leveling agent, preparation method and application thereof
  • Leveling agent, metal electroplating composition containing leveling agent, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0069] Preparation Example 1 Preparation of leveling agent 1

[0070] Tetrazole (100 mmol) and sodium hydride (11 mmol) were dissolved in 50 mL of anhydrous tetrahydrofuran. The mixture was stirred and cooled in an ice bath for 2 hours until hydrogen evolution ceased. 1,4-Dibromobutane (50 mmol) was added and the mixture was stirred at room temperature for 12 hours. After removing the precipitate, the solvent was removed to obtain 1,4-bis(tetrazolyl)butane.

[0071] 1,4-Bis(tetrazolyl)butane (10 mmol) and 1,4-dibromobutane (10 mmol) were dissolved in dimethylformamide and the mixture was heated at 100°C for 24 hours. The resulting precipitate (leveler 1) was collected by filtration and washed with ethyl acetate. Mn was found to be 4,016 and Mw was found to be 6,506.

preparation Embodiment 2

[0072] Preparation Example 2 Preparation of leveling agent 2

[0073] Methyl tetrazole (100 mmol) and sodium hydride (11 mmol) were dissolved in 50 mL of anhydrous tetrahydrofuran. The mixture was stirred and cooled in an ice bath for 2 hours until hydrogen evolution ceased. 1,4-Dibromobutane (50 mmol) was added and the mixture was stirred at room temperature for 12 hours. After removing the precipitate, the solvent was removed by evaporation to obtain 1,4-bis(methyltetrazolyl)butane.

[0074] Dissolve 1,4-bis(methyltetrazolyl)butane (1.16g, 4mmol), 1,4-bis(tetrazolyl)butane (1.14g, 6mmol) and 1,4-dibromobutane The mixture was heated in dimethylformamide at 100°C for 24 hours. The resulting precipitate (leveler 2) was collected by filtration and washed with ethyl acetate. According to the NMR results, the molar ratio of methyl tetrazolyl to tetrazolyl in product 1 was 0.75. Mn was found to be 4,102 and Mw was found to be 15,304.

preparation Embodiment 3

[0075] Preparation Example 3 Preparation of leveling agent 3

[0076]Methyl tetrazole (4 mmol), tetrazole (6 mmol) and sodium hydride (11 mmol) were dissolved in 50 mL of anhydrous tetrahydrofuran. The mixture was stirred and cooled in an ice bath for 2 hours until hydrogen evolution ceased. 1,4-Dibromobutane (50 mmol) was added and the mixture was stirred at room temperature for 12 hours. After removing the precipitate by filtration, 50 ml of dimethylformamide and 10.8 g of 1,4-dibromobutane (50 mmol) were added. The mixture was heated at 100°C for 24 hours. The resulting precipitate (leveler 3) was collected by filtration and washed with ethyl acetate. According to the NMR results, the molar ratio of methyl tetrazolyl to tetrazolyl in product 2 was 1.12. Mn was found to be 3,224 and Mw was found to be 11,583.

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Abstract

The invention discloses a leveling agent, a metal electroplating composition containing the leveling agent, a preparation method and the application thereof. The raw materials of the metal electroplating composition comprise a metal electroplating solution and the leveling agent, wherein the metal electroplating solution comprises copper salt, acidic electrolyte, halide ion source and water. The preparation method of the leveling agent comprises the following step: in a second organic solvent, one or more Rxs and one or more compounds with the structure as shown in the formula I are subjected to reaction. The metal electroplating composition can be used in a printed circuit board electroplating technology and an integrated circuit copper interconnection electroplating technology, the effects that no voids and defects exists, the impurities of the coating are low, the uniformity of plating is good, the structure is compact and the surface roughness is small can be achieved, and the metal electroplating composition has good industrial application value. (Please see the figure (I) in the specification for the formula of reaction.)

Description

technical field [0001] The invention belongs to the field of semiconductor materials, and in particular relates to a leveler, a metal electroplating composition containing it, a preparation method and an application. Background technique [0002] With the development of Very Large Scale Integration (VLSI) and Ultra Large Scale Integration (ULSI), the level of integration continues to increase, and circuit components become more and more dense. Chip interconnection has become a key factor affecting chip performance. The reliability of these interconnect structures plays a very important role in the success of VLSI and ULSI and the improvement of circuit density. However, the scaling down of interconnect lines in VLSI and ULSI technologies has placed additional demands on processing capabilities due to size constraints of the circuitry. Such requirements include precise machining of multi-layered, high-aspect-ratio structural features. [0003] As the circuit density increas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 王溯施立琦高学朋
Owner SHANGHAI SINYANG SEMICON MATERIALS
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