28results about How to "Uniform thickness distribution" patented technology

The invention provides a control method for the rolling force of a temper mill and related equipment, and relates to the technical field of metallurgical production, the method comprises the steps that pattern information of strip steel is obtained, and the pattern information comprises width information and thickness information; determining the height of an inlet and the height of an outlet of the anti-wrinkling roller based on the model information; determining the diameter of a working roll based on the model information; determining inlet tension and outlet tension according to the diameter of the working roll; and controlling the rolling process of the temper mill based on the height of the inlet of the anti-wrinkling roller, the height of the outlet of the anti-wrinkling roller, the inlet tension and the outlet tension.

The invention provides a solid waste-emulsified asphalt cold recycled mixture and a preparation method thereof, and belongs to the technical field of road engineering materials. According to the invention, asphalt mixture reclaimed materials (RAP), new aggregates, mineral powder, a cementing material, water and emulsified asphalt are used as raw materials, wherein the cementing material adopts blast furnace slag powder and fly ash to replace part of cement. By improving the mixing process, the cold recycling mixture is mixed more uniformly, so that the asphalt film thickness distribution on the surfaces of different types of aggregates after demulsification of the emulsified asphalt is uniform; the macroscopic pavement performance such as volume parameters, mechanical strength, water stability, high-temperature performance and low-temperature performance of the blast furnace slag powder-fly ash-emulsified asphalt cold recycled mixture sample is effectively improved.

The invention provides a bonding structure, a chip and a preparation method of the bonding structure. The bonding structure comprises a first stacking sheet, a second stacking sheet and a bonding layer, the bonding layer is deposited between the first stacking piece and the second stacking piece so as to bond the first stacking piece and the second stacking piece; and the bonding layer is made of an inorganic material and can absorb energy of laser to realize de-bonding. According to the bonding structure, the inorganic substance compatible with the microelectronic technology is adopted as the material of the bonding layer, and the inorganic substance is used for absorbing laser energy in the de-bonding process and converting the laser energy into heat energy to destroy the physicochemical properties or local vaporization of the original bonding layer, so that de-bonding of the bonding structure is realized. The technology implemented by the structure is completely compatible with the modern microelectronic technology, and meanwhile, the risk of fragments of the bonding structure in the de-bonding process is reduced, so that the de-bonding efficiency of the bonding structure is also improved.

The invention provides an optical imaging lens. The optical imaging lens can be used for near-infrared band imaging, the optical imaging lens comprises a lens barrel, a lens group and a spacing element group, and the lens group comprises a first lens, a second lens, a third lens and a fourth lens; the spacing element group comprises a first spacing element and a second spacing element, and the effective focal length f2 of the second lens, the center thickness CT2 of the second lens on the optical axis and the distance EP12 between the image side surface of the first spacing element and the object side surface of the second spacing element in the extension direction of the optical axis meet the condition that f2 / (CT2 + EP12) is greater than or equal to 1.03 and less than or equal to 2.88; the curvature radius R3 of the object side surface of the second lens and the outer diameter D1m of the image side surface of the first spacing element satisfy the following relation:-1.93 < = R3 / D1m < =-0.41. The optical imaging lens solves the problem of serious stray light caused by improvement of assembly stability of an optical imaging lens in the prior art.

The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer wax polishing process and a silicon wafer wax polishing device.The silicon wafer wax polishing process comprises the following steps that S1, a polished wafer is placed on a wax polishing disk for wax surface mounting, the silicon wafer is continuously rotated for 1-60 s, and the back surface of the silicon wafer is coated with liquid wax under the action of centrifugal force; and S2, a physical and chemical dual-combined cleaning mode is adopted for cleaning, the polishing disc is cleaned through the combined action of a brush and a dewaxing cleaning agent firstly, then the polishing disc is put into a cleaning machine with an ultrasonic device for secondary cleaning, and the polishing disc is recycled after being cleaned. According to the silicon wafer wax polishing process and the polishing device, more uniform wax film thickness distribution is obtained by seeking the optimal rotating speed and continuous rotating time, and the silicon polished wafer is better in local flatness and higher in yield after chemical mechanical polishing. The polishing disc dewaxing cleaning method is improved, and the polishing disc dewaxing cleaning method can be used for better cleaning the polishing disc in a wax polishing process.

The invention relates to a photovoltaic module and a preparation method thereof. The photovoltaic module comprises first packaging front plate glass, a front layer packaging adhesive film layer, a semi-finished product laminated piece, a rear layer packaging adhesive film layer and first packaging cover plate glass which are stacked in sequence, the semi-finished product laminated piece comprises second packaging front plate glass, a first adhesive film layer, a battery piece array layer, a second adhesive film layer and second packaging cover plate glass which are stacked in sequence; the second packaging front plate glass is attached to a front packaging adhesive film layer; the second packaging cover plate glass is attached to a rear packaging adhesive film layer; the second packaging front plate glass and the second packaging cover plate glass are made of non-tempered glass; the first packaging front plate glass and the first packaging cover plate glass are made of at least one of tempered glass or semi-tempered glass. According to the invention, the edge of the module has no overpressure phenomenon, the glass and the adhesive film have no stress concentration phenomenon, the thickness distribution is uniform, the phenomena of delamination, relaxation and the like caused by stress release of the edge of the module in an outdoor actual use environment can be prevented, and the reliability of the module is improved.

This invention provides a multi-directional air intake silicon carbide coating chemical vapor deposition (CVD) device, belonging to the technical field of CVD equipment. It includes a CVD device body, a gas delivery system, and a control system. The CVD device body has a reaction chamber with gas inlets on its sidewalls, top, and bottom. The gas delivery system has a gas output end, which is connected to the gas inlets on the sidewalls and top of the reaction chamber via pipelines, and is used to introduce gas into the reaction chamber. The control system is connected to the gas delivery system and is used to control the gas flow rate and pressure in the multiple pipelines. By providing gas inlets at the top, bottom, and sidewalls of the reaction chamber and controlling the gas flow rate and pressure in the pipelines, this invention can control the gas flow into the reaction chamber from different directions, achieving multi-directional air intake and ensuring a uniform silicon carbide coating thickness distribution to meet processing requirements.

The application discloses a fast-axis collimating lens and an optical device with the same, and relates to the technical field of laser optical elements. The fast-axis collimating lens comprises a cylindrical base and a composite film layer arranged in sequence along the direction of incident light. The light-in surface of the cylindrical base is a plane, the light-out surface of the cylindrical base is a convex surface, and the radius of curvature of the cylindrical base is greater than 2.5 mm. The composite film layer comprises at least one high-refractive-index transmission film layer, and the refractive index of the high-refractive-index transmission film layer ranges from 1.8 to 2.4. The fast-axis collimating lens is used to realize the collimating function by the synergic design of the film layer and the base structure, the low-convexity base is matched with the high-refractive-index transmission film layer, the processing and integration are facilitated, and the optical and mechanical properties are effectively improved.

The utility model relates to a concrete aggregate conveying mechanism, including frame, be provided with the transmission belt of inclination on the frame, the top of transmission belt lower extreme is provided with the fairing of vertical or inclination, the upper end of fairing is provided with the feed port, and the lower extreme is provided with the discharge gate, and the inside of fairing is provided with the flow guide chamber, and the section of flow guide chamber is rectangular, and the width direction of flow guide chamber is parallel to the width direction of transmission belt, and the thickness of flow guide chamber decreases from top to bottom, the inside of flow guide chamber is provided with multiple material distribution columns. Aggregate reaches material distribution column, will move downward from the both sides of material distribution column, promote aggregate more dispersed, because the thickness of flow guide chamber gradually reduces, aggregate will gradually disperse from the middle to the both sides of flow guide chamber, and the thickness distribution of aggregate is more uniform, finally, after being discharged from the discharge gate of the lower extreme of flow guide chamber and falling on the transmission belt, can be more evenly distributed to the middle and edge position of transmission belt, make the load that transmission belt middle and edge position bears more uniform.

The application discloses a packaging board, a preparation method thereof and a chip packaging structure. First, a substrate is provided, and a first through hole is formed by patterning the substrate, the first through hole penetrating the substrate in a thickness direction, the first through hole having a first axis, the first through hole having a first opening and a second opening oppositely arranged in the thickness direction, and the aperture of the first opening being smaller than that of the second opening. Then, a buffer structure is filled in the first through hole, and a second through hole is formed by patterning the buffer structure, the second through hole penetrating the buffer structure in the thickness direction, the second through hole having a second axis, and the first axis and the second axis being arranged in a same line. Finally, a conductive structure is prepared, and the conductive structure is located in the second through hole. The first axis and the second axis are arranged in the same line, the thickness distribution of the buffer structure around the conductive structure is uniform, the stress generated due to the difference in thermal expansion coefficients between the substrate and the conductive structure is effectively buffered, and the risk of crack generation is reduced.

The present invention relates to a preparation process of an ultra-clean fusible polytetrafluoroethylene joint, and belongs to the technical field of ultra-clean plastic joints. It mainly includes the following steps: S1, PFA material pretreatment; S2, mold surface treatment; S3, extrusion; S4, injection molding and rapid and uniform heating and rapid solidification through high-temperature and high-pressure steam treatment; S5, pressure holding; S6, demolding; S7, heat treatment to eliminate the internal stress caused by the PFA joint molding process and improve the mechanical properties of the PFA joint; S8, post-treatment. The preparation process of the present invention is simple, and the prepared fusible polytetrafluoroethylene joint has good cleanliness, low metal ion precipitation rate, low microparticle precipitation rate, and the joint has good hardness, dimensional precision, and anti-penetration performance.

The present application relates to the technical field of bipolar plate, in particular to a liquid flow battery flow channel bipolar plate with positive and negative staggered rib parts and wave-shaped reinforcement, comprising: a bipolar plate substrate, a flow channel unit, a rib part unit; a first surface is provided with a first flow channel unit and a first rib part unit, a second surface is provided with a second flow channel unit and a second rib part unit, the first flow channel unit and the second rib part unit correspond to each other in positive and negative directions of the bipolar plate substrate, and the second flow channel unit and the first rib part unit correspond to each other in positive and negative directions of the bipolar plate substrate; the flow channel unit is a wave-shaped flow channel, a chamfer is arranged between the first rib part unit and the first flow channel unit, and a chamfer is arranged between the second rib part unit and the second flow channel unit. The present application makes the flow channel bipolar plate have higher structural rigidity and fracture resistance when bearing bending load.

The present invention discloses a double V-shaped liquid hydrostatic guide rail for diaphragm feedback throttling, comprising a base, a fixed guide rail, a first sliding guide rail, a slider, a double diaphragm feedback throttle, a valve seat, and a second sliding guide rail; the fixed guide rail is fixed on the base, and a first sliding guide rail and a second sliding guide rail slidably connected to the fixed guide rail are respectively arranged on both sides of the fixed guide rail, and the surfaces of the first sliding guide rail and the second sliding guide rail matching with the fixed guide rail are V-shaped, and an oil cavity is arranged on the V-shaped matching surfaces of the first sliding guide rail and the second sliding guide rail; the first sliding guide rail and the second sliding guide rail are fixedly connected to the slider, and the valve seat is fixed on the side of the slider, the left and right ends of the valve seat are connected to the first double diaphragm feedback throttle, and the right end is connected to the second double diaphragm feedback throttle; a total oil inlet hole is arranged on the valve seat, and the total oil inlet hole simultaneously supplies oil to the first and second double diaphragm feedback throttles, and the first and second double diaphragm feedback throttles jointly supply oil to the oil cavity.

This invention relates to a medium-high fluorine, low-alumina slag system for electroslag remelting S-06 stainless steel, belonging to the field of electroslag special metallurgical technology. It addresses the problems of high fluorine content, significant pollution, and poor uniformity of steel ingots produced by existing electroslag remelting slag systems. The mass percentage of each component in the medium-high fluorine, low-alumina slag system of this invention is as follows: CaF2: 56.4%~57.3%, Al2O3: 11.5%~14.9%, CaO: 19.7%~20.2%, MgO: 8.0%~10.0%, SiO2: 0.9%~1.1%, C: 0.04%~0.06%, with the remainder being impurities. The slag system of this invention exhibits good metallurgical effects; when using this slag system for electroslag remelting S-06 stainless steel, the resulting steel ingots show uniform elemental distribution and a uniform slag coating.

The invention provides a bonding structure, a substrate and a preparation method of the bonding structure. The bonding structure comprises a first stacked sheet, a second stacked sheet, a bonding layer and a first anti-reflection layer, the bonding layer is deposited between the first stacking piece and the second stacking piece so as to bond the first stacking piece and the second stacking piece; the first anti-reflection layer is laid on the face, back to the second stacking piece, of the first stacking piece. Wherein the refractive index of the first anti-reflection layer is smaller than that of the first stacked sheet. According to the bonding structure, the first anti-reflection layer with the lower refractive index is prepared on the first stacking sheet, so that the laser transmittance in the de-bonding process is improved. Therefore, the energy waste is reduced, and the utilization rate of the laser is improved. Therefore, the bonding knowing efficiency is improved.

The utility model provides a paper thickness detection device for paper mill workshop, its characterized in being including support structure, pretreatment structure, detection structure, the one side of support structure is provided with pretreatment structure, detection structure, support structure and pretreatment structure, detection structure are connected through bolt, nut, the utility model of improvement pretreatment structure, the pretreatment structure that is composed of telescopic cylinder B, pressing plate, rubber protection sleeve, paper dust dust catcher, collection box, telescopic cylinder B can drive pressing plate and realize accurate up and down movement, through the stable pressure of exerting is even to paper and carries out the even processing, can effectively eliminate paper because of transport, the wrinkle, curling etc. of stacking generation, even after the paper thickness distribution is more even, can pressing plate one side through the rubber protection sleeve connected of adhesive way, avoid the hard pressing plate direct contact and lead to paper edge breakage, indentation or tear, especially suitable for processing thinner, easily broken paper, reduce production cost.

The application relates to the technical field of energy storage material preparation, and particularly discloses a method for improving the thickness of a dry-process lithium battery diaphragm and the obtained dry-process lithium battery diaphragm. The method for improving the thickness of the dry-process lithium battery diaphragm comprises the following steps: S1. selecting polypropylene resin as a base material; S2. feeding the polypropylene resin particles into an extruder; S3. regulating the die lip opening to prepare a thickness-compensated casting film; and S4. performing heat treatment and tensile setting on the thickness-compensated casting film to prepare a dry-process lithium battery diaphragm with uniform thickness distribution. The dry-process lithium battery diaphragm prepared by the method has uniform thickness distribution, and the appearance defects such as burst muscle and diagonal printing folds of the diaphragm during slitting and winding are greatly improved, so that the production yield and use quality of the diaphragm are improved.

The invention discloses an automobile exhaust silencing package shell forming process and a forming processing system thereof, blanking of an upper half shell material piece and a lower half shell material piece is carried out respectively, and the contours of the upper half shell material piece and the lower half shell material piece adopt two contour shapes respectively according to the forming sequence of multi-opening end structure molded surfaces of the upper half shell material piece and the lower half shell material piece; shell body molded surfaces, bevel end molded surfaces and multi-port end local molded surfaces of the two half shell structures are formed through a pre-forming mold, then the multi-port end molded surfaces are completely formed through a forming mold, and the pre-formed molded surfaces serve as positioning molded surfaces during complete forming; wherein the multi-port end, deviating to the side half shell, of the air inlet is firstly preformed into an outer side outline molded surface and then is completely molded into a multi-port end molded surface; and the multi-port end, deviating from the side half shell, of the air inlet is firstly pre-molded with an inner convex functional surface, and then is completely molded into a multi-port end molded surface. The problem that the exhaust silencing bag with the complex profile is poor in forming quality due to the adoption of a common process is solved.

The invention relates to the technical field of semiconductor manufacturing equipment, and discloses an ESC automatic bonding device, the ESC comprises a chuck main body and a substrate, the chuck main body and the substrate are laminated, the chuck main body and the substrate are provided with positioning holes corresponding in position, and the device comprises a rotating assembly; the base is arranged at the output end of the rotating assembly and used for placing the chuck body, and a positioning pin is arranged on the base; a moving assembly; and the clamping assembly is arranged at the output end of the moving assembly and used for clamping the substrate. The chuck has the beneficial effects that the substrate can be automatically placed on the adhesive layer coated on the chuck main body, the contact surfaces between the chuck main body and the substrate are kept parallel in the placement process of the substrate, air is prevented from entering the adhesive layer to generate bubbles, uniform pressure is applied to the substrate, the thickness distribution of the adhesive layer is uniform, and the production efficiency is improved. The bonding strength between the chuck body and the substrate is improved, and the production efficiency is improved.

The invention discloses a package carrier and a preparation method thereof, and a chip packaging structure, and the method comprises the steps: firstly, providing a substrate, carrying out the patterning of the substrate, forming a first through hole, enabling the first through hole to penetrate through the substrate in the thickness direction of the substrate, and enabling the first through hole to be provided with a first axis; the first through hole is provided with a first opening and a second opening which are oppositely arranged in the thickness direction, and the aperture of the first opening is smaller than that of the second opening. The first through hole is filled with a buffer structure, the buffer structure is patterned to form a second through hole, the second through hole penetrates through the buffer structure in the thickness direction, the second through hole is provided with a second axis, and the first axis and the second axis are collinear. And finally, preparing a conductive structure, wherein the conductive structure is located in the second through hole. The first axis and the second axis are collinear, so that the thickness distribution of the buffer structure around the conductive structure is uniform and consistent, the stress generated by the difference of thermal expansion coefficients between the substrate and the conductive structure is effectively buffered, and the risk of crack generation is reduced.

The present invention belongs to the technical field of powder metallurgy, and specifically provides a molybdenum alloy target material and a preparation method and application thereof. The preparation method of the molybdenum alloy target material comprises the following steps: preparing raw materials: weighing and mixing raw materials according to the mass ratio of each element of the target material, the target material comprises the following components in mass percentage, Ni: 10% to 30%, Ti: 5% to 25%, W: 1% to 20% and Re: 0.5% to 5%, the remainder being Mo and unavoidable impurities, and the mass percentage of Mo is ≥50%; cold isostatic pressing; hot isostatic pressing; hot rolling; annealing. The target material prepared by the method of the present application has good plastic toughness, good deformation ability, and fine and uniform grains. The thickness distribution of the thin film deposited by sputtering of the target material prepared by the present application is more uniform, and it can be attached to the main conductive layer of the laminated wiring film for electronic components by sputtering to form a metal covering layer, which is used for flat panel displays, thin-film solar energy and semiconductor devices, etc.

The utility model provides an aluminum plastic film and a battery. The aluminum plastic film comprises a base layer, a first heat sealing layer and a second heat sealing layer. In the thickness direction of the aluminum plastic film, one side of the base layer is coated with the first heat sealing layer, a containing groove is formed in the first heat sealing layer, and a groove opening of the containing groove faces the side away from the base layer; the second heat sealing layer is located in the containing groove, and the second heat sealing layer is connected with the bottom wall of the containing groove in the thickness direction of the aluminum plastic film; wherein the melting point of the second heat sealing layer is lower than that of the first heat sealing layer, and the second heat sealing layer is used for bonding the battery cell main body. The battery comprises a battery cell main body and the aluminum plastic film, the battery cell main body is coated with the aluminum plastic film, and the second heat sealing layer is adhered to the battery cell main body, so that the battery cell main body is fixed. According to the aluminum-plastic film and the battery, the thickness uniformity of the battery can be improved, so that the volume energy density of a battery module is improved.

The application discloses an aluminum electrolysis cell with a special-shaped end, which comprises a cell body composed of a cell shell and an inner lining, an anode group, a cathode group and a crossbeam bus structure arranged above the cell body, the cell body comprises two large faces and two end faces, the two end faces are semicircular or trapezoidal, when the end face is semicircular, the cell shell is an elliptical cell shell, and correspondingly, the inner lining is an elliptical inner lining, when the end face is trapezoidal, the cell shell is a flat octagonal cell shell, and correspondingly, the inner lining is a flat octagonal inner lining. The aluminum electrolysis cell can conform to the flowing form of the melt area of the electrolysis cell, improves the uniformity of the hearth and the current distribution, and achieves the purposes of reducing the abnormal cell condition of the electrolysis cell and increasing the operation stability.

The utility model relates to the field of powder coating manufacturing equipment, and particularly discloses a tablet press for powder coating production, which comprises a cooling roller fixing frame, a cooling roller rotationally matched with the cooling roller fixing frame is arranged on the side face of the cooling roller fixing frame, the cooling roller comprises an outer roller, and a first threaded connector fixedly connected with the outer roller is arranged on one side of the outer roller. A water injection nozzle is formed in the side surface of the inner roller; a water inlet pipe is arranged at one end, far away from the outer roller, of the inner roller; a second threaded connector is formed in one end, far away from the water inlet pipe, of the outer roller; a water outlet pipe is arranged outside the second threaded connector and is in threaded connection with the second threaded connector; the water inlet pipe and the water outlet pipe are embedded in the cooling roller fixing frame. A water pump is arranged at the end, away from the cooling roller fixing frame, of the water inlet pipe. According to the tablet press for producing the powder coating, the powder coating is rapidly cooled and cured through the mechanical pressure and the heat conduction effect, the time needed by the powder coating from coating to curing is shortened, and the production efficiency is improved.

This invention discloses a method for preparing a highly textured high-purity copper target. The method includes: annealing a polycrystalline copper block to prepare a high-purity single-crystal copper block; cold rolling the high-purity single-crystal copper block with the rolling direction parallel to the rolling surface, a thinning amount of 80%–98%, and a deformation amount of 5%–20% per pass; quenching the cold-rolled high-purity single-crystal copper block, followed by polishing, to obtain a highly textured high-purity copper target. The grain size of the highly textured high-purity copper target is less than 30 μm, and the proportion of the main texture is greater than 50%. The preparation method disclosed in this invention involves annealing a polycrystalline copper block to prepare a high-purity single-crystal copper block, and then controlling the cold rolling and quenching conditions to regulate the texture and grain size of the high-purity single-crystal copper block, resulting in a highly textured high-purity copper target with a small grain size and a high proportion of the main texture. The magnetron sputtering film formation rate of the strongly textured high-purity copper target disclosed in this invention is high, and the film quality and thickness distribution are uniform.

The invention discloses a PERT multi-layer pipeline and a multi-layer pipeline production device.The multi-layer pipeline comprises a main body layer, a bonding layer, an outer layer and an inner layer, the outer layer is located on the outer side of the main body layer, the bonding layer is located between the main body layer and the outer layer and used for bonding the main body layer and the outer layer, and the inner layer is located on the inner side of the main body layer and used for bonding the main body layer and the outer layer. The main body layer, the bonding layer, the outer layer and the inner layer are of an integrated structure. The multi-layer composite structure is adopted, and the outer layer is made of the oxygen barrier performance material, so that fluid in the pipe can be completely isolated from oxygen; the PERT modified by the scale inhibitor and the antibacterial agent is added into the inner layer, so that the inner wall of the pipeline is prevented from scaling and bacteria are prevented from being generated on fluid in direct contact with the PERT, and the composite pipeline has scale prevention and antibacterial effects; the integrated pipeline is produced by adopting a multi-layer mold technology, and can be widely applied to water system projects such as indoor floor heating, a whole-house water circulation water supply system, home decoration, engineering decoration and assembled building.

The utility model relates to a sole forming mould with uniform stress, which comprises a lower mould plate and an upper mould plate, the front sides of the lower mould plate and the upper mould plate are hinged through a hinge component, the rear side, the left side and the right side of the lower mould plate are respectively provided with an extension seat, each extension seat is hinged with a buckling component, and the buckling components are connected with the lower mould plate and the upper mould plate. When the upper mold plate and the lower mold plate are closed, the buckling and pressing assembly can be buckled and pressed on the upper end face of the upper mold plate in a turning mode. After the upper mold plate and the lower mold plate are closed, the buckling and pressing assemblies on the rear side, the left side and the right side are buckled and pressed on the upper mold plate, so that extruded raw materials are not prone to causing extrusion deformation of the mold cavity in the foaming expansion process, the upper mold plate can be evenly stressed after mold closing, and then it is guaranteed that the thickness of a shoe sole in the mold cavity is evenly distributed; and the production quality of the soles is improved.

This invention relates to a low-fluorine, high-calcium desulfurization slag system for electroslag remelting S-06 stainless steel and its application method, belonging to the field of electroslag special metallurgical technology. It addresses the problems of high fluorine content and pollution in existing electroslag smelting slag systems, resulting in poor uniformity of the prepared steel ingots and uneven, thick slag skin. The mass percentage of each component in the low-fluorine, high-calcium desulfurization slag system of this invention is as follows: CaF2: 38.3%~42.1%, Al2O3: 23.2%~24.8%, CaO: 30.9%~32.8%, MgO: 1.0%~5.0%, SiO2: 0.8%~1.0%, C: 0.07%~0.1%, with the remainder being impurities. The slag system of this invention exhibits good metallurgical effects; when using this slag system for electroslag remelting S-06 stainless steel, the resulting steel ingots have a uniform elemental distribution and a uniform slag skin.