7results about How to "Uniform thickness distribution" patented technology

This invention provides a multi-directional air intake silicon carbide coating chemical vapor deposition (CVD) device, belonging to the technical field of CVD equipment. It includes a CVD device body, a gas delivery system, and a control system. The CVD device body has a reaction chamber with gas inlets on its sidewalls, top, and bottom. The gas delivery system has a gas output end, which is connected to the gas inlets on the sidewalls and top of the reaction chamber via pipelines, and is used to introduce gas into the reaction chamber. The control system is connected to the gas delivery system and is used to control the gas flow rate and pressure in the multiple pipelines. By providing gas inlets at the top, bottom, and sidewalls of the reaction chamber and controlling the gas flow rate and pressure in the pipelines, this invention can control the gas flow into the reaction chamber from different directions, achieving multi-directional air intake and ensuring a uniform silicon carbide coating thickness distribution to meet processing requirements.

The utility model relates to a concrete aggregate conveying mechanism, including frame, be provided with the transmission belt of inclination on the frame, the top of transmission belt lower extreme is provided with the fairing of vertical or inclination, the upper end of fairing is provided with the feed port, and the lower extreme is provided with the discharge gate, and the inside of fairing is provided with the flow guide chamber, and the section of flow guide chamber is rectangular, and the width direction of flow guide chamber is parallel to the width direction of transmission belt, and the thickness of flow guide chamber decreases from top to bottom, the inside of flow guide chamber is provided with multiple material distribution columns. Aggregate reaches material distribution column, will move downward from the both sides of material distribution column, promote aggregate more dispersed, because the thickness of flow guide chamber gradually reduces, aggregate will gradually disperse from the middle to the both sides of flow guide chamber, and the thickness distribution of aggregate is more uniform, finally, after being discharged from the discharge gate of the lower extreme of flow guide chamber and falling on the transmission belt, can be more evenly distributed to the middle and edge position of transmission belt, make the load that transmission belt middle and edge position bears more uniform.

This invention relates to a medium-high fluorine, low-alumina slag system for electroslag remelting S-06 stainless steel, belonging to the field of electroslag special metallurgical technology. It addresses the problems of high fluorine content, significant pollution, and poor uniformity of steel ingots produced by existing electroslag remelting slag systems. The mass percentage of each component in the medium-high fluorine, low-alumina slag system of this invention is as follows: CaF2: 56.4%~57.3%, Al2O3: 11.5%~14.9%, CaO: 19.7%~20.2%, MgO: 8.0%~10.0%, SiO2: 0.9%~1.1%, C: 0.04%~0.06%, with the remainder being impurities. The slag system of this invention exhibits good metallurgical effects; when using this slag system for electroslag remelting S-06 stainless steel, the resulting steel ingots show uniform elemental distribution and a uniform slag coating.

The utility model provides a paper thickness detection device for paper mill workshop, its characterized in being including support structure, pretreatment structure, detection structure, the one side of support structure is provided with pretreatment structure, detection structure, support structure and pretreatment structure, detection structure are connected through bolt, nut, the utility model of improvement pretreatment structure, the pretreatment structure that is composed of telescopic cylinder B, pressing plate, rubber protection sleeve, paper dust dust catcher, collection box, telescopic cylinder B can drive pressing plate and realize accurate up and down movement, through the stable pressure of exerting is even to paper and carries out the even processing, can effectively eliminate paper because of transport, the wrinkle, curling etc. of stacking generation, even after the paper thickness distribution is more even, can pressing plate one side through the rubber protection sleeve connected of adhesive way, avoid the hard pressing plate direct contact and lead to paper edge breakage, indentation or tear, especially suitable for processing thinner, easily broken paper, reduce production cost.

The invention discloses a package carrier and a preparation method thereof, and a chip packaging structure, and the method comprises the steps: firstly, providing a substrate, carrying out the patterning of the substrate, forming a first through hole, enabling the first through hole to penetrate through the substrate in the thickness direction of the substrate, and enabling the first through hole to be provided with a first axis; the first through hole is provided with a first opening and a second opening which are oppositely arranged in the thickness direction, and the aperture of the first opening is smaller than that of the second opening. The first through hole is filled with a buffer structure, the buffer structure is patterned to form a second through hole, the second through hole penetrates through the buffer structure in the thickness direction, the second through hole is provided with a second axis, and the first axis and the second axis are collinear. And finally, preparing a conductive structure, wherein the conductive structure is located in the second through hole. The first axis and the second axis are collinear, so that the thickness distribution of the buffer structure around the conductive structure is uniform and consistent, the stress generated by the difference of thermal expansion coefficients between the substrate and the conductive structure is effectively buffered, and the risk of crack generation is reduced.

This invention discloses a method for preparing a highly textured high-purity copper target. The method includes: annealing a polycrystalline copper block to prepare a high-purity single-crystal copper block; cold rolling the high-purity single-crystal copper block with the rolling direction parallel to the rolling surface, a thinning amount of 80%–98%, and a deformation amount of 5%–20% per pass; quenching the cold-rolled high-purity single-crystal copper block, followed by polishing, to obtain a highly textured high-purity copper target. The grain size of the highly textured high-purity copper target is less than 30 μm, and the proportion of the main texture is greater than 50%. The preparation method disclosed in this invention involves annealing a polycrystalline copper block to prepare a high-purity single-crystal copper block, and then controlling the cold rolling and quenching conditions to regulate the texture and grain size of the high-purity single-crystal copper block, resulting in a highly textured high-purity copper target with a small grain size and a high proportion of the main texture. The magnetron sputtering film formation rate of the strongly textured high-purity copper target disclosed in this invention is high, and the film quality and thickness distribution are uniform.

This invention relates to a low-fluorine, high-calcium desulfurization slag system for electroslag remelting S-06 stainless steel and its application method, belonging to the field of electroslag special metallurgical technology. It addresses the problems of high fluorine content and pollution in existing electroslag smelting slag systems, resulting in poor uniformity of the prepared steel ingots and uneven, thick slag skin. The mass percentage of each component in the low-fluorine, high-calcium desulfurization slag system of this invention is as follows: CaF2: 38.3%~42.1%, Al2O3: 23.2%~24.8%, CaO: 30.9%~32.8%, MgO: 1.0%~5.0%, SiO2: 0.8%~1.0%, C: 0.07%~0.1%, with the remainder being impurities. The slag system of this invention exhibits good metallurgical effects; when using this slag system for electroslag remelting S-06 stainless steel, the resulting steel ingots have a uniform elemental distribution and a uniform slag skin.