Gold-plating process using gold potassium citrate

A technology of gold potassium citrate and process, applied in the field of gold plating process using gold potassium citrate, can solve problems such as affecting the safety of operators, not adapting to the development trend, poor appearance and color, and achieves uniform thickness distribution and operable current. Wide range of densities and easy-to-control effects

Active Publication Date: 2012-12-05
CHENGDU HOMIN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, cyanide gold plating solution contains highly toxic cyanide, which affects the safety of operators and causes environmental pollution
From the perspective of scientific development, potassium gold cyanide products do not adapt to the future development trend of the modern electron

Method used

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  • Gold-plating process using gold potassium citrate

Examples

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Effect test

Embodiment 1

[0034] A gold plating process using gold potassium citrate, which includes the following steps:

[0035] S1. Electrolytic degreasing, put the workpiece into solution A for electrolytic degreasing, the time is 12s, then wash and dry the workpiece;

[0036] S2, solid acid activation, put the workpiece into the solid acid solution for pickling, the pickling time is 12s, then wash and dry the workpiece;

[0037] S3, hydrochloric acid activation, the workpiece is put into the hydrochloric acid solution for pickling, the pickling time is 12s, then the workpiece is washed and dried;

[0038] S4, pre-nickel plating, pre-nickel plating treatment is carried out on the surface of the workpiece, and then the workpiece is washed and dried;

[0039] S5, nickel plating, electroplating metallic nickel in four times, each electroplating time is 12s, wash and dry the workpiece after electroplating metallic nickel each time;

[0040] S6, high-temperature nickel, carry out high-temperature enha...

Embodiment 2

[0056] A gold plating process using gold potassium citrate, which includes the following steps:

[0057] S1. Electrolytic degreasing, put the workpiece into solution A for electrolytic degreasing, the time is 13s, then wash and dry the workpiece;

[0058] S2, solid acid activation, put the workpiece into the solid acid solution for pickling, the pickling time is 14s, then wash and dry the workpiece;

[0059] S3, hydrochloric acid activation, the workpiece is put into the hydrochloric acid solution for pickling, the pickling time is 13s, then the workpiece is washed and dried;

[0060] S4, pre-nickel plating, pre-nickel plating treatment is carried out on the surface of the workpiece, and then the workpiece is washed and dried;

[0061] S5. Nickel plating, electroplating metal nickel in four times, each electroplating time is 13s, after each electroplating metal nickel, the workpiece is washed and dried;

[0062] S6, high-temperature nickel, carry out high-temperature enhance...

Embodiment 3

[0078] A gold plating process using gold potassium citrate, which includes the following steps:

[0079] S1. Electrolytic degreasing, put the workpiece into solution A for electrolytic degreasing, the time is 15s, then wash and dry the workpiece;

[0080] S2, solid acid activation, put the workpiece into the solid acid solution for pickling, the pickling time is 15s, then wash and dry the workpiece;

[0081] S3, hydrochloric acid activation, the workpiece is put into hydrochloric acid solution for pickling, the pickling time is 15s, then the workpiece is washed with water and dried;

[0082] S4, pre-nickel plating, pre-nickel plating treatment is carried out on the surface of the workpiece, and then the workpiece is washed and dried;

[0083] S5. Nickel plating, electroplating metal nickel in four times, each electroplating time is 15s, after each electroplating metal nickel, the workpiece is washed and dried;

[0084] S6, high-temperature nickel, carry out high-temperature ...

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Abstract

The invention discloses a gold-plating process using gold potassium citrate, comprising the following steps: step S1 of electrolyzing and degreasing; step S2 of pickling in the solid acid solution; step S3 of pickling in the hydrochloric acid solution; step S4 of pre-plating nickel; step S5 of plating nickel; step S6 of strengthening nickel plating at a high temperature; step S7 of pickling in the citric acid solution step S8 of pre-plating gold; step S9 of plating gold; step S10 of washing by ultrasonic wave; and step S11 of drying with hot air. The process provided by the invention has the advantages as follows: a gold-leaching plating layer with good adhesiveness and uniform distribution thickness can be formed on a surface of a plated piece matrix; and the plating layer has a better crystal structure and high hardness so as to greatly save cost; operable current density range is wide; production efficiency can be increased; radiance can be controlled easily; the process is safe and pollution-free because cyanogens matters are not used; cost is low; and economic benefit and social benefit are good.

Description

technical field [0001] The invention relates to the technical field of electroplating technology, in particular to a gold plating technology using gold potassium citrate. Background technique [0002] At present, most of the gold salts used for leaching gold are potassium aurous cyanide containing cyanide. Because the cyanide-containing system is leaching gold, the plating solution is stable, the production process is easy to control, and the performance and appearance of the coating are better than those of the cyanide-free system. Therefore, although potassium gold cyanide is a highly toxic product and the waste plating solution is difficult to dispose of, it is still widely used and is the current mainstream technology for electroplating gold. Cyanide gold plating is the earliest and most widely used gold plating technology. However, the cyanide gold plating solution contains highly toxic cyanide, which affects the safety of operators and causes environmental pollution. ...

Claims

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Application Information

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IPC IPC(8): C25D3/48
Inventor 罗建国黄皓刘呈明赵景勋李道
Owner CHENGDU HOMIN TECH
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