7 results about "Middle zone" patented technology

The utility model discloses a pole piece, battery cell and pole piece manufacturing equipment, the pole piece comprises a middle area and two edge areas, along the width direction of the pole piece, the two edge areas are respectively connected with the two ends of the middle area, the middle area is provided with a plurality of first grooves, and the first grooves are respectively connected with the two ends of the middle area. The edge area is provided with a plurality of first grooves, the edge area is provided with a plurality of second grooves, the orientation of an opening of each first groove is the same as that of an opening of each second groove, and the volume of each first groove is larger than that of each second groove. The pole piece disclosed by the utility model can effectively avoid the situation that powder falls off from the edge.

1. Name of the product in this design: Three-function partition freezer (4-4B). 2. Application of this product design: This is an integrated, convenient freezer with an upper zone for refrigeration and preservation, a middle zone for micro-freezing and freshness locking, and a lower zone for constant water temperature control, suitable for aquarium landscaping, aquarium viewing, fruit chilling, beverage chilling, and food storage. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.

The invention provides a simulation method and system for double-sided polishing removal amount, a terminal and a medium, and the method comprises the steps: carrying out the stress analysis of each point on a silicon wafer, and obtaining the contact pressure of each point of the silicon wafer; meanwhile, motion trail analysis is conducted on all points of the silicon wafer, and the motion distances of the points in the inner area, the middle area and the outer area of the polishing pad large disc are determined; and the removal amount of each point of the silicon wafer is calculated based on the obtained movement distance of each point of the silicon wafer in the inner area, the middle area and the outer area of the polishing pad large disc and the contact pressure of each point of the silicon wafer. According to the method, the influence of various factors such as a machine table, pressure and rotating speed is considered, accurate calculation of the double-sided polishing removal rate is achieved, the calculation mode is simple, convenient and efficient, and important guidance and basis can be provided for follow-up DSP process optimization and high-planarization large silicon wafer production.

This invention provides a method for controlling the uniformity of quenching cooling in intensive continuous heat treatment of hot coils, comprising the following steps: (1) using multiple sets of pressure rollers as dividing points, the cooling zone is divided into multiple segments, with the area between two adjacent sets of pressure rollers as one segment. After the strip enters the cooling zone, the tension of each segment of the cooling zone is controlled at 5-35 MPa; (2) spraying facilities for dispensing cooling medium are set at the upper and lower parts of the strip in each segment of the cooling zone; along the width direction of the strip, the surface of the strip is divided into 3-7 zones, with the middle zone as the central zone and the other zones as the edge zones. The air-to-water ratio of each zone is 2:6-6:2, and the flow rate ratio of the edge and central zones is 0.8:1-0.2:1.5; the flow rate ratio of the upper and lower surfaces of the strip provided by the corresponding spraying facilities is 1:2-2:1.

A cover-flap transfer tape construct and associated applicators for paper web turn-up are disclosed. A zone-coated substrate carried on a linered web includes a top-side central web-grabbing adhesive band bounded by uncoated edge zones, and underside edge mounting adhesive bands separated by an uncoated middle zone. An applicator forms an out-of-plane raised profile across a central portion of the tape while maintaining planar side bands, using cooperating forming members (convex crest and complementary cavity) and manual or motorized feed. The formed length is cut to yield a discrete tape construct with the raised profile over the central adhesive and side bands aligned with mounting adhesives. The tape construct promotes reliable interception and transfer of a moving paper web during turn-up.

A showerhead for a substrate processing chamber configured to perform bulk deposition includes a faceplate, a backplate, and a faceplate. The faceplate defines a first plenum corresponding to center and middles zones and a second plenum corresponding to an edge zone. The faceplate includes a first plurality of holes distributed throughout the center zone and the middle zone and a second plurality of holes distributed throughout the edge zone. The middle plate is disposed between the faceplate and the backplate. The faceplate is configured to receive a first gas mixture supplied to the center zone via a center inlet, receive a second gas mixture supplied to the middle zone via a middle inlet, blend the first gas mixture and the second gas mixture within the first plenum, and receive a third gas mixture supplied to the edge zone via an edge inlet.

The application discloses a CSAMT full-area apparent resistivity-depth profile generation method. The horizontal position and vertical position of a recording point are taken as the assignment points of the apparent resistivity; in the far zone, the recording point is located at the detection depth directly below the measuring point; in the middle zone, the radius of the wave front is linearly reduced with the decrease of the induction number, the recording point is located at the intersection of the wave front and the detection depth to the source point straight line and approaches the source point from the measuring point with the decrease of the induction number; in the near zone, with the continuous decrease of the induction number, the horizontal position of the recording point approaches the midpoint of the offset distance from the vicinity of the source point, and the vertical position approaches a certain fixed value proportional to the offset distance from the vicinity below the source point, and the fixed value is equal to the offset distance divided by the critical value of the far zone and the middle zone. The application provides a new, simple, fast method for separating the plane and non-plane wave, eliminating and utilizing the field source copying and shadow effect, and improves the interpretation effect of the apparent resistivity-depth profile.