Chemical silver plating solution and preparation method thereof

A technology of chemical silver plating and silver plating solution, which is applied in the field of chemical plating, can solve the problems of poor electrical conductivity, thermal conductivity and welding performance, waste of prepared solution, poor stability of plating solution, etc., and achieve good weldability, avoid waste, and uniformity The effect of strong plating ability

Inactive Publication Date: 2012-10-24
淮安市曼蒂科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the traditional direct silver plating process using formaldehyde, dimethylaminoborane, and hydrazine as reducing agents has the disadvantages of poor stability of the plating solution, slow deposition rate, coarse grains of the coating, poor bonding force, poor electrical conductivity, thermal conductivity and welding Poor performance, the prepared solution can basically only be used once, so the service life of the plating solution is short
Due to the poor stability of the traditional electroless silver plating solution, the silver salt solution and the reducing agent solution should be prepared separately and mixed before silver plating, which brings great inconvenience to the production operation, and also causes waste of the prepared solution, further Limit the scope of application of traditional silver plating methods

Method used

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  • Chemical silver plating solution and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Every liter of electroless silver plating solution carries out component distribution ratio by the raw material described in table 1:

[0026] Table 1

[0027] Silver nitrate 15g Succinimide 85g tartaric acid 30g Triethanolamine 10g methanesulfonic acid 20g water margin sodium hydroxide Appropriate amount PH value 10

[0028] The composition of electroless silver plating solution in table 1 is prepared according to the following steps:

[0029] (1) Dilute silver nitrate with distilled water to form a transparent solution;

[0030] (2) Dissolve succinimide with distilled water;

[0031] (3) The solution obtained in step (1) is slowly added to the solution obtained in step (2) under stirring conditions;

[0032] (4) Slowly add tartaric acid, triethanolamine and methanesulfonic acid in the solution of step (3), make it fully complexed;

[0033] (5) Add an appropriate amount of sodium hydroxide to the solution ob...

Embodiment 2

[0037] Every liter of electroless silver plating solution carries out component distribution ratio by the raw material described in table 2:

[0038] Table 2

[0039] Silver nitrate 22g Succinimide 115g tartaric acid 22g Triethanolamine 16g methanesulfonic acid 15g water margin Potassium hydroxide Appropriate amount PH value 11

[0040] The components of the electroless silver plating solution in Table 2 were prepared according to the steps described in Example 1.

[0041] The method of using the plating solution: the immersion plating time is 5 minutes at 35°C.

[0042] The present invention will be further described by test below:

[0043] One, implement electroless plating with plating solution provided by the invention

[0044] 1. The silver plating solution provided by the present invention is to carry out chemical silver plating on epoxy resin boards to a batch of substrate materials, and the remaining silver p...

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Abstract

The invention discloses a chemical silver plating solution. The silver plating solution comprises silver nitrate, succimide, tartaric acid, trolamine, methylsulfonic acid and water. The silver plating solution per liter comprises 5-30g of the silver nitrate, 30-160g of the succimide, 10-38g of the tartaric acid and 6-68g of auxiliary complexing agents; alkali is used for adjusting the PH value of the silver plating solution to be in a range of 9-11; the auxiliary complexing agents are the trolamine and the methylsulfonic acid; the silver plating solution per liter comprises 1-38g of the trolamine and 5-30g of the methylsulfonic acid; and the alkali is sodium hydroxide or potassium hydroxide. The silver plating solution has the advantages that comprehensive quality of plating layers of the chemical silver plating solution is good, and the chemical silver plating solution can replace hydrazine, formaldehyde and dimethylamino borane, serves as a reducing agent process and is used for plating silver. The storage performance of the silver plating solution is stable, the waste of the silver plating solution can be avoided, and the application of the silver plating solution is wide. The preparation of the silver plating solution is flexible and the silver plating solution is convenient to use.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an electroless silver plating solution and a preparation method thereof. . Background technique [0002] Electroless silver plating is the earliest chemical plating applied in industry, and it was widely used in making vacuum flasks and mirrors. However, the traditional direct silver plating process using formaldehyde, dimethylaminoborane, and hydrazine as reducing agents has the disadvantages of poor stability of the plating solution, slow deposition rate, coarse grains of the coating, poor bonding force, poor electrical conductivity, thermal conductivity and welding The performance is poor, and the prepared solution can basically only be used once, so the service life of the plating solution is short. Due to the poor stability of the traditional electroless silver plating solution, the silver salt solution and the reducing agent solution should be prepared separat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
Inventor 李桂英符建陈根祥沈浩
Owner 淮安市曼蒂科技发展有限公司
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