Chemical silver plating solution and preparation method thereof

Abstract

The invention discloses a chemical silver plating solution. The silver plating solution comprises silver nitrate, succimide, tartaric acid, trolamine, methylsulfonic acid and water. The silver plating solution per liter comprises 5-30g of the silver nitrate, 30-160g of the succimide, 10-38g of the tartaric acid and 6-68g of auxiliary complexing agents; alkali is used for adjusting the PH value of the silver plating solution to be in a range of 9-11; the auxiliary complexing agents are the trolamine and the methylsulfonic acid; the silver plating solution per liter comprises 1-38g of the trolamine and 5-30g of the methylsulfonic acid; and the alkali is sodium hydroxide or potassium hydroxide. The silver plating solution has the advantages that comprehensive quality of plating layers of the chemical silver plating solution is good, and the chemical silver plating solution can replace hydrazine, formaldehyde and dimethylamino borane, serves as a reducing agent process and is used for plating silver. The storage performance of the silver plating solution is stable, the waste of the silver plating solution can be avoided, and the application of the silver plating solution is wide. The preparation of the silver plating solution is flexible and the silver plating solution is convenient to use.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an electroless silver plating solution and a preparation method thereof. . Background technique [0002] Electroless silver plating is the earliest chemical plating applied in industry, and it was widely used in making vacuum flasks and mirrors. However, the traditional direct silver plating process using formaldehyde, dimethylaminoborane, and hydrazine as reducing agents has the disadvantages of poor stability of the plating solution, slow deposition rate, coarse grains of the coating, poor bonding force, poor electrical conductivity, thermal conductivity and welding The performance is poor, and the prepared solution can basically only be used once, so the service life of the plating solution is short. Due to the poor stability of the traditional electroless silver plating solution, the silver salt solution and the reducing agent solution should be prepared separat...

AI Technical Summary

Problems solved by technology

However, the traditional direct silver plating process using formaldehyde, dimethylaminoborane, and hydrazine as reducing agents has the disadvantages of poor stability of the plating solution, slow deposition rate, coarse grains of the coating, poor bonding force, poor electrical conductivity, thermal conductivity and welding Poor performance, the prepared solution can basically only be used once, so the service life of the plating solution is short

Due to the poor stability of the traditional electroless silver plating solution, the silver salt solution and the reducing agent solution should be prepared separately and mixed before silver plating, which brings great inconvenience to the production operation, and also causes waste of the prepared solution, further Limit the scope of application of traditional silver plating methods

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