Method for filling PCB blind hole by electroplating copper

A technology of electroplating copper and blind holes, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as restricting the development of the PCB industry, and achieve the effects of good plating solution dispersion ability, good bonding force, and fine coating crystallization.

Inactive Publication Date: 2017-05-31
SHAANXI HUANKE BIOLOGICAL TECH CO LTD
View PDF0 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the copper plating solutions for blind holes currently sold in the domestic market are

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] A method for filling PCB blind holes with electroplated copper, comprising the steps of:

[0019] (1) Weigh 330g of CuSO4•5H2O and dissolve it evenly in 1200mL of deionized water, and then slowly add 44mL of concentrated sulfuric acid under constant stirring conditions. After the temperature of the solution drops to room temperature, start to add chloride ions, inhibitors, Accelerator, leveling agent, after stirring evenly, add an appropriate amount of deionized water to make up the volume, and set aside;

[0020] (2) Take 1.5L of the above plating solution and transfer it to the electroplating tank, insert the copper plate and the phosphor copper plate as cathode and anode respectively, and then carry out electrolytic treatment with low current, the current density is 0.5A / dm2, and the time is 5min;

[0021] (3) PCB sample pretreatment: Activate the PCB blind hole plate treated with electroless copper in 10wt% sulfuric acid solution for 1min, rinse it with deionized wa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for filling a PCB blind hole by electroplating copper, and belongs to the field of circuit board manufacturing. The method is characterized by comprising the following steps of: (i) taking CuSO4.5H2O and dissolving CuSO4.5H2O into deionized water, then, adding 44 mL of concentrated sulfuric acid, starting to sequentially add chloride ions, an inhibitor, an accelerator and a leveling agent after a solution is cooled to the room temperature, and uniformly stirring for later use; (2) transferring a plating solution into an electroplating bath, separately inserting a copper plate and a phosphor copper plate as a cathode and an anode, and performing small-current electrolytic treatment; (3) performing PCB sample pre-treatment; and (4) switching on a power supply, and switching off after controlling current density to perform electroplating. According to the method disclosed by the invention, a layer of thin copper is deposited on a hole wall through a chemical plating method, and hole filling treatment is performed by electroplating copper in an acidic copper sulfate plating solution containing an additive until the whole blind hole or buried hole is filled with a deposited copper layer, so that dispersing power of the plating solution is good, crystals of a coating are fine, and binding force is good.

Description

technical field [0001] The invention belongs to the field of circuit board preparation, in particular to a method for filling PCB blind holes with electroplated copper. Background technique [0002] The development trend of electronic products becoming thinner, thinner and smaller has put forward higher requirements for the production of printed circuit boards. At present, high-level printed circuit boards and relatively complex high-density interconnection boards have been widely used in various electronic products. Its market demand continues to rise, and its development prospects are good. The metallization of blind holes is one of the key technologies in the HDI board manufacturing process. At present, the more common treatment method is to deposit copper first, and then electroplate copper to fill the holes. The effect of electroplating copper to fill blind holes has a significant impact on the stability and reliability of electrical signal transmission in printed boar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C25D3/38H05K3/42
CPCC25D3/38H05K3/423
Inventor 郝青
Owner SHAANXI HUANKE BIOLOGICAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap