Stainless steel copper plating process

Abstract

The invention discloses a stainless steel copper plating process. The stainless steel copper plating process comprises the following steps that S1, pretreatment is conducted, specifically, a stainless steel band is cleaned; s2, nickel pre-plating is conducted, specifically, the stainless steel band is transferred into a nickel plating tank for nickel pre-plating, the nickel plating tank is filled with a nickel plating solution, and the nickel pre-plating solution comprises 240 g/L of NiCl26H2O and 120 g/L of HCl; s3, copper plating is conducted, specifically, the stainless steel band subjected to nickel pre-plating is transferred into an electroplating bath containing a copper plating solution to be plated; s4, cleaning is conducted, specifically, the stainless steel band subjected to copper plating is cleaned; s5, gun coloring, wherein the stainless steel band is transferred into an electroplating bath containing a gun coloring solution to be subjected to gun coloring treatment; s6, cleaning is conducted, specifically, the stainless steel band obtained after gun coloring is conducted is cleaned; and S7, drying: drying the cleaned stainless steel band to obtain a finished product.

Description

technical field [0001] The invention relates to the field of electroplating technology, in particular to a copper plating process for stainless steel. Background technique [0002] At present, domestic copper-plated plates are all made of stainless steel veneer. The electroplating process is generally degreasing → water washing → pickling → water washing → electroplating → post-plating treatment → drying. This process has the advantages of fast copper layer deposition and high current efficiency. advantage. The copper sulfate single-salt copper electroplating process is the original process formula in the history of electroplating. Without a complexing agent, it is difficult to control the polarization reaction during the electroplating process. The copper layer is generally directly stacked on the workpiece, so it is rough and loose. This process uses acid copper additives to make the thickness of the surface copper layer uniform. SUMMARY OF THE INVENTION [0003] The p...

AI Technical Summary

Problems solved by technology

Copper sulfate single-salt copper plating process is the original process formula in the history of electroplating. Without complexing agent, it is difficult to control the polarization reaction in the electroplating process. The copper layer is generally piled directly on the workpiece, so it is rough and loose.