5G antenna stannous electroplating process

A tin electroplating and stannous electroplating technology, applied in jewelry and other directions, can solve the problems of failing to meet the requirements of 5G antenna tin plating, poor crystallinity of the coating, low bonding force, etc., to achieve good coating coverage, fine coating crystallization, and bonding good effect

Active Publication Date: 2020-02-14
中山美力特环保科技有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] The plating solution in the alkaline electroplating tin plating process needs to be heated, resulting in increased power consumption. The maximum current density allowed for operation is low, and the theoretical power required is twice that of the acidic spot plating solution. When the current density is low, the tin anode dissolves into sub- Stannate, when the current density increases to a critical value, a golden film will be formed on the surface of the tin anode, and once this film covers the surface of the anode, the tin will completely dissolve into stannate
The stability of the plating solution in the common acidic tin plating process is poor, it is easy to form tin sludge, the coating has poor crystallinity, low bonding force, and poor uniformity, which cannot meet the requirements of 5G antennas for tin plating

Method used

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  • 5G antenna stannous electroplating process

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preparation example Construction

[0082] In one embodiment, the preparation method of the stannous electroplating additive comprises the steps of: first uniformly mixing polyether, hydroquinone, benzenesulfonic acid, and water in proportion, and then slowly adding an inorganic acid under stirring conditions, Mix evenly to obtain the stannous electroplating additive.

[0083] In one embodiment, the preparation method of the stannous electroplating solution comprises the steps of: mixing the stannous salt and distilled water uniformly, adding the stannous electroplating additive and stirring uniformly, then slowly adding sulfuric acid under stirring conditions, mixing uniformly, That is, the stannous electroplating solution is obtained.

[0084] The second aspect of the present invention provides a tin-plated 5G antenna, which is prepared by the above tin-tin electroplating process.

Embodiment 1

[0089] Embodiment 1 provides a 5G antenna tinous electroplating process, including the following steps:

[0090] S1: prepare stannous electroplating solution;

[0091] S2: Pour the tin-tin electroplating solution in S1 into the electroplating tank, use the copper-plated 5G antenna as the cathode, and use the carbon electrode as the anode, and the current density at the cathode is 30mA / cm 2 Lower electroplating;

[0092] The electroplating temperature of the S2 step is 20°C;

[0093] The electroplating time of the S2 step is 30min;

[0094] In parts by weight, the stannous electroplating solution in the S1 step includes: 20 parts of stannous salt, 280 parts of sulfuric acid, 10 parts of stannous electroplating additive, and 900 parts of distilled water;

[0095] The stannous salt is stannous sulfate;

[0096] Described sulfuric acid is the sulfuric acid that concentration is 98wt%;

[0097]In terms of mass percentage, the stannous electroplating additive includes: polyethe...

Embodiment 2

[0104] Embodiment 2 provides a 5G antenna tinous electroplating process, including the following steps:

[0105] S1: prepare stannous electroplating solution;

[0106] S2: Pour the stannous electroplating solution in S1 into the electroplating tank, use the copper-plated 5G antenna as the cathode, and use the carbon electrode as the anode, and the current density at the cathode is 70mA / cm 2 Lower electroplating;

[0107] The electroplating temperature of the S2 step is 30°C;

[0108] The electroplating time of described S2 step is 50min;

[0109] In parts by weight, the stannous electroplating solution of the S1 step comprises: 30 parts of stannous salt, 320 parts of sulfuric acid, 20 parts of stannous electroplating additives, and 1100 parts of distilled water;

[0110] The stannous salt is stannous sulfate;

[0111] Described sulfuric acid is the sulfuric acid that concentration is 98wt%;

[0112] In terms of mass percentage, the stannous electroplating additive include...

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Abstract

The invention relates to the technical field of electroplating, in particular to a 5G antenna stannous electroplating process. The 5G antenna stannous electroplating process at least includes the following steps of S1, preparing a stannous electroplating solution; and S2, pouring the stannous electroplating solution in the step S1 into an electroplating tank, using a copper-plated 5G antenna as acathode, using a carbon electrode as an anode, and conducting electroplating at the cathode current density being 30 mA / cm<2>to 70 mA / cm<2>. By means of the 5G antenna stannous electroplating process,the electroplating process is controlled, and the specific stannous electroplating solution is adopted, so that a plating layer has fine crystals, good bonding force, good uniformity, high stabilityand corrosion resistance, and the requirements for tin plating of the 5G antenna are fully met. The stannous electroplating process has very high uniform plating ability, and the difference of film thicknesses of a high-potential circuit and a circuit in a complex cavity is not more than 10%; by means of the 5G antenna stannous electroplating process, the plating layer is very meticulous, and theedges of the circuits are neat without warping edges and burrs; and the coverage capacity of the plating layer is good, plastic is quickly covered, and problems such as missing plating are effectivelyavoided.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a tin-tin electroplating process for a 5G antenna. Background technique [0002] In the 5G (fifth-generation mobile communication) era of the Internet of Everything, smart cities, unmanned driving, unmanned factories, and remote surgery, the 5G Capriccio is becoming clearer. The blueprint for the 5G network is a high rate 100 times that of 4G, which will reach 10Gbit / s, a low latency of less than 1ms, a high density supporting more than 100 billion connections, and a high capacity 1000 times that of 4G. On the one hand, antenna systems such as massive MIMO (massive array antenna technology) antennas and integrated active antennas are required to serve macro base stations. On the other hand, ubiquitous micro base stations require high integration of antennas and base station equipment. As the sensing organ of the mobile communication network, the 5G antenna plays an increa...

Claims

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Application Information

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IPC IPC(8): C25D3/32C25D7/00
CPCC25D3/32C25D7/00
Inventor 邓才君
Owner 中山美力特环保科技有限公司
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