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High-phosphorus chemical nickel-plating solution

An electroless nickel plating solution and a technology of nickel plating solution are applied in the field of electroless nickel plating solution for nickel plating process, which can solve the problems of high cost, residual magnetism of the coating layer, short service life of the cylinder opening solution, etc., and achieve excellent throwing ability and cost Low, stable opening fluid

Inactive Publication Date: 2017-05-31
贵阳华科电镀有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the commercially available high-phosphorus electroless plating solution has the disadvantages of high cost, slow deposition rate, short service life of the opening solution and residual magnetism of the coating. Based on this high requirement of electroless nickel plating, the technology of the present invention has been systematically studied

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Each 1000mL of said cylinder liquid contains: nickel sulfate: 26g / L, sodium hypophosphite: 32g / L, citric acid: 20g / L, lactic acid: 5mL / L, sodium acetate: 15g / L, succinic acid: 3.0 g / L, potassium iodate: 0.2g / L, potassium iodide: 17mg / L, nitrilotriacetic acid: 6mg / L, cerium sulfate: 6mg / L, copper sulfate: 15mg / L, benzotriazole: 50mg / L, Benimidazole: 6mg / L, OP-10: 15mL / L, the balance is pure water.

[0038] Preparation of cylinder opening liquid:

[0039] (1) Preparation of liquid A

[0040] ①Take 200mL of pure water, slowly add citric acid under stirring, stir evenly, obtain product a, set aside;

[0041] ②Take 400mL of pure water, add nickel sulfate until completely dissolved to obtain product b, add b to product a to obtain product c, and set aside;

[0042] ③Take 300mL of pure water, dissolve succinic acid and potassium iodide under constant stirring to obtain product d, add product d to c and transfer to a 1000mL constant volume bottle to obtain liquid A for later...

Embodiment 2

[0059] Each 1000mL of said cylinder liquid contains: nickel sulfate: 30g / L, sodium hypophosphite: 36g / L, citric acid: 24g / L, lactic acid: 8mL / L, sodium acetate 18g / L, succinic acid: 4.5g / L, potassium iodate: 0.3g / L, potassium iodide: 30mg / L, nitrilotriacetic acid: 10mg / L, cerium sulfate: 10mg / L, copper sulfate: 35mg / L, benzotriazole: 80mg / L, Benzimidazole: 10mg / L, OP-10: 25mL / L, and the balance is pure water.

[0060] Preparation of cylinder opening liquid:

[0061] (1) Preparation of liquid A

[0062] ①Take 200mL of pure water, slowly add citric acid under stirring, stir evenly, obtain product a, set aside;

[0063] ②Take 400mL of pure water, add nickel sulfate until completely dissolved to obtain product b, add b to product a to obtain product c, and set aside;

[0064] ③Take 300mL of pure water, dissolve succinic acid and potassium iodide under constant stirring to obtain product d, add product d to c and transfer to a 1000mL constant volume bottle to obtain liquid A fo...

Embodiment 3

[0081] The cylinder opening liquid contains per 1000mL: 22g / L, sodium hypophosphite: 28g / L, citric acid: 16g / L, lactic acid: 2mL / L, sodium acetate 10g / L, succinic acid: 1.5g / L, Potassium iodate: 0.1g / L, potassium iodide: 10mg / L, nitrilotriacetic acid: 2mg / L, cerium sulfate: 2mg / L, copper sulfate: 15mg / L, benzotriazole: 20mg / L, benzoimidazole : 2mg / L, OP-10: 5mL / L, the balance is pure water

[0082] Preparation of cylinder opening liquid:

[0083] (1) Preparation of liquid A

[0084] ①Take 200mL of pure water, slowly add citric acid under stirring, stir evenly, obtain product a, set aside;

[0085] ②Take 400mL of pure water, add nickel sulfate until completely dissolved to obtain product b, add b to product a to obtain product c, and set aside;

[0086] ③Take 300mL of pure water, dissolve succinic acid and potassium iodide under constant stirring to obtain product d, add product d to c and transfer to a 1000mL constant volume bottle to obtain liquid A for later use;

[0087...

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Abstract

The invention discloses a high-phosphorous chemical nickel-plating solution which comprises a cylinder opening solution and a supplement solution. The cylinder opening solution contains nickel sulfate, sodium hypophosphite, citric acid, lactic acid, sodium acetate, succinic acid, potassium iodate, potassium iodide, nitrilotriacetic acid, cerous sulfate, copper sulfate, benzotriazole, benzimidazole with the concentration being 2-10 mg / L, 5-25 mL / L of OP-10 with the concentration being 5-25 mL / L and the balance pure water. The nickel-plating solution has the advantages that cost is low, the excellent plating ability is achieved, the cylinder opening solution is stable, glossiness is achieved, the magnetism level requirement is met, and the service life reaches 11.0 MTO; during the service life, the average sedimentation rate is 12-14 [mu]m / h, the phosphorus content of a plating layer is 10%-14%, the time for neutral salt spraying is longer than or equal to 96 h (the thickness of the plating layer is 18-25 [mu]m), and the time for a purification resistant nitric-acid test is longer than or equal to 8 min (the thickness of the plating layer is 18-25 [mu]m); the magnetism level is lower than or equals to 200 gamma (specifically, 1 gamma is equal to 1 nT, and in general, remanence in the aerospace field takes gamma as a unit), the western country standard is met, and the magnetism is required to meet the NMB magnetism level; and the plating solution is free of lead and cadmium, conforms to the RoHS command and is an environment-friendly high-phosphorous chemical nickel-plating solution.

Description

technical field [0001] The invention relates to an electroless nickel plating solution for a nickel plating process, in particular to a high-phosphorus electroless nickel plating solution. Background technique [0002] Due to the excellent uniformity, hardness, wear resistance and other comprehensive physical and chemical properties of the electroless nickel plating layer, this technology has been widely used. It is used in different industries according to the phosphorus content in the coating. The performance of the coating is closely related to its composition and structure. Related, the coating containing 1%~4% (weight) P is generally called low phosphorus, the coating containing 5%~8% (weight) P is called medium phosphorus, and the coating containing 9%~12% (weight) P is called High phosphorus. With the rapid development of science and technology, especially the development of automobile, petroleum, aerospace, computer, machinery and post and telecommunications industr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36C23C18/18
CPCC23C18/36C23C18/1683C23C18/1837
Inventor 李雨葛黔峰谭润清袁丽红李桂麟
Owner 贵阳华科电镀有限公司
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