Non-cyanide electro cooper plating bath of EDTA system and use method thereof

A copper electroplating and system technology, applied in the field of electroplating solution, can solve the problems of staying in the experimental research stage and not fully using industrial production, and achieve the effects of good appearance and color, easy wastewater treatment, uniform plating and strong covering power

Inactive Publication Date: 2009-10-07
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Several other processes also have different defects, basically stay in the experimental research stage, and have not been fully used in industrial production.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The formula of electroplating copper solution is:

[0023] Disodium EDTA 120g / L

[0024] Basic copper carbonate 12g / L

[0025] Potassium hydroxide 30g / L

[0026] Tripotassium citrate 30g / L

[0027] Potassium nitrate 6g / L;

[0028] The process conditions during electroplating are: the pH value of the copper electroplating solution is 12, the temperature is 50°C, and the current density is 0.5A / dm 2 .

[0029] Compared with cyanide and citric acid-tartaric acid electroplating copper systems, Example 1 has better throwing ability and leveling ability, and comparable deep plating ability. The maximum current efficiency and deposition rate are slightly lower. It can meet the needs of pre-plating copper process.

Embodiment 2

[0031] The formula of electroplating copper solution is:

[0032] Dipotassium EDTA 145g / L

[0033] Basic copper carbonate 14g / L

[0034] Trisodium citrate 25g / L

[0035] Sodium nitrate 5g / L

[0036] Sodium hydroxide 20g / L;

[0037] The process conditions during electroplating are: the pH value of the copper electroplating solution is 12.5, the temperature is 60°C, and the current density is 1.0A / dm 2 .

[0038] Compared with cyanide and citric acid-tartaric acid electroplating copper systems, Example 2 has better throwing ability and leveling property, and higher maximum current efficiency. Throwing power and deposition rate are slightly lower. It can meet the needs of pre-plating copper process.

Embodiment 3

[0040] The formula of electroplating copper solution is:

[0041] Disodium EDTA 155g / L

[0042] Basic copper carbonate 18g / L

[0043] Sodium Potassium Tartrate 30g / L

[0044] Sodium nitrate 5g / L

[0045] Potassium hydroxide 40g / L;

[0046] The process conditions during electroplating are: the pH value of the copper electroplating solution is 13, the temperature is 70°C, and the current density is 2.5A / dm 2。

[0047] Compared with cyanide and citric acid-tartaric acid electroplating copper systems, Example 3 has better throwing ability and higher maximum current efficiency. The deep plating ability and deposition rate are slightly lower, and the leveling is relatively poor. It can basically meet the needs of the pre-plating copper process.

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PUM

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Abstract

The present invention provides a new non-cyanide electro cooper plating bath of EDTA system and use method thereof. In the electro copper plating bath, using disodium EDTA or dipotassium EDTA as main complexant, using copper sulfate or basic copper carbonate as main salt, using trisodium citrate, potassium citrate or potassium sodium tartrate as auxiliary complexant, using sodium nitrate or potassium nitrate as conductive salt, using sodium hydroxide or potassium hydrate as pH value regulator. The invention also provides a use method of the non-cyanide electro cooper plating bath. The invention has advantages: simple plating bath formula, easy control and operation, wide temperature range of plating bath using, high current efficiency, fine crystallization coating, good appearance color, stable plating bath, strong uniform plating and covering ability, low cost, easy wastewater treatment. The invention can be used for pre copper plating or direct electro-coppering instead of virulent cyaniding electro-coppering process.

Description

technical field [0001] The invention relates to an electroplating solution, in particular to a cyanide-free electroplating copper solution, and belongs to the technical field of electroplating. Background technique [0002] The cyanide electroplating copper layer has fine crystallization, good bonding force, good leveling, leveling and stability of the plating solution, and can be directly electroplated on steel, zinc and zinc alloy substrate parts. However, the cyanide electroplating copper solution contains cyanide ions, which is highly toxic, difficult to handle waste water and liquid waste, seriously pollutes the environment, and endangers human health. Therefore, people have been looking for a cyanide-free copper plating process that can replace cyanide electroplating copper. The existing cyanide-free copper plating processes mainly include pyrophosphate copper plating, sulfate copper plating, ethylenediamine copper plating, fluoroborate copper plating, citric acid-tar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 郭忠诚徐瑞东龙晋明周卫铭
Owner KUNMING UNIV OF SCI & TECH
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