33results about How to "Plating solution formula is simple" patented technology

The invention discloses components and a technology of a monopulse cyanide-free silver electroplating solution. The components and the technology are characterized in that: cyanide-free silver electroplating solution mainly comprises silver nitrate, hydantoin and derivatives thereof, potassium pyrophosphate, potassium sulfate, hydrochloric acid, deionized water, and the like. Operation conditions are that the pH value of the electroplating solution is 6-10 and that the temperature of the electroplating solution is 20-40 DEG C. A finely crystallized silver plating can be obtained through electroplating on pure copper or a copper alloy by utilizing of monopulse electroplating and by controlling the pulse width, the pulse duty cycle, the average pulse current density and the pulse working time. The electroplating solution is simple in formula, easy to control, strong in throwing power and in covering power and high in batch production stability. The plating is finely crystallized, and is good in appearance color. The plating is free from peeling, falling off and stripping. The technology can replace cyanide silver electroplating technologies, is environmental-friendly and pollution-free, and reduces damage of silver electroplating to operators.

The invention discloses a plating solution and an electroplating method for electroplating pure tin on copper wires, wherein the pH value of the plating solution is 1.0, and it contains stannous sulfate, an additive bismuth oxide, an additive nonionic surfactant, and a stabilizer pair Hydroquinone, brightener gelatin, solvent methanesulfonic acid; electroplating method: copper wire is washed with alkali to remove oil, hot water, pickling, cold water, and dried to make the cathode of the electroplating, and the titanium plate is used as the anode of the electroplating; the current density is 2.5 ‑4A / dm2, the electroplating time is 10min, and the temperature is room temperature. The composition of the plating solution of the invention is simple and easy to control, the waste liquid is environmentally friendly and easy to handle, the electroplating process is easy to control, and the plating layer is uniform and smooth and has good binding force.

The invention discloses a plating solution and a plating method of cyanide-free plating silver. 20-60g silver nitrate, 70-90g ammonium acetate, 70-110g nicotinic acid, 60-90g potassium carbonate, 40-70g potassium hydroxide, 0.2-1.2g o-benzoyl sulfimide sodium and 0.16-0.64g polyethylene glycol are contained in 1L of the plating solution with a pH value of 9-10. According to the plating solution and the plating method of the cyanide-free plating silver, the plating solution does not contain cyanide ions; the pollution of wastewater treatment is reduced; the injury to a human body due to precious metal plating is reduced; a formula of the plating solution is simple, and easy to control; compared with other cyanide-free plating, the current density is higher; and the deposition efficiency of a silver coating can be improved. With the adoption of pulse plating, a coating that is small in coating stress and good in compactness and brightness, and combines with a matrix well can be obtained.

A preparation method and application of a bimetallic Cu-Bi electrocatalytic denitrification electrode, the steps are as follows: (1) pretreatment of copper substrate, (2) preparation of plating solution, (3) electroplating. The Cu-Bi electrocatalytic electrode prepared by the method of the present invention has a high reduction activity to nitrate in water, and can effectively reduce it to N 2 , and can effectively reduce intermediate products, and has great application prospects.

The invention discloses a Cu-Zn-Sn ternary alloy cyanide-free imitation gold plating solution and a use method thereof. In the plating solution, copper sulfate, zinc sulfate and stannous sulfate are used as main salts, potassium pyrophosphate is used as a main complexing agent, ethylene diamine, potassium citrate and nitrilotriacetic acid are used as auxiliary complexing agents, sulfuric acid is used as an antioxidant and an anti-hydrolysis agent for stannous ions, and potassium hydroxide is used as a regulator for regulating the pH value of the plating solution. The operating conditions are as follows: the cathode current density is 1.0-3.0A / dm2, the pH value is 8.0-10.0, the temperature of the plating solution is room temperature, the plating time is 60-90s, the mechanical stirring or cathode movement is adopted, the anode material is 316L stainless steel, and the plating process is carried out on the substrate of a plating bright nickel layer. The invention has simple formula of the plating solution, easy control, wide process parameter range, fine crystal, good appearance color, stable plating solution, long service life, strong uniformly plating capacity and covering capacity, and high stability in batch production. The technology can replace the cyanide imitation gold plating process to be used as the plating process for imitating 9K, 18K or 24K gold on surfaces of decorative articles such as jewelry, clocks, handicraft articles and the like.