33results about How to "Plating solution formula is simple" patented technology

The invention relates to a chemical Ni-P plating technique on the surface of magnesium alloy which takes nickel sulfate (NiSO4, 6H20) as the main salt. The technique process is as follows, ultrasonic cleaning, alkali cleaning, acid cleaning, activation, and chemical nickel phosphorus plating (water cleaning is employed among steps), dispensations of plating solution are NiSO4, 6H2O (20 grams per liter), HF (40%, 12 milliliter per liter), Na3C6H5O7, 2H2O (20 grams per liter), NH4HF2 (10 grams per liter), NH3, H20 (25%, 30 milliliters per liter), and NaH2PO2, H2O (20 grams per liter), and the plating temperature is 88 +-2 DEG C. The plating speed on the surface of magnesium alloy is 20 micrometers per hour, and the plated rigidity is 300-500 HV. The invention is low in cost and simple in plating solution dispensation, and is applicable to the magnesium alloy in Mg-Al-Zn series (AZ series).

The invention discloses a Cu-Zn-Sn ternary alloy cyanide-free imitation gold plating solution and a use method thereof. In the plating solution, copper sulfate, zinc sulfate and stannous sulfate are used as main salts, potassium pyrophosphate is used as a main complexing agent, ethylene diamine, potassium citrate and nitrilotriacetic acid are used as auxiliary complexing agents, sulfuric acid is used as an antioxidant and an anti-hydrolysis agent for stannous ions, and potassium hydroxide is used as a regulator for regulating the pH value of the plating solution. The operating conditions are as follows: the cathode current density is 1.0-3.0A/dm2, the pH value is 8.0-10.0, the temperature of the plating solution is room temperature, the plating time is 60-90s, the mechanical stirring or cathode movement is adopted, the anode material is 316L stainless steel, and the plating process is carried out on the substrate of a plating bright nickel layer. The invention has simple formula of the plating solution, easy control, wide process parameter range, fine crystal, good appearance color, stable plating solution, long service life, strong uniformly plating capacity and covering capacity, and high stability in batch production. The technology can replace the cyanide imitation gold plating process to be used as the plating process for imitating 9K, 18K or 24K gold on surfaces of decorative articles such as jewelry, clocks, handicraft articles and the like.

The invention relates to a preparation method of an electroplated cadmium coating for metalwork, belonging to the field of chemical industry, and comprising the following steps of: degreasing and cleaning metalwork to be electroplated by an ultrasonic cleaner, then finely sanding the metalwork, cleaning the surface of the metalwork with clear water and alcohol in sequence, drying the metal surface to remove the alcohol from the surface of the metalwork; and electroplating by a plating solution composed of cadmium sulfate, nickel sulfate, potassium hydroxide, a complexing agent and an auxiliary complexing agent. The preparation method provided by the invention has the advantages that the metalwork is easy to treat, the formula of the plating solution is simple, operation and maintenance are easy, harmful substances such as cyanogen and the like are not contained, and environmental protection is benefited. In addition, the bonding quality between a plated coating and a substrate is good without cracking or damage.

The present invention provides a new non-cyanide electro cooper plating bath of EDTA system and use method thereof. In the electro copper plating bath, using disodium EDTA or dipotassium EDTA as main complexant, using copper sulfate or basic copper carbonate as main salt, using trisodium citrate, potassium citrate or potassium sodium tartrate as auxiliary complexant, using sodium nitrate or potassium nitrate as conductive salt, using sodium hydroxide or potassium hydrate as pH value regulator. The invention also provides a use method of the non-cyanide electro cooper plating bath. The invention has advantages: simple plating bath formula, easy control and operation, wide temperature range of plating bath using, high current efficiency, fine crystallization coating, good appearance color, stable plating bath, strong uniform plating and covering ability, low cost, easy wastewater treatment. The invention can be used for pre copper plating or direct electro-coppering instead of virulent cyaniding electro-coppering process.

The invention discloses a high-performance electrochemical capacitor plate material and a preparation method thereof, and belongs to the field of capacitor manufacture. The high-performance electrochemical capacitor plate material is silicon micro-channel supported neodymium-doped bismuth titanate, and adopts the structure that a neodymium-doped bismuth titanate thin film layer is generated on the inner wall of a three-dimensional silicon micro-channel plate through vacuum filtration and high-temperature oxidation to be used as an electrochemical capacitor active layer. The preparation method of the high-performance electrochemical capacitor plate material comprises the following steps: preparing the three-dimensional silicon micro-channel plate by adopting an electrochemical method, then, depositing a nickel layer by adopting a electroless plating method, preparing a nano-neodymium-doped bismuth titanate thin film layer by adopting a sol-gel method, and finally, performing rapid thermal annealing in an oxygen atmosphere, so as to form a neodymium-doped bismuth titanate/silicon micro-channel composite structure material. The high-performance electrochemical capacitor plate material provided by the invention provides a short transmission/diffusion path length, has larger specific area, and is conductive to obtaining higher energy density and power density.

A stabilizer for electroplating brightening tin and tin alloy comprises, by weight, 100-120 parts of sodium hypophosphite, 20-30 parts of ascorbic acid, 30-40 parts of polyethylene glycol and 10-15 parts of sulfanilic acid. The molecular weight M of the polyethylene glycol is 6000-12000. A preparation method of the stabilizer for electroplating brightening tin and tin alloy includes the following steps that (a) polyethylene glycol is weighed, distilled water is added to the polyethylene glycol to form a polyethylene glycol solution with the concentration of 5-8%, and heating and stirring are conducted until the polyethylene glycol is completely dissolved; (b) sodium hypophosphite is added and stirred until the sodium hypophosphite is completely dissolved; (c) ascorbic acid is added into the solution and stirred until the ascorbic acid is completely dissolved; (d) sulfanilic acid is added into the solution and stirred until the sulfanilic acid is completely dissolved; and (e) distilled water is supplemented and added to enable the concentration of the polyethylene glycol to be 3-4%, and the operation is competed after uniform stirring. The stabilizer for electroplating brightening tin and tin alloy has the advantages of being high in corrosion resistance, good in covering capacity, good in stability, high in electroplating efficiency and capable of being stored for a long time. A tin plating solution is stable. A clad layer obtained through electroplating is uniform, compact and good in combination force.

The invention discloses a plating solution formula for electroplating pure tin on a copper wire and an electroplating method. The pH value of a plating solution is 1.0. The plating solution comprises tin(II) sulfate, an adding agent bismuth oxide, an adding agent nonionic surfactant, a stabilizing agent p-dihydroxybenzene, a brightening agent gelatin and solvent sulphonethane. The electroplating method includes the steps that the copper wire serves as an electroplating cathode after being subjected to alkaline washing to remove oil and subjected to hot water washing, acid pickling, cold water washing and drying, and a titanium plate serves as an electroplating anode; and the current density is 2.5-4 A/dm<2>, the electroplating time is 10 min, and temperature is normal temperature. The plating solution composition is simple and easy to control, waste liquid is environment-friendly and easy to process, the electroplating process is easy to control, and a plating layer is uniform, smooth and good in binding force.

The present invention relates to a cyanide-free copper electroplating method for reducing porosity of a copper plating layer. According to the cyanide-free copper electroplating method, a substrate is alternately subjected to a direct current electroplating unit and a pulse electroplating unit, the pH value of the electroplating solution is controlled to 12-13, the temperature is 50-70 DEG C, the cathode current density for copper electroplating in each direct current electroplating unit is 0.5-3.0 A/dm<2>, the electroplating time is 2-3 min, the pulse average current density for copper electroplating in each alternating current electroplating unit is 0.5-3.0 A/dm<2>, the duty ratio is 15%, and the electroplating time is 2-3 min. The plating layer obtained through the method has minimal porosity when the plating layer thickness is 10-20 mum.

The invention discloses a plating solution of a nickel-cobalt-tungsten gradient plating layer, a preparation method and an electroplating method, and relates to the field of preparation of gradient plating layers, and every 1 L of the plating solution comprises 9-18 g of nickel sulfate, 3-6 g of cobalt sulfate, 30-60 g of sodium tungstate, 90-180 g of trisodium citrate, 18-36 g of ammonium chloride and 6-12 g of sodium chloride. Constant-current and direct-current continuous electroplating is adopted, and the problems that in the gradient plating electroplating process, electroplating parameter control is complex, and the requirement for an electroplating power source is high are solved.

The invention relates to a standard copper wire electroplating solution formula which is characterized in that the pH of the electroplating solution is 5.0, the standard copper wire electroplating solution includes 20-30 g of aluminum hydroxide, 20 to 46 g of aluminum oxide, 12-16g of sodium lauryl sulfate, 15-18g of silicic acid, 50-64g of magnesium carbonate, 12-16g of methyl methacrylate, 7-12gof potassium chloride, 3-11g of ferroferric oxide, 2-5g of silver nitrate, 30 40g of tin propane sulfonate; 0.5-2g of additive bismuth oxide; 0.5-2g of additive non-ionic surfactant; 5-8g of stabilizer hydroquinone; 2-4g of brightener gelatin and 300-500g of deionized water. The the standard copper wire electroplating solution has the advantages of simple formula, environmental protection, and good stability, an electroplating process is easy to control, and an electroplated layer is uniform, compact, good in bonding force, and widely used in welding. The electroplating solution does not generate bubbles, and remains clear during the electroplating process.

The invention relates to a standard nut electroplate liquid formula. The standard nut electroplate liquid formula is characterized in that the pH value of the electroplate liquid is 5.0; the electroplate liquid comprises 20-36g of aluminium hydroxide, 20-46g of aluminium oxide, 12-16g of sodium hydroxide, 15-18g of silicic acid, 50-64g of magnesium carbonate, 12-16g of methyl methacrylate, 7-12g of potassium chloride, 3-11g of ferriferrous oxide, 2-5g of silver nitrate, 30-40g of stannous sulfate, 0.5-2g of additive bismuth oxide; 0.5-2g of additive nonionic surfactant, 5-8g of stabilizer hydroquinone, 2-4g of brightener gelatin, and 300-500g of deionized water. The standard nut electroplate liquid formula is simple, environmentally friendly and excellent in stability; electroplating technology is easy to control; a clad layer produced by electroplating is high in uniformity, densification and binding force; and the standard nut electroplate liquid formula can be widely applied in welding; and bubbles are not produced in the electroplate liquid during electroplating, and the electroplate liquid is always clear.