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A kind of electroplating solution and electroplating method of cyanide-free electroplating silver

An electroplating solution and electroplating silver technology, which is applied in the field of electroplating silver, can solve the problems that cyanide-free silver plating is not widely used in electroplating silver, the stability of the plating solution is poor, and the stress of the coating is large, so as to improve the corrosion resistance and anti-tarnish performance of the coating. The effect of low stress and simple formula

Inactive Publication Date: 2015-08-26
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to problems such as high stress, poor bonding, and poor stability of the plating solution, cyanide-free silver plating has not been widely used in the electroplating banking industry.

Method used

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  • A kind of electroplating solution and electroplating method of cyanide-free electroplating silver

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Comparison scheme
Effect test

Embodiment 1

[0023] The electroplating method of cyanide-free electroplating silver, comprises the following steps:

[0024] 1) The composition of the cyanide-free alkaline silver plating solution is (with water as the solvent): silver nitrate content 20g / L, ammonium acetate 70g / L, nicotinic acid 70g / L, potassium carbonate 60g / L, potassium hydroxide 40g / L L, 0.2g / L of sodium o-benzoylsulfonimide, 0.16g / L of polyethylene glycol, and ammonia water are the pH value adjusting agent, and the pH value of the plating solution is adjusted to 9.5.

[0025] 2) Use the silver plate (purity is 99.99%) as the anode, and the piece to be plated as the cathode; the following are several specific materials of the plated piece, as well as the corresponding pretreatment and pretreatment process (it can be processed according to the existing method ):

[0026] The base material of the plated parts is copper pretreatment and the pretreatment process: degreasing of the plated parts - water washing - pickling -...

Embodiment 2

[0031] The electroplating method of cyanide-free electroplating silver, comprises the following steps:

[0032] 1) The composition of the cyanide-free alkaline silver plating solution is as follows: silver nitrate content 40g / L, ammonium acetate 80g / L, nicotinic acid 95g / L, potassium carbonate 70g / L, potassium hydroxide 50g / L, o-benzoyl Sodium sulfonylimide is 0.8g / L, polyethylene glycol is 0.32g / L, ammonia water is used as a pH regulator, and the pH of the bath is 9.5-10.

[0033] 2) Use the silver plate (purity 99.99%) as the anode, and the piece to be plated as the cathode; heat the temperature of the plating solution to 30-40°C, apply a single pulse electroplating power supply between the anode and the cathode, and control the average pulse current of the cathode The density is 0.6~1.2A / dm 2 , pulse width 4ms, duty cycle 30%; the cathode is moved and stirred, and the electroplating is completed when the thickness of the coating reaches the requirement.

Embodiment 3

[0035] The electroplating method of cyanide-free electroplating silver, comprises the following steps:

[0036] 1) The composition of the cyanide-free alkaline silver plating solution is as follows: silver nitrate content 60g / L, ammonium acetate 90g / L, nicotinic acid 110g / L, potassium carbonate 80g / L, potassium hydroxide 60g / L, o-benzoyl Sodium sulfonylimide is 1.2g / L, polyethylene glycol is 0.64g / L, ammonia water is used as a pH regulator, and the pH of the bath is 9 to 9.5.

[0037] 2) Use the silver plate (purity 99.99%) as the anode, and the piece to be plated as the cathode; heat the bath temperature to 25-35°C, apply a single pulse electroplating power supply between the anode and the cathode, and control the average pulse current of the cathode The density is 0.6~1.2A / dm 2 , the pulse width is 5ms, and the duty cycle is 40%; the cathode is moved and stirred, and the electroplating is completed when the thickness of the coating reaches the requirement.

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Abstract

The invention discloses a plating solution and a plating method of cyanide-free plating silver. 20-60g silver nitrate, 70-90g ammonium acetate, 70-110g nicotinic acid, 60-90g potassium carbonate, 40-70g potassium hydroxide, 0.2-1.2g o-benzoyl sulfimide sodium and 0.16-0.64g polyethylene glycol are contained in 1L of the plating solution with a pH value of 9-10. According to the plating solution and the plating method of the cyanide-free plating silver, the plating solution does not contain cyanide ions; the pollution of wastewater treatment is reduced; the injury to a human body due to precious metal plating is reduced; a formula of the plating solution is simple, and easy to control; compared with other cyanide-free plating, the current density is higher; and the deposition efficiency of a silver coating can be improved. With the adoption of pulse plating, a coating that is small in coating stress and good in compactness and brightness, and combines with a matrix well can be obtained.

Description

technical field [0001] The invention belongs to the technical field of electroplating silver, and belongs to an electroplating solution and an electroplating method for cyanide-free electroplating silver. Background technique [0002] With the development of industry, electroplating silver is widely used in contact parts of appearance decoration, electronic devices, instruments and meters, switches of transformers, high and low voltage switches and other industries. [0003] The cyanide-free silver plating solution uses cyanide-free ions as silver ion complexing agents to deposit silver plating layers through electrochemical reactions. However, due to problems such as high stress, poor bonding, and poor stability of the plating solution, cyanide-free silver plating has not been widely used in the electroplating banking industry. Contents of the invention [0004] The problem to be solved by the present invention is to provide an electroplating solution and an electroplati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/46C25D5/18
Inventor 宋忠孝郝留成李钦廉继英阮兴伟李宝红
Owner XI AN JIAOTONG UNIV
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