A kind of electroplating solution and electroplating method of cyanide-free electroplating silver

An electroplating solution and electroplating silver technology, which is applied in the field of electroplating silver, can solve the problems that cyanide-free silver plating is not widely used in electroplating silver, the stability of the plating solution is poor, and the stress of the coating is large, so as to improve the corrosion resistance and anti-tarnish performance of the coating. The effect of low stress and simple formula
CN103046091BInactive Publication Date: 2015-08-26XI AN JIAOTONG UNIV +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XI AN JIAOTONG UNIV
Publication Date
2015-08-26
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a plating solution and a plating method of cyanide-free plating silver. 20-60g silver nitrate, 70-90g ammonium acetate, 70-110g nicotinic acid, 60-90g potassium carbonate, 40-70g potassium hydroxide, 0.2-1.2g o-benzoyl sulfimide sodium and 0.16-0.64g polyethylene glycol are contained in 1L of the plating solution with a pH value of 9-10. According to the plating solution and the plating method of the cyanide-free plating silver, the plating solution does not contain cyanide ions; the pollution of wastewater treatment is reduced; the injury to a human body due to precious metal plating is reduced; a formula of the plating solution is simple, and easy to control; compared with other cyanide-free plating, the current density is higher; and the deposition efficiency of a silver coating can be improved. With the adoption of pulse plating, a coating that is small in coating stress and good in compactness and brightness, and combines with a matrix well can be obtained.
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Description

technical field

[0001] The invention belongs to the technical field of electroplating silver, and belongs to an electroplating solution and an electroplating method for cyanide-free electroplating silver. Background technique

[0002] With the development of industry, electroplating silver is widely used in contact parts of appearance decoration, electronic devices, instruments and meters, switches of transformers, high and low voltage switches and other industries.

[0003] The cyanide-free silver plating solution uses cyanide-free ions as silver ion complexing agents to deposit silver plating layers through electrochemical reactions. However, due to problems such as high stress, poor bonding, and poor stability of the plating solution, cyanide-free silver plating has not been widely used in the electroplating banking industry. Contents of the invention

[0004] The problem to be solved by the present invention is to provide an electroplating solution and an electroplati...

Claims

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