A kind of cyanide-free copper plating electroplating solution applicable to wide ph and wide current density range and preparation method thereof

A current density, cyanide-free copper plating technology, applied in the field of cyanide-free copper plating solution, cyanide-free copper plating solution and its preparation, can solve the problem of poor bonding between the coating and the substrate, unstable operation of the plating solution, and solution pH Narrow range and other problems, to avoid continuous adjustment or even scrapping, improve the tolerance of solution operation, and facilitate production and operation
CN106521574BActive Publication Date: 2018-10-26ZHEJIANG UNIV OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
ZHEJIANG UNIV OF TECH
Publication Date
2018-10-26

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Abstract

The invention provides a cyanide-free copper-plated electroplating solution suitable for a wide pH range and a wide current density range. The cyanide-free copper-plated electroplating solution comprises amino methylene diphosphonic acid (AMDP) with concentration being 20-90g / L, inositol hexaphosphoric acid (PA) or phytic acid sodium salt hydrate with concentration being 10-70g / L, pyrophosphate with concentration being 0.5-15g / L, and copper salt with concentration being 3-25g / L. The cyanide-free copper-plated electroplating solution provided by the invention has an applicable pH range of 6-13.5, an applicable current density range of 0.2-4 amperes / square decimeter, is simple in formula, is non-toxic, is free of cyanide pollution; and copper is directly plated on iron substrate, a magnesium alloy, zinc or zinc alloy matrix and zinc-immersed aluminum, so that the obtained copper plating is excellent in binding force with the matrix.
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Description

Technical field

[0001] The invention belongs to the technical field of electroplating, and specifically relates to a cyanide-free copper plating electroplating solution, in particular to a cyanide-free copper plating electroplating solution suitable for a wide pH and a wide current density range and a preparation method thereof. Background technique

[0002] The acid copper sulfate electroplating solution will directly plate copper on metal substrates such as iron, zinc or zinc alloy, magnesium alloy, aluminum, etc., which will cause a substitution reaction, resulting in poor bonding between the substrate and the copper coating. In order to obtain high bonding strength, alkaline cyanide plating solutions are now widely used in industry. However, because cyanide has a very high biological toxicity and can cause major environmental and social safety accidents, the state has repeatedly issued industrial policies to eliminate cyanide-containing electroplating. Therefore, the develop...

Claims

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