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A kind of cyanide-free copper plating electroplating solution applicable to wide ph and wide current density range and preparation method thereof

A current density, cyanide-free copper plating technology, applied in the field of cyanide-free copper plating solution, cyanide-free copper plating solution and its preparation, can solve the problem of poor bonding between the coating and the substrate, unstable operation of the plating solution, and solution pH Narrow range and other problems, to avoid continuous adjustment or even scrapping, improve the tolerance of solution operation, and facilitate production and operation

Active Publication Date: 2018-10-26
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a cyanide-free copper electroplating solution suitable for wide pH and wide current density range, which solves the serious environmental pollution caused by the existing cyanide-containing plating solution, and the cyanide-free plating solution will cause the plating layer to be damaged. Poor substrate bonding, especially in the low current density area, the plating layer will appear bubbling, the plating solution is unstable for a long time, and the pH range of the applicable solution is narrow, etc.

Method used

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  • A kind of cyanide-free copper plating electroplating solution applicable to wide ph and wide current density range and preparation method thereof
  • A kind of cyanide-free copper plating electroplating solution applicable to wide ph and wide current density range and preparation method thereof
  • A kind of cyanide-free copper plating electroplating solution applicable to wide ph and wide current density range and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0021] Example 1:

[0022] Prepare the cyanide-free copper plating bath with wide pH and wide current density according to the following ratio.

[0023]

[0024]

[0025] Dissolve and mix the weighed methylene diphosphonic acid and copper sulfate pentahydrate with deionized water respectively. Add potassium hydroxide solution during stirring and stir thoroughly. If the pH is too high due to the addition of potassium hydroxide, adjust the pH to The specified pH value.

[0026] In the resulting solution, adjust the temperature of the solution to 30°C and set the cathode current density to 1A / dm 2 The copper plating layer of about 5 microns is plated on the steel wire substrate with a diameter of 2 mm, and the electroplating time is 15 minutes. The bonding force is tested by the winding method according to ASTM B452-2002.

Embodiment 2

[0028] Prepare the cyanide-free copper plating bath with wide pH and wide current density according to the following ratio.

[0029]

[0030] Dissolve and mix the weighed methylene diphosphonic acid and copper chloride dihydrate in deionized water respectively, add sodium hydroxide solution during stirring and stir thoroughly. If the pH is too high due to the addition of potassium hydroxide, adjust with sulfuric acid To the specified pH value.

[0031] In the resulting solution, adjust the temperature of the solution to 50°C and set the cathode current density to 0.5A / dm 2 The copper plating layer of about 5 microns is plated on the steel wire substrate with a diameter of 2 mm, and the electroplating time is 30 minutes. The bonding force is tested by the winding method according to ASTM B452-2002.

Embodiment 3

[0033] Prepare a cyanide-free copper plating bath with a wide pH range according to the following ratio

[0034]

[0035]

[0036] Dissolve and mix the weighed methylene diphosphonic acid and copper chloride dihydrate in deionized water respectively, add sodium hydroxide solution during stirring and stir thoroughly. If the pH is too high due to the addition of potassium hydroxide, adjust with sulfuric acid To the specified pH value.

[0037] In the obtained solution, adjust the temperature of the solution to 55℃, and set the cathode current density to 2A / dm 2 The copper plating layer of about 5 microns is plated on the steel wire substrate with a diameter of 2 mm, and the electroplating time is 7 minutes. The bonding force is tested by the winding method according to ASTM B452-2002.

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Abstract

The invention provides a cyanide-free copper-plated electroplating solution suitable for a wide pH range and a wide current density range. The cyanide-free copper-plated electroplating solution comprises amino methylene diphosphonic acid (AMDP) with concentration being 20-90g / L, inositol hexaphosphoric acid (PA) or phytic acid sodium salt hydrate with concentration being 10-70g / L, pyrophosphate with concentration being 0.5-15g / L, and copper salt with concentration being 3-25g / L. The cyanide-free copper-plated electroplating solution provided by the invention has an applicable pH range of 6-13.5, an applicable current density range of 0.2-4 amperes / square decimeter, is simple in formula, is non-toxic, is free of cyanide pollution; and copper is directly plated on iron substrate, a magnesium alloy, zinc or zinc alloy matrix and zinc-immersed aluminum, so that the obtained copper plating is excellent in binding force with the matrix.

Description

Technical field [0001] The invention belongs to the technical field of electroplating, and specifically relates to a cyanide-free copper plating electroplating solution, in particular to a cyanide-free copper plating electroplating solution suitable for a wide pH and a wide current density range and a preparation method thereof. Background technique [0002] The acid copper sulfate electroplating solution will directly plate copper on metal substrates such as iron, zinc or zinc alloy, magnesium alloy, aluminum, etc., which will cause a substitution reaction, resulting in poor bonding between the substrate and the copper coating. In order to obtain high bonding strength, alkaline cyanide plating solutions are now widely used in industry. However, because cyanide has a very high biological toxicity and can cause major environmental and social safety accidents, the state has repeatedly issued industrial policies to eliminate cyanide-containing electroplating. Therefore, the develop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 郑精武陈海波乔梁蔡伟姜力强车声雷应耀李旺昌余靓
Owner ZHEJIANG UNIV OF TECH
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