A kind of electrolytic copper foil additive and electrolytic copper surface treatment process

Abstract

The invention discloses an electrolytic copper foil additive. The electrolytic copper foil additive comprises sodium phosphotungstate, polyethylene glycol and sodium 3,3'-dithiodipropane sulfonate, wherein the content of sodium phosphotungstate in an electroplating liquid is 20-300mg / L; the content of polyethylene glycol in the electroplating liquid is 10-200mg / L; and the content of sodium 3,3'-dithiodipropane sulfonate in the electroplating liquid is 20-300mg / L. According to the electrolytic copper foil additive, sodium phosphotungstate is added and hydrolyzed to obtain phosphotungstate radical, an electrode reaction is accelerated by virtue of the complexing action of phosphotungstic acid, and the covering power of a roughening treatment process and the uniformity of surface crystallization are improved. The invention further provides a surface treatment process for an electrolytic copper foil. The surface treatment process for the electrolytic copper foil comprises the steps of acidpickling, roughening, curing, passivating, silane coupling agent coating and drying; the treated copper foil is good in covering power presentation, a compact roughened layer can be formed, and the anti-oxidation and anti-peeling capacity are improved; the roughness Rz of the surface of the treated copper foil is not greater than 8[mu]m, the Rmax is not greater than 10.0[mu]m, the anti-peeling strength is not less than 2.0kg / cm; and additives containing arsenic, lead and other substances are not used in the treatment process, and the requirements of environment protection and sustainable development are met.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an electrolytic copper foil additive and a surface treatment process for electrolytic copper. Background technique [0002] As the "nervous system" in electronic equipment, copper foil is widely used in various electronic equipment and its components. With the development of information technology, electronic equipment and its components are gradually developing in the direction of smaller size, lighter weight, and better performance. to improve the portability of the product. In this context, higher technical requirements are also put forward for copper foil. [0003] The surface treatment of electrolytic copper foil is a very important link in the production of copper foil. The main process includes: raw foil → pretreatment → roughening treatment → curing treatment → passivation treatment → organic treatment, according to the type and application range of electro...

AI Technical Summary

Problems solved by technology

The roughening treatment should not be too deep or too shallow. If the roughening is too deep, it will easily cause copper powder to fall off the surface of the copper foil. The improvement of anti-stripping performance is limited, resulting in a waste of resources

[0004] The existing copper foil surface treatment process uses arsenic-containing compounds as additives, and the effect is better, but on the one hand, arsenic-containing compounds are extremely harmful to the human body and the environment, and cannot meet people's requirements for environmental protection, harmlessness and sustainable development , on the other hand, arsenic-containing roughening treatment has limited improvement in copper foil anti-peel strength, oxidation resistance, etc., and has been unable to meet the needs of current electronic equipment and its components.

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