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A kind of electroplating liquid and electroplating method thereof

An electroplating solution and forward current technology, applied in the field of copper electroplating, can solve the problems of high toxicity, etc., achieve high plating ability, reduce plating hole defects, and thin coating thickness

Active Publication Date: 2020-04-28
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But, the electroplating solution of this invention contains pentavalent vanadium and has bigger toxicity

Method used

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  • A kind of electroplating liquid and electroplating method thereof
  • A kind of electroplating liquid and electroplating method thereof
  • A kind of electroplating liquid and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Embodiment 1 Plated through hole

[0059] The electroplating solution of the present embodiment comprises the following components in terms of mass concentration:

[0060]

[0061]

[0062] Immerse the plate-shaped piece with a through hole on the surface in the electroplating solution, and conduct electroplating after the plate-shaped piece is electrified as the cathode, wherein the aspect ratio (AR) of the through hole is 5, and the forward current density is 9A / dm 2 , the forward current pulse time is 15ms, and the reverse current density is 27A / dm 2 , the reverse current pulse time is 1.5ms, and the electroplating time is 3h. The difference in TP value can be seen more intuitively through long-term electroplating.

Embodiment 2

[0075] Example 2 Plated through hole

[0076] The electroplating solution of the present embodiment comprises the following components in terms of mass concentration:

[0077]

[0078]Immerse the plate-shaped piece with a through hole on the surface into the electroplating solution, wherein the diameter of the through-hole is 300 μm and the hole height is 1500 μm μm, and the plate-shaped piece is used as the cathode to carry out electroplating, wherein the forward current density is 10A / dm 2 , the forward current pulse time is 40ms, and the reverse current density is 30A / dm 2 , the reverse current pulse time is 2ms, and the electroplating time is 60min.

Embodiment 3

[0086] Example 3 Plated Through Holes

[0087] The electroplating solution of the present embodiment comprises the following components in terms of mass concentration:

[0088]

[0089] Immerse the plate-shaped piece with a through hole on the surface into the electroplating solution, wherein the diameter of the through-hole is 300 μm and the hole height is 1500 μm, and the plate-shaped piece is used as the cathode to carry out electroplating after electrification, wherein the forward current density is 10A / dm 2 , the forward current pulse time is 40ms, and the reverse current density is 30A / dm 2 , the reverse current pulse time is 2ms, and the electroplating time is 30min.

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Abstract

The present application provides an electroplating solution and an electroplating method employing the same. The electroplating solution comprises the following components by weight / volume concentration: 0.3-25 g / L of tetralvanadium, 4-10 g / L of ferrous iron, 0.3-5 g / L of ferric iron, 100-250 g / L of copper sulfate, 50-210 g / L of sulfuric acid, and 30-150 mg / L of a chloride.

Description

technical field [0001] The invention belongs to the technical field of electroplating copper, and relates to an electroplating solution and an electroplating method thereof. Background technique [0002] With the development of science and technology, electronic products tend to be more and more intelligent and miniaturized. This trend continues to promote the improvement of the circuit board manufacturing process; and eventually leads to the emergence of high-density interconnect circuit boards (HDI). This kind of circuit board has small pad diameter, small wiring width, small line spacing, and many layers at the same time. Therefore, the number of through holes or blind holes that provide access between different layers is large and the aperture is small; this brings great challenges to the process of metallization in the hole, thereby establishing a channel between layers, drilling process, filling material , and the subsequent process steps of the printed circuit board ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/56C25D5/18C25D7/00
CPCC25D3/562C25D5/18C25D7/00
Inventor 章晓冬冯建松刘江波苏向荣王科宋通李智信
Owner GUANGDONG SKYCHEM TECH LTD
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