Composite acid system PCB vertical continuous electroplating device and method

Abstract

The embodiment of the invention provides a composite acid system PCB vertical continuous electroplating device and a method. The composite acid system PCB vertical continuous electroplating device comprises independent sealed anode chambers separated in an electroplating bath, the independent sealed anode chambers are composed of diaphragm clamping plates for clamping the two sides of a diaphragm, a plurality of side stand plates perpendicular to a copper cylinder groove wall and guide components for guiding an anode power line, and inclined guide separation plates are arranged on the guide components. The diaphragm clamping plates are in bolt connection with the front edges of the side stand plates, and the guide components are located on the front edges of the anode chambers, and fixed to the side stand plates. The sealed anode chambers are symmetrically arranged on the two sides of a copper cylinder. Different acid systems are adopted inside and outside the anode chambers for electrolysis and electroplating, and composite acid system electroplating is formed. The deep electroplating hole penetrating capacity of electroplating equipment is improved, an electroplating layer is even and good in consistency, productivity is large, efficiency is improved, liquid is saved, and production cost is lowered.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of electroplating, in particular to a composite acid system PCB vertical continuous electroplating device and method. Background technique [0002] In the PCB process, copper plating is usually performed on the entire board for through holes, blind holes and filled holes for the needs of line connections. Vertical continuous electroplating (VCP) is a relatively advanced continuous electroplating method newly developed in the industry in recent years. It adopts cyclic continuous processing, high degree of automation, good coating uniformity and high efficiency. However, the vertical continuous electroplating line of the prior art still has shortcomings such as large solution circulation, heavy filtration burden, high consumption of additives, and lack of better electroplating uniformity. [0003] As we all know in the industry, electroplating uses methanesulfonic acid system or sulf...

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Problems solved by technology

[0004] The embodiment of the present invention provides a compound acid system PCB vertical continuous electroplating device and method to overcome the problems of insufficient uniformity and high cost of the PCB electroplating layer in the prior art

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