A compound acid system pcb vertical continuous electroplating device and method

Abstract

The embodiment of the present invention provides a composite acid system PCB vertical continuous electroplating device and method. The device of the present invention comprises: an independent closed anode chamber separated in the electroplating tank, and the described independent closed anode chamber is composed of diaphragm splints for clamping both sides of the diaphragm, several side vertical plates perpendicular to the tank wall of the copper cylinder, The guide member used for guiding the anode electric power line is composed of an inclined guide partition on the guide member; the diaphragm splint is bolted to the front edge of the side vertical plate, and the guide member is located at the front edge of the anode chamber and is fixed on the On the side vertical plate; the independent anode chambers are arranged symmetrically on both sides of the copper cylinder; inside and outside the anode chamber, different acid systems are used for electrolysis and electroplating to form a composite acid system for electroplating. The device in this embodiment improves the deep-plating through-hole capability of the electroplating equipment, achieves good uniformity of the plating layer, high productivity and high efficiency, saves chemical solution, and reduces production costs.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of electroplating, in particular to a composite acid system PCB vertical continuous electroplating device and method. Background technique [0002] In the PCB process, copper plating is usually performed on the entire board for through holes, blind holes and filled holes for the needs of line connections. Vertical continuous electroplating (VCP) is a relatively advanced continuous electroplating method newly developed in the industry in recent years. It adopts cyclic continuous processing, high degree of automation, good coating uniformity and high efficiency. However, the vertical continuous electroplating line of the prior art still has shortcomings such as large solution circulation, heavy filtration burden, high consumption of additives, and lack of better electroplating uniformity. [0003] As we all know in the industry, electroplating uses methanesulfonic acid system or sulf...

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Problems solved by technology

[0004] The embodiment of the present invention provides a compound acid system PCB vertical continuous electroplating device and method to overcome the problems of insufficient uniformity and high cost of the PCB electroplating layer in the prior art

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