A kind of high tg plate production process

A production process and baking technology, which is applied in the manufacturing of printed circuits, electrical components, printed circuits, etc., can solve the problems of poor decontamination effect and easy influence on product quality, so as to eliminate functional defects and improve appearance quality. , the effect of improving quality

Active Publication Date: 2020-04-28
DONGGUAN MEADVILLE CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effect of potassium permanganate to remove drilling dirt is not good, and it is easy to affect the quality of the product. Therefore, there are still many deficiencies in the mode of using potassium permanganate to remove drilling dirt.

Method used

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Embodiment Construction

[0008] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0009] The present invention provides a kind of high Tg board production process, it comprises the following steps:

[0010] Step (1), provide a TG plate, the TG plate is a rigid "glass state" at room temperature, when the temperature rises to reach the glass transition temperature in a certain area, the TG plate will change from "glass state" to "high bouncing";

[0011] Step (2), drilling, drilling a through hole on the TG board, the through hole runs through the entire TG board up and down;

[0012] Step (3), drying the board after drilling, drying the drilled TG board to remove moisture in the board, reduce internal s...

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PUM

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Abstract

The invention provides a high-Tg board production process. The process comprises the following steps: (1) providing a TG board; (2) hole drilling: drilling a through hole in the TG board; (3) baking the board after the hole drilling step; (4) detecting the hole; (5) removing the glue of the through hole by virtue of Plasma; (6) conducting the high-pressure water washing, and cleaning the TG board;(7) conducting the laser hole-drilling operation, and drilling a blind hole in the PCB; (8) conducting the high-pressure water washing; (9) removing the glue of the blind hole by virtue of Plasma, wherein the Plasma-based glue-removing strength of the blind hole is smaller than the Plasma-based glue-removing strength of the through hole; (10) conducting the secondary water washing; (11) pattern manufacturing: manufacturing outer-layer patterns. According to the invention, the glue is removed by virtue of Plasma, so that the effect of removing the drilling sewage is effectively improved. The quality of products is improved. During the removing process of the drilling sewage, the Plasma-based glue removing of the through hole and the Plasma-based glue removing of the blind hole are separated. Therefore, glass fibers in the blind hole are effectively prevented from being protruded. During the plate surface electroplating process and the pattern electroplating process, the parameter matching performance of the two processes are considered. Therefore, the deep plating capability of the copper plating through hole is improved.

Description

technical field [0001] The invention relates to a PCB production process, in particular to a high Tg board production process. Background technique [0002] In the production process of PCB boards, it is necessary to treat the residual drilling dirt after drilling. At present, the potassium permanganate method is more commonly used in the industry to remove drilling dirt, that is, in a strong alkaline solution, the chemical bonds in the resin system are opened through the strong oxidation of potassium permanganate, so that the resin dissolves into the strong alkaline permanganate In the potassium solution, the debris generated by drilling is completely removed, and the hole wall is smoothed. However, the effect of potassium permanganate to remove drilling dirt is not good, and it is easy to affect the quality of the product. Therefore, there are still many deficiencies in the mode of using potassium permanganate to remove drilling dirt. Contents of the invention [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/26
Inventor 余锦玉
Owner DONGGUAN MEADVILLE CIRCUITS
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