A kind of high tg plate production process

Abstract

The invention provides a high-Tg board production process. The process comprises the following steps: (1) providing a TG board; (2) hole drilling: drilling a through hole in the TG board; (3) baking the board after the hole drilling step; (4) detecting the hole; (5) removing the glue of the through hole by virtue of Plasma; (6) conducting the high-pressure water washing, and cleaning the TG board;(7) conducting the laser hole-drilling operation, and drilling a blind hole in the PCB; (8) conducting the high-pressure water washing; (9) removing the glue of the blind hole by virtue of Plasma, wherein the Plasma-based glue-removing strength of the blind hole is smaller than the Plasma-based glue-removing strength of the through hole; (10) conducting the secondary water washing; (11) pattern manufacturing: manufacturing outer-layer patterns. According to the invention, the glue is removed by virtue of Plasma, so that the effect of removing the drilling sewage is effectively improved. The quality of products is improved. During the removing process of the drilling sewage, the Plasma-based glue removing of the through hole and the Plasma-based glue removing of the blind hole are separated. Therefore, glass fibers in the blind hole are effectively prevented from being protruded. During the plate surface electroplating process and the pattern electroplating process, the parameter matching performance of the two processes are considered. Therefore, the deep plating capability of the copper plating through hole is improved.

Description

technical field

[0001] The invention relates to a PCB production process, in particular to a high Tg board production process. Background technique

[0002] In the production process of PCB boards, it is necessary to treat the residual drilling dirt after drilling. At present, the potassium permanganate method is more commonly used in the industry to remove drilling dirt, that is, in a strong alkaline solution, the chemical bonds in the resin system are opened through the strong oxidation of potassium permanganate, so that the resin dissolves into the strong alkaline permanganate In the potassium solution, the debris generated by drilling is completely removed, and the hole wall is smoothed. However, the effect of potassium permanganate to remove drilling dirt is not good, and it is easy to affect the quality of the product. Therefore, there are still many deficiencies in the mode of using potassium permanganate to remove drilling dirt. Contents of the invention

[0003] ...