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A standard bolt and electroplating solution technology, applied in jewelry, etc., can solve the problems of uniform welding performance and inability to guarantee the coating, and achieve the effect of good bonding force, easy electroplating process, and uniform coating
Inactive Publication Date: 2018-09-28
如皋市跃天特种标准件有限公司
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Abstract
Description
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a standard bolt electroplating solution formula, which can solve the problem that the general standard bolts cannot ensure uniform coating and have good welding performance when the general standard bolts are electroplated.
Method used
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Embodiment 1
[0011] A standard bolt electroplating solution formula, the pH of the plating solution is 5.0, including aluminum chloride 20g, aluminum oxide 20g, sodium hydroxide 12g, silicic acid 15g, magnesium carbonate 50g, methyl methacrylate 12g, chlorine Potassium chloride 7g, zinc chloride 3g, cupric chloride 2g, stannous sulfate 30g; additive bismuth oxide 0.5g; additive non-ionic surfactant 0.5g; stabilizer hydroquinone 5g; brightener gelatin 2g and 300g of deionized water.
[0012] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.
Embodiment 2
[0014] A standard bolt electroplating solution formula, the pH of the plating solution is 5.0, including aluminum chloride 28g, aluminum oxide 33g, sodium hydroxide 14g, silicic acid 16.5g, magnesium carbonate 57g, methyl methacrylate 14g, Potassium chloride 9.5g, zinc chloride 7g, copper chloride 3.5g, stannous sulfate 3.5g; additive bismuth oxide 1.25g; additive non-ionic surfactant 1.25g; stabilizer hydroquinone 6.5g; brightener Gelatin 3g and deionized water 400g.
[0015] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.
Embodiment 3
[0017] A standard bolt electroplating solution formula, the pH of the plating solution is 5.0, including aluminum chloride 36g, aluminum oxide 46g, sodium hydroxide 16g, silicic acid 18g, magnesium carbonate 64g, methyl methacrylate 16g, chlorine Potassium chloride 12g, zinc chloride 11g, cupric chloride 5g, stannous sulfate 40g; additive bismuth oxide 2g; additive nonionic surfactant 2g; stabilizer hydroquinone 8g; brightener gelatin 4g and deionized water 500g .
[0018] The additive nonionic surfactant is any one of polyoxyethylene (EO15) lauryl alcohol and OP emulsifier or a mixture of the two in any ratio.
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Abstract
The invention relates to a formula of a standard bolt electroplating solution. The formula of the standard bolt electroplating solution is characterized in that the pH value of an plating solution is5.0, and the plating solution comprises of 20-36 g of aluminum chloride, 20-46 g of aluminum oxide, 12-16 g of sodium hydroxide, 15-18 g of silicic acid, 50-64 g of magnesium carbonate, 12-16 g of methyl methacrylate, 7-12 g of potassium chloride, 3-11 g of zinc chloride, 2-5 g of copper chloride, 30-40 g of stannous sulfate, 0.5-2 g of additive bismuth oxide, 0.5-2 g of an additive nonionic surfactant, 5-8 g of a stabilizer hydroquinone, 2-4 g of a brightener gelatin and 300-500 g of deionized water. According to the method, the formula of the plating solution is simple, environment-friendlyand good in stability, the electroplating technology is easy to be controlled, the electroplated coating is uniform and dense, the binding force is good, and the application is wide in the aspect of welding; and in the electroplating process, the plating solution does not generate bubbles, and the plating solution is kept clear all the time.
Description
technical field [0001] The invention relates to the field of electroplating of standard parts, in particular to a formula of electroplating solution for standard bolts. Background technique [0002] In recent years, the rapid development of the electronics industry has made people have higher and higher requirements for solderable coatings. Due to the good solderability of tin and the limited use of lead, a lot of research has been done on tin plating and tin alloy plating. [0003] At present, there are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, and methanesulfonic acid system tin plating. Mos...
Claims
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Application Information
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