A kind of plating solution and electroplating method for electroplating pure tin on copper wire

A copper wire and plating solution technology, applied in the field of electroplating, can solve the problems of uneven electroplating coating, uneven surface, affecting the solderability of the soldering layer, etc., and achieve the effects of simple formula, wide application and good stability

Active Publication Date: 2018-08-03
JIANGSU XINGDA STEEL TYPE CORD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: the present invention provides a plating solution and an electroplating method for electroplating pure tin on copper wires, so as to solve the problem that the addition of additives to the plating solution for electroplating tin on thin copper wires in the prior art affects the solderability of the solder layer, and the electroplating layer is not Uniform, non-smooth surface issues

Method used

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  • A kind of plating solution and electroplating method for electroplating pure tin on copper wire
  • A kind of plating solution and electroplating method for electroplating pure tin on copper wire
  • A kind of plating solution and electroplating method for electroplating pure tin on copper wire

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Embodiment 1

[0035] Table 1

[0036]

[0037] A kind of electroplating method of electroplating pure tin on copper wire, the pH of described plating solution is 1.0, and contains composition in table 1 in every 1L plating solution, prepare 1L plating solution and copper wire electroplating as follows:

[0038] Step 1. Preparation of plating solution:

[0039] a. Measure 100mL of methanesulfonic acid into deionized water and stir;

[0040] B, take by weighing the bismuth oxide of 0.5g, be dissolved in the solution that step a is prepared, stir;

[0041] c, take by weighing the hydroquinone of 5g, be dissolved in the solution that step b is prepared, stir;

[0042] d, take by weighing 1g of polyoxyethylene (EO15) lauryl alcohol, be dissolved in the solution that step c is prepared, stir;

[0043] E, take by weighing the stannous sulfate of 30g, be dissolved in the solution that step d is joined, stir;

[0044] f. Weigh 2g of gelatin, dissolve it in hot water at 50°C, make it fully dis...

Embodiment 2

[0049] Table 2

[0050]

[0051] A kind of electroplating method of electroplating pure tin on copper wire, the pH of described plating solution is 1.0, and contains composition in table 2 in every 1L plating solution, prepare 1L plating solution and copper wire electroplating as follows:

[0052] Step 1. Preparation of plating solution:

[0053] a. Measure 110mL of methanesulfonic acid into deionized water and stir;

[0054] b, take 1g of bismuth oxide, dissolve in the solution prepared in step a, and stir;

[0055] c, take the hydroquinone of 6g, be dissolved in the solution that step b is prepared, stir;

[0056] d, weigh 0.5g of OP emulsifier, dissolve in the solution prepared in step c, and stir;

[0057] E, take by weighing the stannous sulfate of 35g, be dissolved in the solution that step d is joined, stir;

[0058] f. Weigh 3g of gelatin, dissolve it in hot water at 60°C, make it fully dissolved, then add it to the solution prepared in step e, stir, and finally...

Embodiment 3

[0062] table 3

[0063]

[0064] A kind of electroplating method of electroplating pure tin on copper wire, the pH of described plating solution is 1.0, and contains composition in table 3 in every 1L plating solution, prepare 1L plating solution and copper wire electroplating as follows:

[0065] Step 1. Preparation of plating solution:

[0066] a. Measure 120mL of methanesulfonic acid into deionized water and stir;

[0067] B, take by weighing the bismuth oxide of 1.8g, be dissolved in the solution that step a is prepared, stir;

[0068] c, take by weighing the hydroquinone of 8g, be dissolved in the solution that step b is prepared, stir;

[0069] d. Weigh 1g polyoxyethylene (EO15) lauryl alcohol and 1g OP emulsifier, dissolve in the solution prepared in step c, and stir;

[0070] E, take by weighing the stannous sulfate of 40g, be dissolved in the solution that step d is joined, stir;

[0071] f. Weigh 4g of gelatin, dissolve it in hot water at 58°C, make it fully dis...

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Abstract

The invention discloses a plating solution and an electroplating method for electroplating pure tin on copper wires, wherein the pH value of the plating solution is 1.0, and it contains stannous sulfate, an additive bismuth oxide, an additive nonionic surfactant, and a stabilizer pair Hydroquinone, brightener gelatin, solvent methanesulfonic acid; electroplating method: copper wire is washed with alkali to remove oil, hot water, pickling, cold water, and dried to make the cathode of the electroplating, and the titanium plate is used as the anode of the electroplating; the current density is 2.5 ‑4A / dm2, the electroplating time is 10min, and the temperature is room temperature. The composition of the plating solution of the invention is simple and easy to control, the waste liquid is environmentally friendly and easy to handle, the electroplating process is easy to control, and the plating layer is uniform and smooth and has good binding force.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a plating solution and an electroplating method for electroplating pure tin on copper wires. Background technique [0002] In recent years, the rapid development of the electronics industry has made people have higher and higher requirements for solderable coatings. Due to the good solderability of tin and the limited use of lead, a lot of research has been done on tin plating and tin alloy plating. [0003] At present, there are many tinning processes, which are divided into two parts: alkaline tinning and acidic tinning. Alkaline tin plating has many disadvantages, such as: slow deposition rate, low cathodic current efficiency, high alkali concentration will lead to serious hydrogen evolution reaction, and it will also affect tin anode, etc. Acid system tin plating generally includes sulfate system tin plating, fluoroboric acid system tin plating, and methanesulfonic a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/32C25D7/06
CPCC25D3/32C25D7/0607
Inventor 倪自飞华欣何广仁王威
Owner JIANGSU XINGDA STEEL TYPE CORD
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